JP5148088B2 - 硬化性オルガノポリシロキサン組成物および半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物および半導体装置 Download PDF

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Publication number
JP5148088B2
JP5148088B2 JP2006229551A JP2006229551A JP5148088B2 JP 5148088 B2 JP5148088 B2 JP 5148088B2 JP 2006229551 A JP2006229551 A JP 2006229551A JP 2006229551 A JP2006229551 A JP 2006229551A JP 5148088 B2 JP5148088 B2 JP 5148088B2
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group
component
sio
curable organopolysiloxane
molecule
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Japanese (ja)
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JP2008050494A (ja
JP2008050494A5 (https=
Inventor
智子 加藤
好次 森田
真一 山本
俊夫 猿山
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2006229551A priority Critical patent/JP5148088B2/ja
Priority to TW096125678A priority patent/TWI398488B/zh
Priority to EP07791537A priority patent/EP2061840B1/en
Priority to AT07791537T priority patent/ATE454430T1/de
Priority to KR1020097003829A priority patent/KR101408711B1/ko
Priority to MYPI20090723A priority patent/MY145422A/en
Priority to US12/438,658 priority patent/US8217388B2/en
Priority to CN2007800316498A priority patent/CN101506309B/zh
Priority to DE602007004235T priority patent/DE602007004235D1/de
Priority to PCT/JP2007/064843 priority patent/WO2008023537A1/en
Publication of JP2008050494A publication Critical patent/JP2008050494A/ja
Publication of JP2008050494A5 publication Critical patent/JP2008050494A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
JP2006229551A 2006-08-25 2006-08-25 硬化性オルガノポリシロキサン組成物および半導体装置 Active JP5148088B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2006229551A JP5148088B2 (ja) 2006-08-25 2006-08-25 硬化性オルガノポリシロキサン組成物および半導体装置
TW096125678A TWI398488B (zh) 2006-08-25 2007-07-13 可固化之有機聚矽氧烷組合物及半導體裝置
PCT/JP2007/064843 WO2008023537A1 (en) 2006-08-25 2007-07-24 Curable orgnopolysiloxane composition and semiconductor device
KR1020097003829A KR101408711B1 (ko) 2006-08-25 2007-07-24 경화성 오가노폴리실록산 조성물 및 반도체 장치
MYPI20090723A MY145422A (en) 2006-08-25 2007-07-24 Curable organopolysiloxane composition and semiconductor device
US12/438,658 US8217388B2 (en) 2006-08-25 2007-07-24 Curable organopolysiloxane composition and semiconductor device
EP07791537A EP2061840B1 (en) 2006-08-25 2007-07-24 Curable orgnopolysiloxane composition and semiconductor device
DE602007004235T DE602007004235D1 (de) 2006-08-25 2007-07-24 Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
AT07791537T ATE454430T1 (de) 2006-08-25 2007-07-24 Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
CN2007800316498A CN101506309B (zh) 2006-08-25 2007-07-24 可固化的有机基聚硅氧烷组合物和半导体器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006229551A JP5148088B2 (ja) 2006-08-25 2006-08-25 硬化性オルガノポリシロキサン組成物および半導体装置

Publications (3)

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JP2008050494A JP2008050494A (ja) 2008-03-06
JP2008050494A5 JP2008050494A5 (https=) 2009-10-01
JP5148088B2 true JP5148088B2 (ja) 2013-02-20

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JP2006229551A Active JP5148088B2 (ja) 2006-08-25 2006-08-25 硬化性オルガノポリシロキサン組成物および半導体装置

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US (1) US8217388B2 (https=)
EP (1) EP2061840B1 (https=)
JP (1) JP5148088B2 (https=)
KR (1) KR101408711B1 (https=)
CN (1) CN101506309B (https=)
AT (1) ATE454430T1 (https=)
DE (1) DE602007004235D1 (https=)
MY (1) MY145422A (https=)
TW (1) TWI398488B (https=)
WO (1) WO2008023537A1 (https=)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR101477609B1 (ko) 2010-09-22 2014-12-31 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체를 함유하는 고굴절률 조성물

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TWI398488B (zh) 2013-06-11
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JP2008050494A (ja) 2008-03-06
EP2061840B1 (en) 2010-01-06
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