JP4985898B2 - 有機電界発光デバイス用浸透バリヤー - Google Patents

有機電界発光デバイス用浸透バリヤー Download PDF

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Publication number
JP4985898B2
JP4985898B2 JP21568499A JP21568499A JP4985898B2 JP 4985898 B2 JP4985898 B2 JP 4985898B2 JP 21568499 A JP21568499 A JP 21568499A JP 21568499 A JP21568499 A JP 21568499A JP 4985898 B2 JP4985898 B2 JP 4985898B2
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Prior art keywords
layer
oxide
nitride
oxygen
inorganic layer
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Expired - Fee Related
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JP21568499A
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Japanese (ja)
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JP2000058258A (ja
JP2000058258A5 (https=
Inventor
ジェイムズ・アール・シーツ
マーク・アール・ハッセン
カレン・エル・シーワード
ダニエル・ビー・ロイツマン
ジョージ・アンドリュー・デイヴィッドソン・ブリッジ
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Innolux Corp
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Chimei Innolux Corp
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Publication of JP2000058258A5 publication Critical patent/JP2000058258A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
JP21568499A 1998-07-30 1999-07-29 有機電界発光デバイス用浸透バリヤー Expired - Fee Related JP4985898B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/126,689 US6146225A (en) 1998-07-30 1998-07-30 Transparent, flexible permeability barrier for organic electroluminescent devices
US126,689 1998-07-30

Publications (3)

Publication Number Publication Date
JP2000058258A JP2000058258A (ja) 2000-02-25
JP2000058258A5 JP2000058258A5 (https=) 2006-09-07
JP4985898B2 true JP4985898B2 (ja) 2012-07-25

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Family Applications (1)

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JP21568499A Expired - Fee Related JP4985898B2 (ja) 1998-07-30 1999-07-29 有機電界発光デバイス用浸透バリヤー

Country Status (4)

Country Link
US (1) US6146225A (https=)
EP (1) EP0977469B1 (https=)
JP (1) JP4985898B2 (https=)
DE (1) DE69911524T2 (https=)

Families Citing this family (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224948B1 (en) 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
US7126161B2 (en) 1998-10-13 2006-10-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having El layer and sealing material
CA2353506A1 (en) 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US6274887B1 (en) * 1998-11-02 2001-08-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
US7141821B1 (en) 1998-11-10 2006-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an impurity gradient in the impurity regions and method of manufacture
US7022556B1 (en) 1998-11-11 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Exposure device, exposure method and method of manufacturing semiconductor device
US6277679B1 (en) 1998-11-25 2001-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing thin film transistor
JP3912711B2 (ja) * 1998-11-27 2007-05-09 ローム株式会社 有機ｅｌ素子
US6228436B1 (en) * 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making light emitting polymer composite material
US6274204B1 (en) 1998-12-16 2001-08-14 Battelle Memorial Institute Method of making non-linear optical polymer
US6228434B1 (en) * 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
WO2000036665A1 (en) * 1998-12-16 2000-06-22 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6207238B1 (en) * 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition for high and/or low index of refraction polymers
US6217947B1 (en) 1998-12-16 2001-04-17 Battelle Memorial Institute Plasma enhanced polymer deposition onto fixtures
US6207239B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition of conjugated polymer
US7697052B1 (en) 1999-02-17 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Electronic view finder utilizing an organic electroluminescence display
US6358570B1 (en) 1999-03-31 2002-03-19 Battelle Memorial Institute Vacuum deposition and curing of oligomers and resins
US6506461B2 (en) 1999-03-31 2003-01-14 Battelle Memorial Institute Methods for making polyurethanes as thin films
US6680487B1 (en) 1999-05-14 2004-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor comprising a TFT provided on a substrate having an insulating surface and method of fabricating the same
US7288420B1 (en) 1999-06-04 2007-10-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing an electro-optical device
TWI232595B (en) 1999-06-04 2005-05-11 Semiconductor Energy Lab Electroluminescence display device and electronic device
US8853696B1 (en) 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
US6174613B1 (en) * 1999-07-29 2001-01-16 Agilent Technologies, Inc. Method and apparatus for fabricating polymer-based electroluminescent displays
US6660409B1 (en) * 1999-09-16 2003-12-09 Panasonic Communications Co., Ltd Electronic device and process for producing the same
TW516244B (en) * 1999-09-17 2003-01-01 Semiconductor Energy Lab EL display device and method for manufacturing the same
JP3942770B2 (ja) * 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 Ｅｌ表示装置及び電子装置
TW480722B (en) * 1999-10-12 2002-03-21 Semiconductor Energy Lab Manufacturing method of electro-optical device
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US6548912B1 (en) * 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US7112115B1 (en) 1999-11-09 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
US6646287B1 (en) 1999-11-19 2003-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with tapered gate and insulating film
US20010053559A1 (en) * 2000-01-25 2001-12-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating display device
US6492026B1 (en) * 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
US6465953B1 (en) * 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6605826B2 (en) 2000-08-18 2003-08-12 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and display device
US6924594B2 (en) 2000-10-03 2005-08-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP4618862B2 (ja) * 2000-10-30 2011-01-26 大日本印刷株式会社 バリア性積層構造体を用いて封止された封止ｅｌ素子
US7199527B2 (en) * 2000-11-21 2007-04-03 Alien Technology Corporation Display device and methods of manufacturing and control
US6537688B2 (en) 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
JP2002175881A (ja) * 2000-12-07 2002-06-21 Fuji Photo Film Co Ltd 発光素子
US6614057B2 (en) 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US7222981B2 (en) * 2001-02-15 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. EL display device and electronic device
US6576351B2 (en) 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) * 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6624568B2 (en) 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6664137B2 (en) 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
US20020155320A1 (en) * 2001-04-20 2002-10-24 Lg.Philips Lcd Co., Ltd. Organic electroluminescent device
KR100415615B1 (ko) 2001-06-13 2004-01-24 엘지전자 주식회사 게터 조성물 및 이를 이용한 전계방출표시소자
US6692326B2 (en) 2001-06-16 2004-02-17 Cld, Inc. Method of making organic electroluminescent display
TW588570B (en) 2001-06-18 2004-05-21 Semiconductor Energy Lab Light emitting device and method of fabricating the same
JP2003086356A (ja) * 2001-09-06 2003-03-20 Semiconductor Energy Lab Co Ltd 発光装置及び電子機器
US7211828B2 (en) * 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
TW548860B (en) * 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
TW546857B (en) * 2001-07-03 2003-08-11 Semiconductor Energy Lab Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
US7469558B2 (en) 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
TW564471B (en) 2001-07-16 2003-12-01 Semiconductor Energy Lab Semiconductor device and peeling off method and method of manufacturing semiconductor device
KR100413450B1 (ko) 2001-07-20 2003-12-31 엘지전자 주식회사 표시소자의 보호막 구조
EP1419286A1 (en) * 2001-08-20 2004-05-19 Nova-Plasma Inc. Coatings with low permeation of gases and vapors
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
TW558743B (en) * 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
JP4166455B2 (ja) * 2001-10-01 2008-10-15 株式会社半導体エネルギー研究所 偏光フィルム及び発光装置
US6888305B2 (en) * 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
US7404877B2 (en) 2001-11-09 2008-07-29 Springworks, Llc Low temperature zirconia based thermal barrier layer by PVD
US6730373B2 (en) 2001-11-21 2004-05-04 Optical Coating Laboratory, Inc. Glass panel with barrier coating and related methods
US6597111B2 (en) 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
US7050835B2 (en) * 2001-12-12 2006-05-23 Universal Display Corporation Intelligent multi-media display communication system
US7265807B2 (en) * 2001-12-13 2007-09-04 Koninklijke Philips Electronics N.V. Sealing structure for display devices
US6765351B2 (en) * 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
US7012363B2 (en) * 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
US7378356B2 (en) 2002-03-16 2008-05-27 Springworks, Llc Biased pulse DC reactive sputtering of oxide films
US6891330B2 (en) * 2002-03-29 2005-05-10 General Electric Company Mechanically flexible organic electroluminescent device with directional light emission
US6835950B2 (en) 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US6897474B2 (en) * 2002-04-12 2005-05-24 Universal Display Corporation Protected organic electronic devices and methods for making the same
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7268486B2 (en) 2002-04-15 2007-09-11 Schott Ag Hermetic encapsulation of organic, electro-optical elements
DE10222958B4 (de) * 2002-04-15 2007-08-16 Schott Ag Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element
KR100475849B1 (ko) * 2002-04-17 2005-03-10 한국전자통신연구원 습식 공정에 의하여 형성된 엔캡슐레이션 박막을 갖춘유기 전기발광 소자 및 그 제조 방법
KR100462469B1 (ko) * 2002-04-17 2004-12-17 한국전자통신연구원 접착식 유기-무기 복합막을 갖춘 엔캡슐레이션 박막과이를 포함하는 유기 전기발광 소자
AU2003219382A1 (en) * 2002-05-10 2003-11-11 Koninklijke Philips Electronics N.V. Electroluminescent panel
US7164155B2 (en) * 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7230271B2 (en) 2002-06-11 2007-06-12 Semiconductor Energy Laboratory Co., Ltd. Light emitting device comprising film having hygroscopic property and transparency and manufacturing method thereof
KR100819297B1 (ko) * 2002-06-26 2008-04-02 삼성전자주식회사 고반사율 미세 패턴의 제조방법
KR100484954B1 (ko) * 2002-07-08 2005-04-22 엘지.필립스 엘시디 주식회사 유기 전계발광 소자의 엔캡슐레이션 방법
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US7993773B2 (en) 2002-08-09 2011-08-09 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US6929864B2 (en) * 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US7215473B2 (en) * 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
US6933051B2 (en) 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
TWI274199B (en) 2002-08-27 2007-02-21 Symmorphix Inc Optically coupling into highly uniform waveguides
US6994933B1 (en) 2002-09-16 2006-02-07 Oak Ridge Micro-Energy, Inc. Long life thin film battery and method therefor
CN1176565C (zh) * 2002-11-25 2004-11-17 清华大学 一种有机电致发光器件的封装层及其制备方法和应用
US7710019B2 (en) 2002-12-11 2010-05-04 Samsung Electronics Co., Ltd. Organic light-emitting diode display comprising auxiliary electrodes
AU2003287820A1 (en) * 2002-12-20 2004-07-14 Ifire Technology Corp. Aluminum nitride passivated phosphors for electroluminescent displays
US7205662B2 (en) 2003-02-27 2007-04-17 Symmorphix, Inc. Dielectric barrier layer films
CN1778002A (zh) * 2003-03-04 2006-05-24 陶氏康宁公司 有机发光二极管
US20070184181A1 (en) * 2003-03-25 2007-08-09 Kazuo Wada Device and method for forming film for organic electro-luminescence element using inductive coupling CVD
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7344901B2 (en) * 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US7238628B2 (en) 2003-05-23 2007-07-03 Symmorphix, Inc. Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
KR20060024459A (ko) * 2003-07-07 2006-03-16 이화이어 테크놀로지 코포레이션 전계발광 디스플레이용 밀봉 및 밀봉방법
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
US8722160B2 (en) 2003-10-31 2014-05-13 Aeris Capital Sustainable Ip Ltd. Inorganic/organic hybrid nanolaminate barrier film
US7495644B2 (en) * 2003-12-26 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing display device
CN1328936C (zh) * 2004-01-05 2007-07-25 统宝光电股份有限公司 形成封装保护结构的方法
DE102004005370B4 (de) * 2004-02-03 2007-08-16 Samsung SDI Co., Ltd., Suwon Elektrisches Gerät mit einem Gehäuse und einem OLED-Anzeigeelement sowie Verfahren zu dessen Herstellung
US7202504B2 (en) 2004-05-20 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element and display device
DE102004026618A1 (de) * 2004-06-01 2005-12-29 Siemens Ag Röntgendetektor
US20050269943A1 (en) * 2004-06-04 2005-12-08 Michael Hack Protected organic electronic devices and methods for making the same
US7812522B2 (en) * 2004-07-22 2010-10-12 Ifire Ip Corporation Aluminum oxide and aluminum oxynitride layers for use with phosphors for electroluminescent displays
US20090032108A1 (en) * 2007-03-30 2009-02-05 Craig Leidholm Formation of photovoltaic absorber layers on foil substrates
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7342356B2 (en) * 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US20060093795A1 (en) * 2004-11-04 2006-05-04 Eastman Kodak Company Polymeric substrate having a desiccant layer
KR101127370B1 (ko) 2004-12-08 2012-03-29 인피니트 파워 솔루션스, 인크. ＬｉＣｏＯ２의 증착
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US20060153997A1 (en) * 2005-01-07 2006-07-13 Eastman Kodak Company Method of varying wavelengths of liquid crystals
WO2006075680A1 (ja) * 2005-01-14 2006-07-20 Matsushita Electric Industrial Co., Ltd. 気体吸着性物質、気体吸着合金および気体吸着材
KR100623731B1 (ko) * 2005-03-16 2006-09-14 삼성에스디아이 주식회사 유기전계발광표시장치 및 그의 제조 방법
US20070020451A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
ITMI20051502A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti uno o piu' depositi di materiale getter ed uno strato di materiale per il trasporto di h02o
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7838133B2 (en) 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US8193705B2 (en) * 2005-11-02 2012-06-05 Ifire Ip Corporation Laminated conformal seal for electroluminescent displays
US7597603B2 (en) * 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
JP4539547B2 (ja) * 2005-12-08 2010-09-08 セイコーエプソン株式会社 発光装置、発光装置の製造方法、及び電子機器
US20070131944A1 (en) * 2005-12-08 2007-06-14 Au Optronics Corporation Dual organic electroluminescent display and method of making same
US8044571B2 (en) * 2005-12-14 2011-10-25 General Electric Company Electrode stacks for electroactive devices and methods of fabricating the same
US8158450B1 (en) * 2006-05-05 2012-04-17 Nanosolar, Inc. Barrier films and high throughput manufacturing processes for photovoltaic devices
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US20080048178A1 (en) 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
CN101523571A (zh) 2006-09-29 2009-09-02 无穷动力解决方案股份有限公司 柔性基板上沉积的电池层的掩模和材料限制
DE102006048339A1 (de) * 2006-10-12 2008-04-24 Agfaphoto Gmbh Schutzfolie
US20080100202A1 (en) * 2006-11-01 2008-05-01 Cok Ronald S Process for forming oled conductive protective layer
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US8115326B2 (en) 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
KR101511799B1 (ko) 2006-12-28 2015-04-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 박막 금속 층 형성을 위한 핵형성 층
CN101573471A (zh) * 2006-12-29 2009-11-04 3M创新有限公司 固化含有金属烷氧化物的膜的方法
BRPI0720867A2 (pt) * 2006-12-29 2014-03-04 3M Innovative Properties Company. Método para fabricação de filmes inorgânicos ou híbridos inorgânicos/orgânicos
NL1033860C2 (nl) 2007-05-16 2008-11-18 Otb Group Bv Werkwijze voor het aanbrengen van een dunnefilm-encapsulatielaagsamenstel op een organisch device en een organisch device voorzien van een dunnefilm-encapsulatielaagsamenstel bij voorkeur aangebracht met een dergelijke werkwijze.
JP5208591B2 (ja) 2007-06-28 2013-06-12 株式会社半導体エネルギー研究所 発光装置、及び照明装置
CL2008002636A1 (es) 2007-09-07 2009-06-19 Avery Dennison Corp Un rótulo para cubrir identificación existente en sustratos como paquetes o envases de tal manera que el sustrato puede ser reutilizado, hoja de rótulos y método de fabricación.
WO2009053886A2 (en) * 2007-10-25 2009-04-30 Koninklijke Philips Electronics N.V. Organic electro-optical device, light source, display device and solar cell
US20090162667A1 (en) * 2007-12-20 2009-06-25 Lumination Llc Lighting device having backlighting, illumination and display applications
KR100832847B1 (ko) * 2007-12-21 2008-05-28 (주)누리셀 평탄화 유기 박막 및 컨포멀 유기 박막을 포함하는 다층봉지막
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
EP2225406A4 (en) 2007-12-21 2012-12-05 Infinite Power Solutions Inc PROCEDURE FOR SPUTTER TARGETS FOR ELECTROLYTE FILMS
JP2011508062A (ja) 2007-12-28 2011-03-10 スリーエム イノベイティブ プロパティズ カンパニー 可撓性封入フィルムシステム
JP5705549B2 (ja) 2008-01-11 2015-04-22 インフィニット パワー ソリューションズ， インコーポレイテッド 薄膜電池および他のデバイスのための薄膜カプセル化
JP5595377B2 (ja) 2008-04-02 2014-09-24 インフィニット パワー ソリューションズ， インコーポレイテッド エネルギー取入れに関連したエネルギー貯蔵デバイスに対する受動的過不足電圧の制御および保護
US8053984B2 (en) * 2008-05-26 2011-11-08 Lg Display Co., Ltd. Organic light emitting diode display
US8350451B2 (en) 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
KR20170005154A (ko) * 2008-06-30 2017-01-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 무기 또는 무기/유기 혼성 장벽 필름 제조 방법
WO2010019577A1 (en) 2008-08-11 2010-02-18 Infinite Power Solutions, Inc. Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
WO2010030743A1 (en) 2008-09-12 2010-03-18 Infinite Power Solutions, Inc. Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
EP2178133B1 (en) 2008-10-16 2019-09-18 Semiconductor Energy Laboratory Co., Ltd. Flexible Light-Emitting Device, Electronic Device, and Method for Manufacturing Flexible-Light Emitting Device
US20100095705A1 (en) 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US8219408B2 (en) * 2008-12-29 2012-07-10 Motorola Mobility, Inc. Audio signal decoder and method for producing a scaled reconstructed audio signal
CN102484079B (zh) * 2009-06-01 2015-09-23 住友化学株式会社 电子器件的封装工艺及结构
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
US8599572B2 (en) 2009-09-01 2013-12-03 Infinite Power Solutions, Inc. Printed circuit board with integrated thin film battery
US8580332B2 (en) * 2009-09-22 2013-11-12 Applied Materials, Inc. Thin-film battery methods for complexity reduction
US9472783B2 (en) * 2009-10-12 2016-10-18 General Electric Company Barrier coating with reduced process time
CN101707237B (zh) * 2009-10-30 2011-08-17 彩虹集团公司 一种柔性有机电致发光器件的封装结构及其封装方法
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
KR101155904B1 (ko) 2010-01-04 2012-06-20 삼성모바일디스플레이주식회사 유기 발광 표시 장치
US9000442B2 (en) * 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
TWI589042B (zh) * 2010-01-20 2017-06-21 半導體能源研究所股份有限公司 發光裝置，撓性發光裝置，電子裝置，照明設備，以及發光裝置和撓性發光裝置的製造方法
US20110300432A1 (en) 2010-06-07 2011-12-08 Snyder Shawn W Rechargeable, High-Density Electrochemical Device
TWI540939B (zh) 2010-09-14 2016-07-01 半導體能源研究所股份有限公司 固態發光元件，發光裝置和照明裝置
JP5827104B2 (ja) 2010-11-19 2015-12-02 株式会社半導体エネルギー研究所 照明装置
JP6118020B2 (ja) 2010-12-16 2017-04-19 株式会社半導体エネルギー研究所 発光装置
US8735874B2 (en) 2011-02-14 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, and method for manufacturing the same
KR101922603B1 (ko) 2011-03-04 2018-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 조명 장치, 기판, 기판의 제작 방법
KR101308480B1 (ko) * 2011-06-14 2013-09-16 엘지디스플레이 주식회사 플라스틱 유기 전계 발광 표시 장치 및 그 제조 방법
JP5504221B2 (ja) * 2011-08-05 2014-05-28 株式会社半導体エネルギー研究所 発光装置及びその作製方法
KR102079188B1 (ko) 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
KR101951223B1 (ko) 2012-10-26 2019-02-25 삼성디스플레이 주식회사 표시장치 및 그 제조방법
KR102309244B1 (ko) 2013-02-20 2021-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
EP2979859A4 (en) 2013-03-27 2016-11-02 Toppan Printing Co Ltd LAMINATE AND GAS TONER
KR102084715B1 (ko) 2013-06-18 2020-03-05 삼성디스플레이 주식회사 유기 발광 표시 장치
WO2015087192A1 (en) 2013-12-12 2015-06-18 Semiconductor Energy Laboratory Co., Ltd. Peeling method and peeling apparatus
CN104746036B (zh) * 2013-12-31 2017-11-07 中国科学院微电子研究所 一种薄膜封装方法
US9909022B2 (en) 2014-07-25 2018-03-06 Kateeva, Inc. Organic thin film ink compositions and methods
US9923176B2 (en) 2015-04-08 2018-03-20 Stmicroelectronics (Tours) Sas Power unit using flexible conductive member
CN105098090A (zh) * 2015-06-15 2015-11-25 深圳市华星光电技术有限公司 Oled器件的封装结构及其封装方法
EP3344712A4 (en) 2015-08-31 2019-05-15 Kateeva, Inc. DI AND MONO (METH) ACRYLATE BASED ORGANIC THIN LAYER INK COMPOSITIONS
JP6457371B2 (ja) * 2015-10-09 2019-01-23 富士フイルム株式会社 ガスバリアフィルム、有機電子装置、有機電界発光装置用基板、有機電界発光装置
TWI841527B (zh) 2017-04-21 2024-05-11 美商凱特伊夫公司 用於形成有機薄膜的組成物和技術
WO2018226078A1 (ko) * 2017-06-09 2018-12-13 주식회사 엘지화학 봉지 필름
CN107369776B (zh) * 2017-08-18 2020-05-08 京东方科技集团股份有限公司 Oled器件的封装结构和oled器件
CN109904345A (zh) * 2019-02-28 2019-06-18 武汉华星光电半导体显示技术有限公司 封装结构及其显示装置
US11588137B2 (en) 2019-06-05 2023-02-21 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device
US11659758B2 (en) 2019-07-05 2023-05-23 Semiconductor Energy Laboratory Co., Ltd. Display unit, display module, and electronic device
US11844236B2 (en) 2019-07-12 2023-12-12 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device
US11997766B2 (en) 2019-10-11 2024-05-28 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842893A (en) * 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
US4954371A (en) * 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
JPS6354295U (https=) * 1986-09-26 1988-04-12
JP2820469B2 (ja) * 1988-12-05 1998-11-05 三菱化学株式会社 防湿フィルム
DE68921707T2 (de) * 1988-12-05 1995-08-10 Mitsubishi Chem Corp Wasserdichter Film.
DE69128524T2 (de) * 1990-10-17 1998-04-16 Mitsubishi Chem Corp Hitze- und feuchtigkeitsbeständiger film
JP3020692B2 (ja) * 1990-10-17 2000-03-15 三菱化学株式会社 耐熱性防湿フィルム
US5260095A (en) * 1992-08-21 1993-11-09 Battelle Memorial Institute Vacuum deposition and curing of liquid monomers
JP3192249B2 (ja) * 1992-10-27 2001-07-23 鐘淵化学工業株式会社 ガス及び湿気バリアー膜及びその製造方法
JP3277965B2 (ja) * 1993-09-20 2002-04-22 東洋紡績株式会社 エレクトロルミネッセンスパネル
JP3577117B2 (ja) * 1994-10-07 2004-10-13 Ｔｄｋ株式会社 有機エレクトロルミネセンス素子の製法
JP3261945B2 (ja) * 1994-10-14 2002-03-04 東洋インキ製造株式会社 エレクトロルミネッセンス素子封止用積層体およびエレクトロルミネッセンス素子封止構造体
JPH0917572A (ja) * 1995-06-26 1997-01-17 Hewlett Packard Co <Hp> 薄膜エレクトロルミネセンス素子のシール形成方法及びエレクトロルミネセンス素子
JP3900543B2 (ja) * 1995-07-17 2007-04-04 東洋紡績株式会社 積層フィルム
JP3539597B2 (ja) * 1995-10-13 2004-07-07 ソニー株式会社 有機光学的素子及びその製造方法
US5811177A (en) * 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
JPH09151371A (ja) * 1995-11-30 1997-06-10 Toppan Printing Co Ltd 有機薄膜ｅｌ素子
JP2950240B2 (ja) * 1996-06-24 1999-09-20 関西日本電気株式会社 電界発光灯
JP3620186B2 (ja) * 1996-12-12 2005-02-16 凸版印刷株式会社 有機薄膜ｅｌ素子
JPH10275680A (ja) * 1997-03-31 1998-10-13 Toyota Central Res & Dev Lab Inc 有機ｅｌ素子
US6432516B1 (en) * 1997-04-17 2002-08-13 Kureha Kagaku Kogyo K.K. Moistureproofing film and electroluminescent device

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