TW200715450A - Substrate processing apparatus, load lock chamber unit, and method for carrying out conveying device - Google Patents
Substrate processing apparatus, load lock chamber unit, and method for carrying out conveying deviceInfo
- Publication number
- TW200715450A TW200715450A TW095132467A TW95132467A TW200715450A TW 200715450 A TW200715450 A TW 200715450A TW 095132467 A TW095132467 A TW 095132467A TW 95132467 A TW95132467 A TW 95132467A TW 200715450 A TW200715450 A TW 200715450A
- Authority
- TW
- Taiwan
- Prior art keywords
- processing apparatus
- load lock
- substrate processing
- conveying device
- conveying
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
To provide a substrate processing apparatus in which a conveying device in a conveying chamber can be carried out of the substrate processing apparatus regardless of the height of an installation place. The substrate processing apparatus 1 comprises processing chambers 10a to 10c for performing predetermined processing on a substrate S in vacuum, a conveying chamber 20 coupled with the processing chambers 10a to 10c and provided with the conveying device 50 for conveying the substrate S while being held in vacuum, and a load lock chamber 30 provided between the conveying chamber 20 and a substrate container 40 on the atmosphere side, wherein a space 310 exists under the load lock chamber 30. The conveying device 50 can be divided into an upper structure 500A and a lower structure 500B, wherein the upper structure 500A can be carried out of the substrate processing apparatus from above the conveying chamber 20, and the lower structure 500B can be carried out of the apparatus from the underside of the conveying chamber 20 through the space 310 under the load lock chamber 30.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005255291A JP4754304B2 (en) | 2005-09-02 | 2005-09-02 | Substrate processing apparatus, load lock chamber unit, and carrying-out method of transfer apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715450A true TW200715450A (en) | 2007-04-16 |
TWI417978B TWI417978B (en) | 2013-12-01 |
Family
ID=37817365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132467A TWI417978B (en) | 2005-09-02 | 2006-09-01 | A substrate processing device, a loading lock chamber unit, and a transporting device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4754304B2 (en) |
KR (1) | KR100830730B1 (en) |
CN (2) | CN101359588B (en) |
TW (1) | TWI417978B (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4903728B2 (en) * | 2008-01-11 | 2012-03-28 | 株式会社アルバック | A transfer chamber in which a transfer robot is installed and a maintenance method thereof. |
US20090194026A1 (en) * | 2008-01-31 | 2009-08-06 | Burrows Brian H | Processing system for fabricating compound nitride semiconductor devices |
JP4993614B2 (en) * | 2008-02-29 | 2012-08-08 | 東京エレクトロン株式会社 | Teaching method for conveying means, storage medium, and substrate processing apparatus |
JP5190303B2 (en) * | 2008-06-04 | 2013-04-24 | 東京エレクトロン株式会社 | Conveying device and processing device |
KR20100136711A (en) * | 2009-06-19 | 2010-12-29 | 주식회사 테라세미콘 | Apparatus for transferring substrate in large area substrate treating system |
EP2315236B1 (en) * | 2009-10-22 | 2014-05-14 | VAT Holding AG | Flap transfer valve |
JP5425656B2 (en) * | 2010-02-15 | 2014-02-26 | 東京エレクトロン株式会社 | Substrate processing apparatus and load lock apparatus |
JPWO2011161888A1 (en) * | 2010-06-21 | 2013-08-19 | 株式会社アルバック | Conveying device and manufacturing method of conveying device |
KR101136728B1 (en) * | 2010-10-18 | 2012-04-20 | 주성엔지니어링(주) | Apparatus for treating substrate and method of disassembling and assembling the same |
KR101136729B1 (en) * | 2011-10-20 | 2012-04-19 | 주성엔지니어링(주) | Means for opening and closing apparatus for treating substrate |
JP2013126707A (en) * | 2011-12-19 | 2013-06-27 | Yaskawa Electric Corp | Robot and robot installation method |
JP2013143413A (en) * | 2012-01-10 | 2013-07-22 | Hitachi High-Technologies Corp | Vacuum processing apparatus |
CN105826227A (en) * | 2015-01-06 | 2016-08-03 | 沈阳新松机器人自动化股份有限公司 | Vacuum transmission device |
JP6755169B2 (en) * | 2016-12-15 | 2020-09-16 | 東京エレクトロン株式会社 | Transport mount and transport method |
CN108346605B (en) * | 2017-01-23 | 2019-08-06 | 孙建忠 | System is sent in substrate storage |
PT3376530T (en) | 2017-03-16 | 2019-11-20 | Atotech Deutschland Gmbh | Automated substrate holder loading device |
CN107082279B (en) * | 2017-05-22 | 2020-01-03 | 昆山国显光电有限公司 | Panel carrying device |
US20210327736A1 (en) * | 2020-04-17 | 2021-10-21 | Kla Corporation | Mini-environment system for controlling oxygen and humidity levels within a sample transport device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697258A (en) * | 1992-09-17 | 1994-04-08 | Hitachi Ltd | Continuous vacuum processing device |
JPH07231028A (en) * | 1994-02-18 | 1995-08-29 | Ebara Corp | Conveying apparatus and conveying method |
JP3350278B2 (en) * | 1995-03-06 | 2002-11-25 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP3539814B2 (en) * | 1995-10-05 | 2004-07-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
TW318258B (en) * | 1995-12-12 | 1997-10-21 | Tokyo Electron Co Ltd | |
JP3650495B2 (en) * | 1995-12-12 | 2005-05-18 | 東京エレクトロン株式会社 | Semiconductor processing apparatus, substrate replacement mechanism and substrate replacement method thereof |
JPH10247675A (en) * | 1997-03-04 | 1998-09-14 | Toshiba Corp | Multi-chamber system, transfer truck thereof, gate valve, and exhaust control method and device thereof |
JPH11354603A (en) * | 1998-06-05 | 1999-12-24 | Hitachi Ltd | Transfer apparatus and semiconductor manufacturing apparatus using the transfer apparatus |
JP4336003B2 (en) * | 1999-07-28 | 2009-09-30 | 三井造船株式会社 | Vacuum container load lock device |
JP4316752B2 (en) * | 1999-11-30 | 2009-08-19 | キヤノンアネルバ株式会社 | Vacuum transfer processing equipment |
JP2002237510A (en) * | 2001-02-07 | 2002-08-23 | Shin Meiwa Ind Co Ltd | Vacuum conveying apparatus |
JP2003037147A (en) * | 2001-07-25 | 2003-02-07 | Tokyo Electron Ltd | Substrate carrying apparatus and thermally treatment method |
JP4244555B2 (en) * | 2002-02-25 | 2009-03-25 | 東京エレクトロン株式会社 | Support mechanism for workpiece |
JP4302575B2 (en) * | 2003-05-30 | 2009-07-29 | 東京エレクトロン株式会社 | Substrate transfer apparatus and vacuum processing apparatus |
JP4493955B2 (en) * | 2003-09-01 | 2010-06-30 | 東京エレクトロン株式会社 | Substrate processing apparatus and transfer case |
JP2005093807A (en) * | 2003-09-18 | 2005-04-07 | Hitachi Kokusai Electric Inc | Semiconductor manufacturing device |
-
2005
- 2005-09-02 JP JP2005255291A patent/JP4754304B2/en not_active Expired - Fee Related
-
2006
- 2006-08-31 KR KR1020060083861A patent/KR100830730B1/en active IP Right Grant
- 2006-09-01 TW TW095132467A patent/TWI417978B/en not_active IP Right Cessation
- 2006-09-04 CN CN2008101451421A patent/CN101359588B/en active Active
- 2006-09-04 CN CNB2006101289245A patent/CN100458515C/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101359588B (en) | 2010-08-11 |
JP2007073540A (en) | 2007-03-22 |
JP4754304B2 (en) | 2011-08-24 |
CN100458515C (en) | 2009-02-04 |
KR100830730B1 (en) | 2008-05-20 |
KR20070026220A (en) | 2007-03-08 |
TWI417978B (en) | 2013-12-01 |
CN1924660A (en) | 2007-03-07 |
CN101359588A (en) | 2009-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |