TWI349324B - - Google Patents

Info

Publication number
TWI349324B
TWI349324B TW096117154A TW96117154A TWI349324B TW I349324 B TWI349324 B TW I349324B TW 096117154 A TW096117154 A TW 096117154A TW 96117154 A TW96117154 A TW 96117154A TW I349324 B TWI349324 B TW I349324B
Authority
TW
Taiwan
Application number
TW096117154A
Other languages
Chinese (zh)
Other versions
TW200737395A (en
Inventor
Hideki Nakayama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200737395A publication Critical patent/TW200737395A/zh
Application granted granted Critical
Publication of TWI349324B publication Critical patent/TWI349324B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096117154A 2003-05-30 2004-05-26 Lid Body Opening/Closing Mechanism of Vacuum Processing Chamber and Method for Opening/Closing Lid Body TW200737395A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003154521 2003-05-30
JP2004146815A JP4302575B2 (ja) 2003-05-30 2004-05-17 基板搬送装置および真空処理装置

Publications (2)

Publication Number Publication Date
TW200737395A TW200737395A (en) 2007-10-01
TWI349324B true TWI349324B (ja) 2011-09-21

Family

ID=34196595

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093114993A TW200428566A (en) 2003-05-30 2004-05-26 Substrate transportation device, method and vacuum processing apparatus
TW096117154A TW200737395A (en) 2003-05-30 2004-05-26 Lid Body Opening/Closing Mechanism of Vacuum Processing Chamber and Method for Opening/Closing Lid Body

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW093114993A TW200428566A (en) 2003-05-30 2004-05-26 Substrate transportation device, method and vacuum processing apparatus

Country Status (4)

Country Link
JP (1) JP4302575B2 (ja)
KR (2) KR100794807B1 (ja)
CN (2) CN100514550C (ja)
TW (2) TW200428566A (ja)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100613265B1 (ko) * 2004-09-06 2006-08-21 (주)아이씨디 진공처리 시스템 및 이를 이용한 대상물 이송방법
JP4716362B2 (ja) * 2005-06-07 2011-07-06 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP4754304B2 (ja) * 2005-09-02 2011-08-24 東京エレクトロン株式会社 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
TWI283005B (en) * 2005-12-28 2007-06-21 Au Optronics Corp Low-pressure process apparatus
JP4903027B2 (ja) * 2006-01-06 2012-03-21 東京エレクトロン株式会社 基板搬送装置および基板支持体
JP2007191278A (ja) * 2006-01-20 2007-08-02 Tokyo Electron Ltd 基板搬送装置、基板搬送方法及び記憶媒体
JP4967717B2 (ja) * 2007-03-02 2012-07-04 中西金属工業株式会社 スライドフォーク装置
US10163667B2 (en) * 2007-03-22 2018-12-25 Brooks Automation, Inc. Linear wafer drive for handling wafers during semiconductor fabrication
JP5190303B2 (ja) * 2008-06-04 2013-04-24 東京エレクトロン株式会社 搬送装置及び処理装置
CN101417747B (zh) * 2008-12-11 2011-11-23 友达光电股份有限公司 传送台机构
KR101175417B1 (ko) * 2009-11-27 2012-08-20 현대제철 주식회사 대차 이동 피트의 추락 방지 방치
CN101831621B (zh) * 2010-04-08 2012-10-17 湖南金博复合材料科技有限公司 化学气相增密炉炉体
JP5560909B2 (ja) * 2010-05-31 2014-07-30 東京エレクトロン株式会社 蓋体保持治具
DE102010022625A1 (de) * 2010-06-04 2011-12-08 Festo Ag & Co. Kg Handhabungssystem zur Handhabung von Gegenständen
JP5482500B2 (ja) * 2010-06-21 2014-05-07 東京エレクトロン株式会社 基板処理装置
JP5585238B2 (ja) * 2010-06-24 2014-09-10 東京エレクトロン株式会社 基板処理装置
JP5595202B2 (ja) * 2010-09-28 2014-09-24 東京エレクトロン株式会社 処理装置およびそのメンテナンス方法
US9656386B2 (en) 2010-10-08 2017-05-23 Brooks Automation, Inc. Coaxial drive vacuum robot
TWI402096B (zh) * 2011-01-20 2013-07-21 China Steel Corp Vacuum filter of the folding type movable cover device
KR101216717B1 (ko) 2011-02-25 2012-12-31 주식회사 영우디에스피 이송장치
CN103010725B (zh) * 2011-09-27 2015-04-15 鸿富锦精密工业（深圳）有限公司 移载机构
KR101460578B1 (ko) 2013-05-31 2014-11-13 주식회사 아스타 진공시스템의 시편이송구조
CN104338883B (zh) * 2013-07-26 2016-05-04 秦皇岛戴卡兴龙轮毂有限公司 车轮旋转锻造压力机装卸模具小车
KR101585869B1 (ko) * 2014-02-24 2016-01-15 주식회사 아스타 진공시스템의 시편이송장치
DE102014209684B4 (de) * 2014-05-21 2023-06-29 Siemens Healthcare Gmbh Medizinisches Untersuchungs- und/oder Behandlungsgerät
KR101695948B1 (ko) * 2015-06-26 2017-01-13 주식회사 테라세미콘 기판처리 시스템
JP6523838B2 (ja) * 2015-07-15 2019-06-05 東京エレクトロン株式会社 プローブカード搬送装置、プローブカード搬送方法及びプローブ装置
CN108091601A (zh) * 2016-11-23 2018-05-29 沈阳芯源微电子设备有限公司 一种半导体长距离晶圆传输装置
KR20180063423A (ko) * 2016-12-01 2018-06-12 주식회사 탑 엔지니어링 기판 이송 장치
JP6869136B2 (ja) * 2017-07-28 2021-05-12 日本電産サンキョー株式会社 産業用ロボット
CN108818598B (zh) * 2018-08-30 2024-03-19 深圳市德业智能股份有限公司 一种送料装置
CN109560032A (zh) * 2018-12-18 2019-04-02 深圳市矽电半导体设备有限公司 一种取料装置、上下料机构及供料系统
CN112027636A (zh) * 2019-06-03 2020-12-04 顺丰科技有限公司 直线行程放大机构
TWI741338B (zh) * 2019-08-02 2021-10-01 鴻勁精密股份有限公司 電子元件移載機構及其應用之作業分類設備

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960002534A (ko) * 1994-06-07 1996-01-26 이노우에 아키라 감압·상압 처리장치
DE29521292U1 (de) * 1995-06-01 1997-02-13 Samsung Electronics Co Ltd Geschwindigkeits-Erhöhungsvorrichtung für eine geradlinige Bewegung eines Orthogonalkoordinaten-Roboters
JPH09272095A (ja) * 1996-04-04 1997-10-21 Nec Corp 板状物搬送用ロボット
JPH1116981A (ja) * 1997-06-20 1999-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11121585A (ja) * 1997-10-17 1999-04-30 Olympus Optical Co Ltd ウェハ搬送装置
JP2003100837A (ja) * 2001-09-21 2003-04-04 Toyota Industries Corp 移載装置

Also Published As

Publication number Publication date
CN1971844A (zh) 2007-05-30
KR100654789B1 (ko) 2006-12-08
JP2005019967A (ja) 2005-01-20
TW200737395A (en) 2007-10-01
CN100514550C (zh) 2009-07-15
TWI349325B (ja) 2011-09-21
JP4302575B2 (ja) 2009-07-29
CN1326227C (zh) 2007-07-11
TW200428566A (en) 2004-12-16
KR20040103435A (ko) 2004-12-08
CN1574271A (zh) 2005-02-02
KR20060025214A (ko) 2006-03-20
KR100794807B1 (ko) 2008-01-15

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