TW200715450A - Substrate processing apparatus, load lock chamber unit, and method for carrying out conveying device - Google Patents

Substrate processing apparatus, load lock chamber unit, and method for carrying out conveying device

Info

Publication number
TW200715450A
TW200715450A TW095132467A TW95132467A TW200715450A TW 200715450 A TW200715450 A TW 200715450A TW 095132467 A TW095132467 A TW 095132467A TW 95132467 A TW95132467 A TW 95132467A TW 200715450 A TW200715450 A TW 200715450A
Authority
TW
Taiwan
Prior art keywords
processing apparatus
load lock
substrate processing
conveying device
conveying
Prior art date
Application number
TW095132467A
Other languages
Chinese (zh)
Other versions
TWI417978B (en
Inventor
Yoichi Nakagomi
Hideki Nakayama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200715450A publication Critical patent/TW200715450A/en
Application granted granted Critical
Publication of TWI417978B publication Critical patent/TWI417978B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices

Abstract

To provide a substrate processing apparatus in which a conveying device in a conveying chamber can be carried out of the substrate processing apparatus regardless of the height of an installation place. The substrate processing apparatus 1 comprises processing chambers 10a to 10c for performing predetermined processing on a substrate S in vacuum, a conveying chamber 20 coupled with the processing chambers 10a to 10c and provided with the conveying device 50 for conveying the substrate S while being held in vacuum, and a load lock chamber 30 provided between the conveying chamber 20 and a substrate container 40 on the atmosphere side, wherein a space 310 exists under the load lock chamber 30. The conveying device 50 can be divided into an upper structure 500A and a lower structure 500B, wherein the upper structure 500A can be carried out of the substrate processing apparatus from above the conveying chamber 20, and the lower structure 500B can be carried out of the apparatus from the underside of the conveying chamber 20 through the space 310 under the load lock chamber 30.
TW095132467A 2005-09-02 2006-09-01 A substrate processing device, a loading lock chamber unit, and a transporting device TWI417978B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255291A JP4754304B2 (en) 2005-09-02 2005-09-02 Substrate processing apparatus, load lock chamber unit, and carrying-out method of transfer apparatus

Publications (2)

Publication Number Publication Date
TW200715450A true TW200715450A (en) 2007-04-16
TWI417978B TWI417978B (en) 2013-12-01

Family

ID=37817365

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132467A TWI417978B (en) 2005-09-02 2006-09-01 A substrate processing device, a loading lock chamber unit, and a transporting device

Country Status (4)

Country Link
JP (1) JP4754304B2 (en)
KR (1) KR100830730B1 (en)
CN (2) CN101359588B (en)
TW (1) TWI417978B (en)

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JP4903728B2 (en) * 2008-01-11 2012-03-28 株式会社アルバック A transfer chamber in which a transfer robot is installed and a maintenance method thereof.
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
JP4993614B2 (en) * 2008-02-29 2012-08-08 東京エレクトロン株式会社 Teaching method for conveying means, storage medium, and substrate processing apparatus
JP5190303B2 (en) * 2008-06-04 2013-04-24 東京エレクトロン株式会社 Conveying device and processing device
KR20100136711A (en) * 2009-06-19 2010-12-29 주식회사 테라세미콘 Apparatus for transferring substrate in large area substrate treating system
EP2315236B1 (en) * 2009-10-22 2014-05-14 VAT Holding AG Flap transfer valve
JP5425656B2 (en) * 2010-02-15 2014-02-26 東京エレクトロン株式会社 Substrate processing apparatus and load lock apparatus
JPWO2011161888A1 (en) * 2010-06-21 2013-08-19 株式会社アルバック Conveying device and manufacturing method of conveying device
KR101136728B1 (en) * 2010-10-18 2012-04-20 주성엔지니어링(주) Apparatus for treating substrate and method of disassembling and assembling the same
KR101136729B1 (en) * 2011-10-20 2012-04-19 주성엔지니어링(주) Means for opening and closing apparatus for treating substrate
JP2013126707A (en) * 2011-12-19 2013-06-27 Yaskawa Electric Corp Robot and robot installation method
JP2013143413A (en) * 2012-01-10 2013-07-22 Hitachi High-Technologies Corp Vacuum processing apparatus
CN105826227A (en) * 2015-01-06 2016-08-03 沈阳新松机器人自动化股份有限公司 Vacuum transmission device
JP6755169B2 (en) * 2016-12-15 2020-09-16 東京エレクトロン株式会社 Transport mount and transport method
CN108346605B (en) * 2017-01-23 2019-08-06 孙建忠 System is sent in substrate storage
PT3376530T (en) 2017-03-16 2019-11-20 Atotech Deutschland Gmbh Automated substrate holder loading device
CN107082279B (en) * 2017-05-22 2020-01-03 昆山国显光电有限公司 Panel carrying device
US20210327736A1 (en) * 2020-04-17 2021-10-21 Kla Corporation Mini-environment system for controlling oxygen and humidity levels within a sample transport device

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPH0697258A (en) * 1992-09-17 1994-04-08 Hitachi Ltd Continuous vacuum processing device
JPH07231028A (en) * 1994-02-18 1995-08-29 Ebara Corp Conveying apparatus and conveying method
JP3350278B2 (en) * 1995-03-06 2002-11-25 大日本スクリーン製造株式会社 Substrate processing equipment
JP3539814B2 (en) * 1995-10-05 2004-07-07 大日本スクリーン製造株式会社 Substrate processing equipment
TW318258B (en) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JP3650495B2 (en) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 Semiconductor processing apparatus, substrate replacement mechanism and substrate replacement method thereof
JPH10247675A (en) * 1997-03-04 1998-09-14 Toshiba Corp Multi-chamber system, transfer truck thereof, gate valve, and exhaust control method and device thereof
JPH11354603A (en) * 1998-06-05 1999-12-24 Hitachi Ltd Transfer apparatus and semiconductor manufacturing apparatus using the transfer apparatus
JP4336003B2 (en) * 1999-07-28 2009-09-30 三井造船株式会社 Vacuum container load lock device
JP4316752B2 (en) * 1999-11-30 2009-08-19 キヤノンアネルバ株式会社 Vacuum transfer processing equipment
JP2002237510A (en) * 2001-02-07 2002-08-23 Shin Meiwa Ind Co Ltd Vacuum conveying apparatus
JP2003037147A (en) * 2001-07-25 2003-02-07 Tokyo Electron Ltd Substrate carrying apparatus and thermally treatment method
JP4244555B2 (en) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 Support mechanism for workpiece
JP4302575B2 (en) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 Substrate transfer apparatus and vacuum processing apparatus
JP4493955B2 (en) * 2003-09-01 2010-06-30 東京エレクトロン株式会社 Substrate processing apparatus and transfer case
JP2005093807A (en) * 2003-09-18 2005-04-07 Hitachi Kokusai Electric Inc Semiconductor manufacturing device

Also Published As

Publication number Publication date
CN101359588B (en) 2010-08-11
JP2007073540A (en) 2007-03-22
JP4754304B2 (en) 2011-08-24
CN100458515C (en) 2009-02-04
KR100830730B1 (en) 2008-05-20
KR20070026220A (en) 2007-03-08
TWI417978B (en) 2013-12-01
CN1924660A (en) 2007-03-07
CN101359588A (en) 2009-02-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees