JP5202822B2 - 硬化性オルガノポリシロキサン組成物および半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物および半導体装置 Download PDF

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Publication number
JP5202822B2
JP5202822B2 JP2006173777A JP2006173777A JP5202822B2 JP 5202822 B2 JP5202822 B2 JP 5202822B2 JP 2006173777 A JP2006173777 A JP 2006173777A JP 2006173777 A JP2006173777 A JP 2006173777A JP 5202822 B2 JP5202822 B2 JP 5202822B2
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sio
curable organopolysiloxane
organopolysiloxane composition
component
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JP2006173777A
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Japanese (ja)
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JP2008001828A5 (https=
JP2008001828A (ja
Inventor
好次 森田
匡慶 寺田
博司 江南
誠 吉武
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2006173777A priority Critical patent/JP5202822B2/ja
Priority to TW096119562A priority patent/TWI425053B/zh
Priority to MYPI20085206A priority patent/MY147862A/en
Priority to EP07767457A priority patent/EP2032653B1/en
Priority to CN2007800215923A priority patent/CN101466795B/zh
Priority to PCT/JP2007/062649 priority patent/WO2007148812A1/en
Priority to KR1020087031182A priority patent/KR101436800B1/ko
Priority to US12/306,049 priority patent/US8080614B2/en
Priority to DE602007003724T priority patent/DE602007003724D1/de
Priority to AT07767457T priority patent/ATE451426T1/de
Publication of JP2008001828A publication Critical patent/JP2008001828A/ja
Publication of JP2008001828A5 publication Critical patent/JP2008001828A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
JP2006173777A 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置 Active JP5202822B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2006173777A JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置
TW096119562A TWI425053B (zh) 2006-06-23 2007-05-31 硬化性有機聚矽氧烷組合物及半導體裝置
AT07767457T ATE451426T1 (de) 2006-06-23 2007-06-18 Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement
CN2007800215923A CN101466795B (zh) 2006-06-23 2007-06-18 可固化的有机基聚硅氧烷组合物和半导体器件
PCT/JP2007/062649 WO2007148812A1 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
KR1020087031182A KR101436800B1 (ko) 2006-06-23 2007-06-18 경화성 오가노폴리실록산 조성물 및 반도체 디바이스
MYPI20085206A MY147862A (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
DE602007003724T DE602007003724D1 (de) 2006-06-23 2007-06-18 Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement
EP07767457A EP2032653B1 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device
US12/306,049 US8080614B2 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006173777A JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置

Publications (3)

Publication Number Publication Date
JP2008001828A JP2008001828A (ja) 2008-01-10
JP2008001828A5 JP2008001828A5 (https=) 2009-07-30
JP5202822B2 true JP5202822B2 (ja) 2013-06-05

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JP2006173777A Active JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置

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Country Link
US (1) US8080614B2 (https=)
EP (1) EP2032653B1 (https=)
JP (1) JP5202822B2 (https=)
KR (1) KR101436800B1 (https=)
CN (1) CN101466795B (https=)
AT (1) ATE451426T1 (https=)
DE (1) DE602007003724D1 (https=)
MY (1) MY147862A (https=)
TW (1) TWI425053B (https=)
WO (1) WO2007148812A1 (https=)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4680274B2 (ja) * 2008-03-10 2011-05-11 信越化学工業株式会社 高硬度シリコーンゴムを与える組成物およびそれを封止材として用いた半導体装置
JP5136963B2 (ja) * 2008-03-24 2013-02-06 信越化学工業株式会社 硬化性シリコーンゴム組成物及び半導体装置
JP5000566B2 (ja) * 2008-03-27 2012-08-15 信越化学工業株式会社 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
JP5628474B2 (ja) 2008-03-31 2014-11-19 東レ・ダウコーニング株式会社 オルガノポリシロキサン、その製造方法、硬化性シリコーン組成物、およびその硬化物
JP5972511B2 (ja) 2008-03-31 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物およびその硬化物
JP5667740B2 (ja) 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5972512B2 (ja) 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010001358A (ja) * 2008-06-19 2010-01-07 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン組成物、その硬化物及び該組成物からなる光学素子封止材
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
US8946353B2 (en) 2008-10-31 2015-02-03 Dow Corning Toray Co. Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
US8697458B2 (en) * 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
EP2422369A4 (en) * 2009-04-22 2014-12-24 Shat R Shield Inc LED EMITTING LIGHT, COATED WITH SILICONE
TWI435895B (zh) 2009-10-28 2014-05-01 Indial Technology Co Ltd Package material composition
DE202011110490U1 (de) * 2010-01-25 2014-04-15 Lg Chem, Ltd. Silikonharz
EP2530122B1 (en) * 2010-01-25 2015-11-11 LG Chem, Ltd. Curable composition
KR101152869B1 (ko) * 2010-01-25 2012-06-12 주식회사 엘지화학 경화성 조성물
EP2530731B1 (en) * 2010-01-25 2016-03-30 LG Chem, Ltd. Sheet for photovoltaic cells
WO2011090366A2 (ko) * 2010-01-25 2011-07-28 (주)Lg화학 광전지 모듈
CN102725866A (zh) * 2010-01-25 2012-10-10 Lg化学株式会社 用于光伏电池的薄板
US9410018B2 (en) 2010-01-25 2016-08-09 Lg Chem, Ltd. Curable composition
KR101074506B1 (ko) 2010-01-25 2011-10-17 주식회사 엘지화학 광전지 모듈
US9379296B2 (en) 2010-01-25 2016-06-28 Lg Chem, Ltd. Silicone resin
JP5377401B2 (ja) * 2010-04-20 2013-12-25 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物
KR101277722B1 (ko) * 2010-07-14 2013-06-24 제일모직주식회사 하이브리드 실록산 중합체, 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
KR20120078606A (ko) * 2010-12-31 2012-07-10 제일모직주식회사 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP5522111B2 (ja) 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
EP2706095B1 (en) * 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
EP2707417A4 (en) 2011-05-11 2015-01-07 Henkel China Co Ltd SILICONE RESIN WITH IMPROVED BARRIER PROPERTIES
KR20140030208A (ko) * 2011-05-16 2014-03-11 샤트-아알-쉬일드 인코포레이팃드 전자 광원을 갖는 인쇄 회로 기판에 광학 렌즈를 부착시키기 위한 방법
JP5992666B2 (ja) 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
JP5893874B2 (ja) * 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN104114645B (zh) * 2011-11-25 2016-08-17 Lg化学株式会社 可固化组合物
WO2013077700A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
WO2013077701A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 오가노폴리실록산의 제조 방법
CN103987786B (zh) * 2011-11-25 2018-06-08 Lg化学株式会社 可固化组合物
WO2013077699A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
TWI498356B (zh) * 2011-11-25 2015-09-01 Ｌｇ化學股份有限公司 有機聚矽氧烷
JP5652387B2 (ja) * 2011-12-22 2015-01-14 信越化学工業株式会社 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置
JP6435260B2 (ja) 2012-05-14 2018-12-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 高屈折率材料
GB201212782D0 (en) * 2012-07-18 2012-08-29 Dow Corning Organosiloxane compositions
JP5819787B2 (ja) * 2012-07-19 2015-11-24 信越化学工業株式会社 硬化性シリコーン樹脂組成物
KR101560046B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
JP2014031394A (ja) * 2012-08-01 2014-02-20 Shin Etsu Chem Co Ltd 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
JP5939723B2 (ja) * 2012-08-02 2016-06-22 ヘンケル・チャイナ・カンパニー・リミテッドＨｅｎｋｅｌ Ｃｈｉｎａ Ｃｏ． Ｌｔｄ． ポリカルボシラン、およびポリカルボシランを含んでなるｌｅｄ向け封入剤用硬化性組成物
CN104662098A (zh) 2012-08-02 2015-05-27 汉高股份有限公司 用于led封装剂的包含聚碳硅烷和含氢聚硅氧烷的可固化组合物
JP6059472B2 (ja) * 2012-09-07 2017-01-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
WO2014062843A1 (en) * 2012-10-16 2014-04-24 Brewer Science Inc. Silicone polymers with high refractive indices and extended pot life
JP5819866B2 (ja) * 2013-01-10 2015-11-24 信越化学工業株式会社 付加硬化型シリコーン組成物、光学素子封止材および光学素子
CN105102540B (zh) * 2013-04-04 2017-09-05 株式会社Lg化学 可固化组合物
EP3039079B1 (en) * 2013-08-29 2022-05-18 Ddp Specialty Electronic Materials Us 9, Llc. Curable silicone composition, cured product thereof, and optical semiconductor device
TWI653295B (zh) * 2014-02-04 2019-03-11 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
TWI624510B (zh) 2014-02-04 2018-05-21 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
KR101714715B1 (ko) 2014-03-11 2017-03-09 제일모직 주식회사 봉지재 조성물, 봉지재, 및 전자 소자
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
KR102136686B1 (ko) * 2018-09-21 2020-08-13 주식회사 케이씨씨 실리콘 조성물
CN110272627B (zh) * 2019-07-24 2021-11-23 杭州之江新材料有限公司 一种高折光指数的有机硅凝胶及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3574226B2 (ja) 1994-10-28 2004-10-06 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物およびその硬化物
CN1086713C (zh) * 1996-06-28 2002-06-26 罗纳·布朗克化学公司 可交联成粘性凝胶的硅氧烷组合物
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3344286B2 (ja) 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
US6432137B1 (en) 1999-09-08 2002-08-13 Medennium, Inc. High refractive index silicone for use in intraocular lenses
JP2001261963A (ja) * 2000-03-17 2001-09-26 Dow Corning Toray Silicone Co Ltd シリコーンゴム組成物
JP2003128992A (ja) 2001-10-18 2003-05-08 Matsushita Electric Ind Co Ltd 親水性塗料
JP4040858B2 (ja) * 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
DE10204893A1 (de) * 2002-02-06 2003-08-14 Ge Bayer Silicones Gmbh & Co Selbsthaftende additionsvernetzende Silikonkautschukmischungen, ein Verfahren zu deren Herstellung, Verfahren zur Herstellung von Verbund-Formteilen und deren Verwendung
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤

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Publication number Publication date
ATE451426T1 (de) 2009-12-15
KR101436800B1 (ko) 2014-09-02
DE602007003724D1 (de) 2010-01-21
US8080614B2 (en) 2011-12-20
EP2032653A1 (en) 2009-03-11
TW200808908A (en) 2008-02-16
WO2007148812A1 (en) 2007-12-27
CN101466795A (zh) 2009-06-24
TWI425053B (zh) 2014-02-01
US20090179180A1 (en) 2009-07-16
MY147862A (en) 2013-01-31
JP2008001828A (ja) 2008-01-10
KR20090028720A (ko) 2009-03-19
EP2032653B1 (en) 2009-12-09
CN101466795B (zh) 2011-08-17

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