JP4754304B2 - 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法 - Google Patents

基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法 Download PDF

Info

Publication number
JP4754304B2
JP4754304B2 JP2005255291A JP2005255291A JP4754304B2 JP 4754304 B2 JP4754304 B2 JP 4754304B2 JP 2005255291 A JP2005255291 A JP 2005255291A JP 2005255291 A JP2005255291 A JP 2005255291A JP 4754304 B2 JP4754304 B2 JP 4754304B2
Authority
JP
Japan
Prior art keywords
chamber
load lock
substrate
lock chamber
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005255291A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007073540A (ja
Inventor
陽一 中込
秀樹 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005255291A priority Critical patent/JP4754304B2/ja
Priority to KR1020060083861A priority patent/KR100830730B1/ko
Priority to TW095132467A priority patent/TWI417978B/zh
Priority to CNB2006101289245A priority patent/CN100458515C/zh
Priority to CN2008101451421A priority patent/CN101359588B/zh
Publication of JP2007073540A publication Critical patent/JP2007073540A/ja
Application granted granted Critical
Publication of JP4754304B2 publication Critical patent/JP4754304B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
JP2005255291A 2005-09-02 2005-09-02 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法 Expired - Fee Related JP4754304B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005255291A JP4754304B2 (ja) 2005-09-02 2005-09-02 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
KR1020060083861A KR100830730B1 (ko) 2005-09-02 2006-08-31 기판 처리 장치, 로드록실 유닛, 및 반송 장치의 반출 방법
TW095132467A TWI417978B (zh) 2005-09-02 2006-09-01 A substrate processing device, a loading lock chamber unit, and a transporting device
CNB2006101289245A CN100458515C (zh) 2005-09-02 2006-09-04 负载锁定室单元
CN2008101451421A CN101359588B (zh) 2005-09-02 2006-09-04 基板处理装置、负载锁定室单元和搬送装置的搬出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255291A JP4754304B2 (ja) 2005-09-02 2005-09-02 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法

Publications (2)

Publication Number Publication Date
JP2007073540A JP2007073540A (ja) 2007-03-22
JP4754304B2 true JP4754304B2 (ja) 2011-08-24

Family

ID=37817365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005255291A Expired - Fee Related JP4754304B2 (ja) 2005-09-02 2005-09-02 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法

Country Status (4)

Country Link
JP (1) JP4754304B2 (zh)
KR (1) KR100830730B1 (zh)
CN (2) CN100458515C (zh)
TW (1) TWI417978B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4903728B2 (ja) * 2008-01-11 2012-03-28 株式会社アルバック 搬送ロボットが装置された搬送室及びそのメンテナンス方法。
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
JP4993614B2 (ja) * 2008-02-29 2012-08-08 東京エレクトロン株式会社 搬送手段のティーチング方法、記憶媒体及び基板処理装置
JP5190303B2 (ja) * 2008-06-04 2013-04-24 東京エレクトロン株式会社 搬送装置及び処理装置
KR20100136711A (ko) * 2009-06-19 2010-12-29 주식회사 테라세미콘 대면적 기판 처리 시스템의 기판 이송 장치
EP2315236B1 (de) 2009-10-22 2014-05-14 VAT Holding AG Klappen-Transferventil
JP5425656B2 (ja) * 2010-02-15 2014-02-26 東京エレクトロン株式会社 基板処理装置及びロードロック装置
JPWO2011161888A1 (ja) * 2010-06-21 2013-08-19 株式会社アルバック 搬送装置及び搬送装置の製造方法
KR101136728B1 (ko) * 2010-10-18 2012-04-20 주성엔지니어링(주) 기판처리장치와 그의 분해 및 조립방법
KR101136729B1 (ko) * 2011-10-20 2012-04-19 주성엔지니어링(주) 기판처리장치의 개폐수단
JP2013126707A (ja) * 2011-12-19 2013-06-27 Yaskawa Electric Corp ロボットおよびロボットの設置方法
JP2013143413A (ja) * 2012-01-10 2013-07-22 Hitachi High-Technologies Corp 真空処理装置
CN105826227A (zh) * 2015-01-06 2016-08-03 沈阳新松机器人自动化股份有限公司 一种真空传输装置
JP6755169B2 (ja) * 2016-12-15 2020-09-16 東京エレクトロン株式会社 輸送用架台および輸送方法
CN108346605B (zh) * 2017-01-23 2019-08-06 孙建忠 基板贮送系统
EP3376530B1 (en) 2017-03-16 2019-08-14 ATOTECH Deutschland GmbH Automated substrate holder loading device
CN107082279B (zh) * 2017-05-22 2020-01-03 昆山国显光电有限公司 面板搬运装置
US20210327736A1 (en) * 2020-04-17 2021-10-21 Kla Corporation Mini-environment system for controlling oxygen and humidity levels within a sample transport device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247675A (ja) * 1997-03-04 1998-09-14 Toshiba Corp マルチチャンバシステム及びその搬送台車並びにゲートバルブさらにはその排気制御方法及びその装置
JPH11354603A (ja) * 1998-06-05 1999-12-24 Hitachi Ltd 搬送装置およびそれを用いた半導体製造装置
JP2001044267A (ja) * 1999-07-28 2001-02-16 Mitsui Eng & Shipbuild Co Ltd 真空容器ロードロック装置
JP2001160578A (ja) * 1999-11-30 2001-06-12 Anelva Corp 真空搬送処理装置
JP2002237510A (ja) * 2001-02-07 2002-08-23 Shin Meiwa Ind Co Ltd 真空搬送装置
JP2003037147A (ja) * 2001-07-25 2003-02-07 Tokyo Electron Ltd 基板搬送装置及び熱処理方法
JP2005093807A (ja) * 2003-09-18 2005-04-07 Hitachi Kokusai Electric Inc 半導体製造装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置
JPH07231028A (ja) * 1994-02-18 1995-08-29 Ebara Corp 搬送装置および搬送方法
JP3350278B2 (ja) * 1995-03-06 2002-11-25 大日本スクリーン製造株式会社 基板処理装置
JP3539814B2 (ja) * 1995-10-05 2004-07-07 大日本スクリーン製造株式会社 基板処理装置
TW318258B (zh) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
JP4302575B2 (ja) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 基板搬送装置および真空処理装置
JP4493955B2 (ja) * 2003-09-01 2010-06-30 東京エレクトロン株式会社 基板処理装置及び搬送ケース

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247675A (ja) * 1997-03-04 1998-09-14 Toshiba Corp マルチチャンバシステム及びその搬送台車並びにゲートバルブさらにはその排気制御方法及びその装置
JPH11354603A (ja) * 1998-06-05 1999-12-24 Hitachi Ltd 搬送装置およびそれを用いた半導体製造装置
JP2001044267A (ja) * 1999-07-28 2001-02-16 Mitsui Eng & Shipbuild Co Ltd 真空容器ロードロック装置
JP2001160578A (ja) * 1999-11-30 2001-06-12 Anelva Corp 真空搬送処理装置
JP2002237510A (ja) * 2001-02-07 2002-08-23 Shin Meiwa Ind Co Ltd 真空搬送装置
JP2003037147A (ja) * 2001-07-25 2003-02-07 Tokyo Electron Ltd 基板搬送装置及び熱処理方法
JP2005093807A (ja) * 2003-09-18 2005-04-07 Hitachi Kokusai Electric Inc 半導体製造装置

Also Published As

Publication number Publication date
KR20070026220A (ko) 2007-03-08
CN100458515C (zh) 2009-02-04
TWI417978B (zh) 2013-12-01
CN101359588A (zh) 2009-02-04
JP2007073540A (ja) 2007-03-22
KR100830730B1 (ko) 2008-05-20
CN1924660A (zh) 2007-03-07
TW200715450A (en) 2007-04-16
CN101359588B (zh) 2010-08-11

Similar Documents

Publication Publication Date Title
JP4754304B2 (ja) 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
JP5264050B2 (ja) 昇降機構および搬送装置
JP4642608B2 (ja) 基板処理装置および基板処理システム
JP5108557B2 (ja) ロードロック装置および基板冷却方法
JP5013987B2 (ja) 基板処理装置および基板搬送装置
JP5482500B2 (ja) 基板処理装置
JP5595202B2 (ja) 処理装置およびそのメンテナンス方法
TWI471896B (zh) Vacuum device, vacuum treatment system and vacuum chamber pressure control method
JP3350234B2 (ja) 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JP5926694B2 (ja) 基板中継装置，基板中継方法，基板処理装置
JP2001291758A (ja) 真空処理装置
JP2007216364A (ja) 真空用ロボット
CN101599449B (zh) 搬送装置以及处理装置
WO2020122125A1 (ja) ロードロックチャンバ
WO2014030432A1 (ja) 基板搬送装置および基板処理システム
CN111164745A (zh) 盒开启器
JP2006108348A (ja) 基板処理装置
JP2001291765A (ja) 基板収容ボックス及び処理システム
JP2003203961A (ja) 基板処理装置
JP2009267356A (ja) 基板処理装置及び基板処理装置内部の工程空間を開閉する方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080811

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100520

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100608

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100804

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100928

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110222

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110524

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110525

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140603

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4754304

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees