TW200428566A - Substrate transportation device, method and vacuum processing apparatus - Google Patents
Substrate transportation device, method and vacuum processing apparatus Download PDFInfo
- Publication number
- TW200428566A TW200428566A TW093114993A TW93114993A TW200428566A TW 200428566 A TW200428566 A TW 200428566A TW 093114993 A TW093114993 A TW 093114993A TW 93114993 A TW93114993 A TW 93114993A TW 200428566 A TW200428566 A TW 200428566A
- Authority
- TW
- Taiwan
- Prior art keywords
- arm
- substrate
- plate
- vacuum
- arms
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003154521 | 2003-05-30 | ||
JP2004146815A JP4302575B2 (ja) | 2003-05-30 | 2004-05-17 | 基板搬送装置および真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200428566A true TW200428566A (en) | 2004-12-16 |
TWI349325B TWI349325B (ja) | 2011-09-21 |
Family
ID=34196595
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093114993A TW200428566A (en) | 2003-05-30 | 2004-05-26 | Substrate transportation device, method and vacuum processing apparatus |
TW096117154A TW200737395A (en) | 2003-05-30 | 2004-05-26 | Lid Body Opening/Closing Mechanism of Vacuum Processing Chamber and Method for Opening/Closing Lid Body |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096117154A TW200737395A (en) | 2003-05-30 | 2004-05-26 | Lid Body Opening/Closing Mechanism of Vacuum Processing Chamber and Method for Opening/Closing Lid Body |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4302575B2 (ja) |
KR (2) | KR100794807B1 (ja) |
CN (2) | CN1326227C (ja) |
TW (2) | TW200428566A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI417978B (zh) * | 2005-09-02 | 2013-12-01 | Tokyo Electron Ltd | A substrate processing device, a loading lock chamber unit, and a transporting device |
TWI469904B (zh) * | 2008-06-04 | 2015-01-21 | Tokyo Electron Ltd | Handling device and handling device |
TWI741338B (zh) * | 2019-08-02 | 2021-10-01 | 鴻勁精密股份有限公司 | 電子元件移載機構及其應用之作業分類設備 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613265B1 (ko) * | 2004-09-06 | 2006-08-21 | (주)아이씨디 | 진공처리 시스템 및 이를 이용한 대상물 이송방법 |
JP4716362B2 (ja) * | 2005-06-07 | 2011-07-06 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
TWI283005B (en) | 2005-12-28 | 2007-06-21 | Au Optronics Corp | Low-pressure process apparatus |
JP4903027B2 (ja) * | 2006-01-06 | 2012-03-21 | 東京エレクトロン株式会社 | 基板搬送装置および基板支持体 |
JP2007191278A (ja) * | 2006-01-20 | 2007-08-02 | Tokyo Electron Ltd | 基板搬送装置、基板搬送方法及び記憶媒体 |
JP4967717B2 (ja) * | 2007-03-02 | 2012-07-04 | 中西金属工業株式会社 | スライドフォーク装置 |
JP2010524201A (ja) * | 2007-03-22 | 2010-07-15 | クロッシング オートメイション, インコーポレイテッド | モジュラクラスタツール |
CN101417747B (zh) * | 2008-12-11 | 2011-11-23 | 友达光电股份有限公司 | 传送台机构 |
KR101175417B1 (ko) * | 2009-11-27 | 2012-08-20 | 현대제철 주식회사 | 대차 이동 피트의 추락 방지 방치 |
CN101831621B (zh) * | 2010-04-08 | 2012-10-17 | 湖南金博复合材料科技有限公司 | 化学气相增密炉炉体 |
JP5560909B2 (ja) * | 2010-05-31 | 2014-07-30 | 東京エレクトロン株式会社 | 蓋体保持治具 |
DE102010022625A1 (de) * | 2010-06-04 | 2011-12-08 | Festo Ag & Co. Kg | Handhabungssystem zur Handhabung von Gegenständen |
JP5482500B2 (ja) * | 2010-06-21 | 2014-05-07 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5585238B2 (ja) * | 2010-06-24 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5595202B2 (ja) * | 2010-09-28 | 2014-09-24 | 東京エレクトロン株式会社 | 処理装置およびそのメンテナンス方法 |
WO2012048346A1 (en) | 2010-10-08 | 2012-04-12 | Brooks Automation, Inc. | Coaxial drive vacuum robot |
TWI402096B (zh) * | 2011-01-20 | 2013-07-21 | China Steel Corp | Vacuum filter of the folding type movable cover device |
KR101216717B1 (ko) | 2011-02-25 | 2012-12-31 | 주식회사 영우디에스피 | 이송장치 |
CN103010725B (zh) * | 2011-09-27 | 2015-04-15 | 鸿富锦精密工业(深圳)有限公司 | 移载机构 |
KR101460578B1 (ko) | 2013-05-31 | 2014-11-13 | 주식회사 아스타 | 진공시스템의 시편이송구조 |
CN104338883B (zh) * | 2013-07-26 | 2016-05-04 | 秦皇岛戴卡兴龙轮毂有限公司 | 车轮旋转锻造压力机装卸模具小车 |
KR101585869B1 (ko) * | 2014-02-24 | 2016-01-15 | 주식회사 아스타 | 진공시스템의 시편이송장치 |
DE102014209684B4 (de) * | 2014-05-21 | 2023-06-29 | Siemens Healthcare Gmbh | Medizinisches Untersuchungs- und/oder Behandlungsgerät |
KR101695948B1 (ko) * | 2015-06-26 | 2017-01-13 | 주식회사 테라세미콘 | 기판처리 시스템 |
JP6523838B2 (ja) * | 2015-07-15 | 2019-06-05 | 東京エレクトロン株式会社 | プローブカード搬送装置、プローブカード搬送方法及びプローブ装置 |
CN108091601A (zh) * | 2016-11-23 | 2018-05-29 | 沈阳芯源微电子设备有限公司 | 一种半导体长距离晶圆传输装置 |
KR20180063423A (ko) * | 2016-12-01 | 2018-06-12 | 주식회사 탑 엔지니어링 | 기판 이송 장치 |
JP6869136B2 (ja) * | 2017-07-28 | 2021-05-12 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN108818598B (zh) * | 2018-08-30 | 2024-03-19 | 深圳市德业智能股份有限公司 | 一种送料装置 |
CN109560032A (zh) * | 2018-12-18 | 2019-04-02 | 深圳市矽电半导体设备有限公司 | 一种取料装置、上下料机构及供料系统 |
CN112027636A (zh) * | 2019-06-03 | 2020-12-04 | 顺丰科技有限公司 | 直线行程放大机构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960002534A (ko) * | 1994-06-07 | 1996-01-26 | 이노우에 아키라 | 감압·상압 처리장치 |
DE29521292U1 (de) * | 1995-06-01 | 1997-02-13 | Samsung Electronics Co Ltd | Geschwindigkeits-Erhöhungsvorrichtung für eine geradlinige Bewegung eines Orthogonalkoordinaten-Roboters |
JPH09272095A (ja) * | 1996-04-04 | 1997-10-21 | Nec Corp | 板状物搬送用ロボット |
JPH1116981A (ja) * | 1997-06-20 | 1999-01-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11121585A (ja) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | ウェハ搬送装置 |
JP2003100837A (ja) * | 2001-09-21 | 2003-04-04 | Toyota Industries Corp | 移載装置 |
-
2004
- 2004-05-17 JP JP2004146815A patent/JP4302575B2/ja not_active Expired - Lifetime
- 2004-05-26 TW TW093114993A patent/TW200428566A/zh unknown
- 2004-05-26 TW TW096117154A patent/TW200737395A/zh unknown
- 2004-05-27 CN CNB200410038397XA patent/CN1326227C/zh not_active Expired - Lifetime
- 2004-05-27 CN CNB2006101645729A patent/CN100514550C/zh not_active Expired - Lifetime
- 2004-05-28 KR KR1020040038427A patent/KR100794807B1/ko active IP Right Grant
-
2006
- 2006-02-16 KR KR1020060015256A patent/KR100654789B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI417978B (zh) * | 2005-09-02 | 2013-12-01 | Tokyo Electron Ltd | A substrate processing device, a loading lock chamber unit, and a transporting device |
TWI469904B (zh) * | 2008-06-04 | 2015-01-21 | Tokyo Electron Ltd | Handling device and handling device |
TWI741338B (zh) * | 2019-08-02 | 2021-10-01 | 鴻勁精密股份有限公司 | 電子元件移載機構及其應用之作業分類設備 |
Also Published As
Publication number | Publication date |
---|---|
CN100514550C (zh) | 2009-07-15 |
KR100794807B1 (ko) | 2008-01-15 |
JP4302575B2 (ja) | 2009-07-29 |
TWI349324B (ja) | 2011-09-21 |
CN1574271A (zh) | 2005-02-02 |
TW200737395A (en) | 2007-10-01 |
JP2005019967A (ja) | 2005-01-20 |
TWI349325B (ja) | 2011-09-21 |
CN1971844A (zh) | 2007-05-30 |
CN1326227C (zh) | 2007-07-11 |
KR100654789B1 (ko) | 2006-12-08 |
KR20060025214A (ko) | 2006-03-20 |
KR20040103435A (ko) | 2004-12-08 |
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