JP4302575B2 - 基板搬送装置および真空処理装置 - Google Patents
基板搬送装置および真空処理装置 Download PDFInfo
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- JP4302575B2 JP4302575B2 JP2004146815A JP2004146815A JP4302575B2 JP 4302575 B2 JP4302575 B2 JP 4302575B2 JP 2004146815 A JP2004146815 A JP 2004146815A JP 2004146815 A JP2004146815 A JP 2004146815A JP 4302575 B2 JP4302575 B2 JP 4302575B2
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- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Description
[第1の実施形態]
図1は本発明の第1の実施形態に係る基板搬送装置が適用される真空処理装置の外観を示す斜視図、図2は本発明の第1の実施形態に係る基板搬送装置が適用される真空処理装置における真空予備室および真空処理室を示す断面図、図3は本発明の第1の実施形態に係る基板搬送装置を示す斜視図、図4および図5はその断面図である。
次に、本発明の第2の実施形態について説明する。
図8は本発明の第2の実施形態に係る基板搬送装置を示す垂直断面図、図9は本発明の第2の実施形態に係る基板搬送装置の縮退状態を示す図、図10は発明の第2の実施形態に係る基板搬送装置の伸長状態を示す図である。なお、図9および図10はいずれも(a)は側面図、(b)は平面図である。
14……基体部
15……蓋体
16……支持軸
20……ロードロック室
30,40……ゲートバルブ
50……大気側搬送機構
60……真空ポンプ
70,170,300……基板搬送装置
70a……駆動モータ
70b……駆動ベルト
71……ベースプレート
71a,72a〜73a……スライドレール
71b……開口部
71c,72c〜73c……プーリ
71d,72d〜73d……ベルト
71e……固定部材
72,73,74……スライドプレート
72b〜73b……開口部
72e〜73e,72f〜73f……固定部材
74a……スライドピック部
74b……スライドベアリング部
100……真空処理装置
171,271,271′……ベース部
172,272,272′……スライドアーム
173,273,273′……スライドピック
174,273,274′……モータ
180,280……駆動伝達機構
181……スライドアーム駆動部
182……スライドピック駆動部
183……駆動プーリ
184……駆動ベルト
186……軸
187……プーリ(第1プーリ)
190……第1ベルト
191……第1係止部材
192……プーリ(第2プーリ)
195……第2ベルト
196……第2係止部材
270……下段搬送機構部
270′……上段搬送機構部
280′……第1駆動伝達機構
290……第2駆動伝達機構
G……基板
Claims (3)
- 基板が載置される支持台と、前記支持台の下部に配置されたスライド可能に積層してなる複数の板状アームと、前記板状アームにそれぞれ設けられ当該板状アームの上側に位置する前記支持台または前記板状アームをスライドさせるアーム駆動機構とを具備し、前記支持台および前記板状アームを縮退した状態と伸長した状態との間で変化させることにより、第1位置と第2位置との間で前記基板の搬送動作が行われ、前記各板状アームは、その中に積層方向において隣同士が互いに重なり合わない位置に貫通して前記アーム駆動機構が収容される開口部を有することを特徴とする基板搬送装置。
- 前記アーム駆動機構は、個々の前記板状アームの前記開口部に配置された一対のプーリと、前記スライド方向に平行に前記プーリに張架されたベルトと、前記ベルトの上部スパンを上側の前記板状アームまたは前記支持台に係止する第1係止部材と、上側の前記板状アームに設けられた前記ベルトの下部スパンを下側の板状アームに固定する第2係止部材とを備えたことを特徴とする請求項1に記載の基板搬送装置。
- 基板に対し、真空中で所定の処理を行う真空処理室と、
前記真空処理室に前記基板を搬入出する基板搬送装置と、を有し、
前記基板搬送装置が、請求項1または請求項2に記載の基板搬送装置であることを特徴とする真空処理装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004146815A JP4302575B2 (ja) | 2003-05-30 | 2004-05-17 | 基板搬送装置および真空処理装置 |
TW096117154A TW200737395A (en) | 2003-05-30 | 2004-05-26 | Lid Body Opening/Closing Mechanism of Vacuum Processing Chamber and Method for Opening/Closing Lid Body |
TW093114993A TW200428566A (en) | 2003-05-30 | 2004-05-26 | Substrate transportation device, method and vacuum processing apparatus |
CNB200410038397XA CN1326227C (zh) | 2003-05-30 | 2004-05-27 | 基板运送装置和基板运送方法以及真空处理装置 |
CNB2006101645729A CN100514550C (zh) | 2003-05-30 | 2004-05-27 | 真空处理室的盖体开闭机构以及盖体开闭方法 |
KR1020040038427A KR100794807B1 (ko) | 2003-05-30 | 2004-05-28 | 기판 반송 장치 및 기판 반송 방법 및 진공 처리 장치 |
KR1020060015256A KR100654789B1 (ko) | 2003-05-30 | 2006-02-16 | 진공 처리실의 덮개 개폐 기구 및 덮개 개폐 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003154521 | 2003-05-30 | ||
JP2004146815A JP4302575B2 (ja) | 2003-05-30 | 2004-05-17 | 基板搬送装置および真空処理装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006000172A Division JP4302693B2 (ja) | 2003-05-30 | 2006-01-04 | 真空処理室の蓋体開閉機構および蓋体開閉方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005019967A JP2005019967A (ja) | 2005-01-20 |
JP4302575B2 true JP4302575B2 (ja) | 2009-07-29 |
Family
ID=34196595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004146815A Active JP4302575B2 (ja) | 2003-05-30 | 2004-05-17 | 基板搬送装置および真空処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4302575B2 (ja) |
KR (2) | KR100794807B1 (ja) |
CN (2) | CN1326227C (ja) |
TW (2) | TW200428566A (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613265B1 (ko) * | 2004-09-06 | 2006-08-21 | (주)아이씨디 | 진공처리 시스템 및 이를 이용한 대상물 이송방법 |
JP4716362B2 (ja) * | 2005-06-07 | 2011-07-06 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
JP4754304B2 (ja) * | 2005-09-02 | 2011-08-24 | 東京エレクトロン株式会社 | 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法 |
TWI283005B (en) | 2005-12-28 | 2007-06-21 | Au Optronics Corp | Low-pressure process apparatus |
JP4903027B2 (ja) * | 2006-01-06 | 2012-03-21 | 東京エレクトロン株式会社 | 基板搬送装置および基板支持体 |
JP2007191278A (ja) * | 2006-01-20 | 2007-08-02 | Tokyo Electron Ltd | 基板搬送装置、基板搬送方法及び記憶媒体 |
JP4967717B2 (ja) * | 2007-03-02 | 2012-07-04 | 中西金属工業株式会社 | スライドフォーク装置 |
WO2008116222A2 (en) * | 2007-03-22 | 2008-09-25 | Crossing Automation, Inc. | A modular cluster tool |
JP5190303B2 (ja) * | 2008-06-04 | 2013-04-24 | 東京エレクトロン株式会社 | 搬送装置及び処理装置 |
CN101417747B (zh) * | 2008-12-11 | 2011-11-23 | 友达光电股份有限公司 | 传送台机构 |
KR101175417B1 (ko) * | 2009-11-27 | 2012-08-20 | 현대제철 주식회사 | 대차 이동 피트의 추락 방지 방치 |
CN101831621B (zh) * | 2010-04-08 | 2012-10-17 | 湖南金博复合材料科技有限公司 | 化学气相增密炉炉体 |
JP5560909B2 (ja) * | 2010-05-31 | 2014-07-30 | 東京エレクトロン株式会社 | 蓋体保持治具 |
DE102010022625A1 (de) * | 2010-06-04 | 2011-12-08 | Festo Ag & Co. Kg | Handhabungssystem zur Handhabung von Gegenständen |
JP5482500B2 (ja) * | 2010-06-21 | 2014-05-07 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5585238B2 (ja) * | 2010-06-24 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5595202B2 (ja) * | 2010-09-28 | 2014-09-24 | 東京エレクトロン株式会社 | 処理装置およびそのメンテナンス方法 |
CN103237634B (zh) | 2010-10-08 | 2016-12-14 | 布鲁克斯自动化公司 | 同轴驱动的真空机器人 |
TWI402096B (zh) * | 2011-01-20 | 2013-07-21 | China Steel Corp | Vacuum filter of the folding type movable cover device |
KR101216717B1 (ko) | 2011-02-25 | 2012-12-31 | 주식회사 영우디에스피 | 이송장치 |
CN103010725B (zh) * | 2011-09-27 | 2015-04-15 | 鸿富锦精密工业(深圳)有限公司 | 移载机构 |
KR101460578B1 (ko) | 2013-05-31 | 2014-11-13 | 주식회사 아스타 | 진공시스템의 시편이송구조 |
CN104338883B (zh) * | 2013-07-26 | 2016-05-04 | 秦皇岛戴卡兴龙轮毂有限公司 | 车轮旋转锻造压力机装卸模具小车 |
KR101585869B1 (ko) * | 2014-02-24 | 2016-01-15 | 주식회사 아스타 | 진공시스템의 시편이송장치 |
DE102014209684B4 (de) * | 2014-05-21 | 2023-06-29 | Siemens Healthcare Gmbh | Medizinisches Untersuchungs- und/oder Behandlungsgerät |
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JP6523838B2 (ja) * | 2015-07-15 | 2019-06-05 | 東京エレクトロン株式会社 | プローブカード搬送装置、プローブカード搬送方法及びプローブ装置 |
CN108091601A (zh) * | 2016-11-23 | 2018-05-29 | 沈阳芯源微电子设备有限公司 | 一种半导体长距离晶圆传输装置 |
KR20180063423A (ko) * | 2016-12-01 | 2018-06-12 | 주식회사 탑 엔지니어링 | 기판 이송 장치 |
JP6869136B2 (ja) * | 2017-07-28 | 2021-05-12 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN108818598B (zh) * | 2018-08-30 | 2024-03-19 | 深圳市德业智能股份有限公司 | 一种送料装置 |
CN112027636A (zh) * | 2019-06-03 | 2020-12-04 | 顺丰科技有限公司 | 直线行程放大机构 |
TWI741338B (zh) * | 2019-08-02 | 2021-10-01 | 鴻勁精密股份有限公司 | 電子元件移載機構及其應用之作業分類設備 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960002534A (ko) * | 1994-06-07 | 1996-01-26 | 이노우에 아키라 | 감압·상압 처리장치 |
DE29521292U1 (de) * | 1995-06-01 | 1997-02-13 | Samsung Electronics Co Ltd | Geschwindigkeits-Erhöhungsvorrichtung für eine geradlinige Bewegung eines Orthogonalkoordinaten-Roboters |
JPH09272095A (ja) * | 1996-04-04 | 1997-10-21 | Nec Corp | 板状物搬送用ロボット |
JPH1116981A (ja) * | 1997-06-20 | 1999-01-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11121585A (ja) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | ウェハ搬送装置 |
JP2003100837A (ja) * | 2001-09-21 | 2003-04-04 | Toyota Industries Corp | 移載装置 |
-
2004
- 2004-05-17 JP JP2004146815A patent/JP4302575B2/ja active Active
- 2004-05-26 TW TW093114993A patent/TW200428566A/zh unknown
- 2004-05-26 TW TW096117154A patent/TW200737395A/zh unknown
- 2004-05-27 CN CNB200410038397XA patent/CN1326227C/zh active Active
- 2004-05-27 CN CNB2006101645729A patent/CN100514550C/zh active Active
- 2004-05-28 KR KR1020040038427A patent/KR100794807B1/ko active IP Right Grant
-
2006
- 2006-02-16 KR KR1020060015256A patent/KR100654789B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI349324B (ja) | 2011-09-21 |
TW200737395A (en) | 2007-10-01 |
KR20040103435A (ko) | 2004-12-08 |
CN1326227C (zh) | 2007-07-11 |
CN1971844A (zh) | 2007-05-30 |
CN100514550C (zh) | 2009-07-15 |
CN1574271A (zh) | 2005-02-02 |
KR100654789B1 (ko) | 2006-12-08 |
TW200428566A (en) | 2004-12-16 |
KR20060025214A (ko) | 2006-03-20 |
JP2005019967A (ja) | 2005-01-20 |
TWI349325B (ja) | 2011-09-21 |
KR100794807B1 (ko) | 2008-01-15 |
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