KR101408711B1 - 경화성 오가노폴리실록산 조성물 및 반도체 장치 - Google Patents

경화성 오가노폴리실록산 조성물 및 반도체 장치 Download PDF

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KR101408711B1
KR101408711B1 KR1020097003829A KR20097003829A KR101408711B1 KR 101408711 B1 KR101408711 B1 KR 101408711B1 KR 1020097003829 A KR1020097003829 A KR 1020097003829A KR 20097003829 A KR20097003829 A KR 20097003829A KR 101408711 B1 KR101408711 B1 KR 101408711B1
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component
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silicon
curable organopolysiloxane
molecule
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KR20090054429A (ko
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도모코 가토
요시쓰구 모리타
신이치 야마모토
도시오 사루야마
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
KR1020097003829A 2006-08-25 2007-07-24 경화성 오가노폴리실록산 조성물 및 반도체 장치 Active KR101408711B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2006-229551 2006-08-25
JP2006229551A JP5148088B2 (ja) 2006-08-25 2006-08-25 硬化性オルガノポリシロキサン組成物および半導体装置
PCT/JP2007/064843 WO2008023537A1 (en) 2006-08-25 2007-07-24 Curable orgnopolysiloxane composition and semiconductor device

Publications (2)

Publication Number Publication Date
KR20090054429A KR20090054429A (ko) 2009-05-29
KR101408711B1 true KR101408711B1 (ko) 2014-06-17

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Country Link
US (1) US8217388B2 (https=)
EP (1) EP2061840B1 (https=)
JP (1) JP5148088B2 (https=)
KR (1) KR101408711B1 (https=)
CN (1) CN101506309B (https=)
AT (1) ATE454430T1 (https=)
DE (1) DE602007004235D1 (https=)
MY (1) MY145422A (https=)
TW (1) TWI398488B (https=)
WO (1) WO2008023537A1 (https=)

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WO2012157330A1 (ja) * 2011-05-17 2012-11-22 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
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US20040241927A1 (en) 2001-10-19 2004-12-02 Tomoko Kato Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device
WO2004037927A1 (en) 2002-10-28 2004-05-06 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition and a semiconductor device made with the use of this composition
JP2006063092A (ja) 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤

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KR20180118164A (ko) * 2016-03-07 2018-10-30 다우 코닝 도레이 캄파니 리미티드 광경화성 실리콘 조성물 및 이의 경화물
KR102372953B1 (ko) 2016-03-07 2022-03-14 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 광경화성 실리콘 조성물 및 이의 경화물

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CN101506309A (zh) 2009-08-12
ATE454430T1 (de) 2010-01-15
US8217388B2 (en) 2012-07-10
TWI398488B (zh) 2013-06-11
DE602007004235D1 (de) 2010-02-25
JP5148088B2 (ja) 2013-02-20
JP2008050494A (ja) 2008-03-06
EP2061840B1 (en) 2010-01-06
MY145422A (en) 2012-02-15
EP2061840A1 (en) 2009-05-27
WO2008023537A1 (en) 2008-02-28
TW200811244A (en) 2008-03-01
US20100301377A1 (en) 2010-12-02
CN101506309B (zh) 2012-03-21

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