KR101436800B1 - 경화성 오가노폴리실록산 조성물 및 반도체 디바이스 - Google Patents

경화성 오가노폴리실록산 조성물 및 반도체 디바이스 Download PDF

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KR101436800B1
KR101436800B1 KR1020087031182A KR20087031182A KR101436800B1 KR 101436800 B1 KR101436800 B1 KR 101436800B1 KR 1020087031182 A KR1020087031182 A KR 1020087031182A KR 20087031182 A KR20087031182 A KR 20087031182A KR 101436800 B1 KR101436800 B1 KR 101436800B1
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curable organopolysiloxane
organopolysiloxane composition
silicon
cured product
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KR20090028720A (ko
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요시쓰구 모리타
마사요시 데라다
히로지 에나미
마코토 요시타케
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다우 코닝 도레이 캄파니 리미티드
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Assigned to 다우 도레이 캄파니 리미티드 reassignment 다우 도레이 캄파니 리미티드 권리의 전부이전등록 Assignors: 다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
KR1020087031182A 2006-06-23 2007-06-18 경화성 오가노폴리실록산 조성물 및 반도체 디바이스 Active KR101436800B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2006-173777 2006-06-23
JP2006173777A JP5202822B2 (ja) 2006-06-23 2006-06-23 硬化性オルガノポリシロキサン組成物および半導体装置
PCT/JP2007/062649 WO2007148812A1 (en) 2006-06-23 2007-06-18 Curable organopolysiloxane composition and semiconductor device

Publications (2)

Publication Number Publication Date
KR20090028720A KR20090028720A (ko) 2009-03-19
KR101436800B1 true KR101436800B1 (ko) 2014-09-02

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KR1020087031182A Active KR101436800B1 (ko) 2006-06-23 2007-06-18 경화성 오가노폴리실록산 조성물 및 반도체 디바이스

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Country Link
US (1) US8080614B2 (https=)
EP (1) EP2032653B1 (https=)
JP (1) JP5202822B2 (https=)
KR (1) KR101436800B1 (https=)
CN (1) CN101466795B (https=)
AT (1) ATE451426T1 (https=)
DE (1) DE602007003724D1 (https=)
MY (1) MY147862A (https=)
TW (1) TWI425053B (https=)
WO (1) WO2007148812A1 (https=)

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KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
KR102136686B1 (ko) * 2018-09-21 2020-08-13 주식회사 케이씨씨 실리콘 조성물
CN110272627B (zh) * 2019-07-24 2021-11-23 杭州之江新材料有限公司 一种高折光指数的有机硅凝胶及其制备方法

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Also Published As

Publication number Publication date
ATE451426T1 (de) 2009-12-15
DE602007003724D1 (de) 2010-01-21
JP5202822B2 (ja) 2013-06-05
US8080614B2 (en) 2011-12-20
EP2032653A1 (en) 2009-03-11
TW200808908A (en) 2008-02-16
WO2007148812A1 (en) 2007-12-27
CN101466795A (zh) 2009-06-24
TWI425053B (zh) 2014-02-01
US20090179180A1 (en) 2009-07-16
MY147862A (en) 2013-01-31
JP2008001828A (ja) 2008-01-10
KR20090028720A (ko) 2009-03-19
EP2032653B1 (en) 2009-12-09
CN101466795B (zh) 2011-08-17

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