CN101359588A - Substrate processing apparatus, load-lock chamber unit, and method of carrying out a transfer device - Google Patents
Substrate processing apparatus, load-lock chamber unit, and method of carrying out a transfer device Download PDFInfo
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- CN101359588A CN101359588A CNA2008101451421A CN200810145142A CN101359588A CN 101359588 A CN101359588 A CN 101359588A CN A2008101451421 A CNA2008101451421 A CN A2008101451421A CN 200810145142 A CN200810145142 A CN 200810145142A CN 101359588 A CN101359588 A CN 101359588A
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- carrying device
- load locking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
Provided is a substrate processing apparatus (1) in which a conveying device in a conveying chamber can be carried out of the substrate processing apparatus regardless of the height of an installation place. The substrate processing apparatus comprises processing chamber (10a-10c) for performing predetermined processing on a substrate s in vacuum, a conveying chamber 20 coupled with the processing chamber and provided with the conveying device 50 for conveying the substrate s while being held in vacuum, and a load lock chamber 30 provided between the conveying chamber 20 and a substrate container on the atmosphere side, wherein a space exists under the load lock chamber 30. The conveying device can be divided into an upper structure and a lower structure 500B, wherein the upper structure can be carried out of the substrate processing apparatus from above the conveying chamber 20, and the lower structure 500B can be carried out of the apparatus from the underside of the conveying chamber 20 through the space under the load lock chamber 30.
Description
(this case is that application number is that 200610100585.X, denomination of invention are the dividing an application of patent application of the method for taking out of of the sharp carrying device of substrate board treatment, load-lock chamber unit)
Technical field
The present invention relates to handle the take out of method of flat-panel monitor (FPD) with substrate board treatment, load-lock chamber unit and the carrying device of large substrates such as glass substrate.
Background technology
In the manufacture process of flat-panel monitor (FPD) that with LCD (LCD) is representative, use a plurality of vacuum flush systems vacuum treatment installation, so-called many chamber profile that under the vacuum glass substrate carried out regulation processing such as etching, ashing, film forming etc. that are included in.
For such vacuum flush system, it comprises: be provided with the conveyance substrate carrying device carrying room and be arranged on a plurality of treatment chamber around it, when moving into processed substrate in each treatment chamber, treatment substrate is taken out of from the treatment chamber of each vacuum treatment installation by the carrying arm in the carrying room.In addition, load locking room is connected with carrying room,, can handles the polylith substrate in that substrate is moved into or when taking out of atmospheric side, can intactly be kept the vacuum state in process chamber and the carrying room from atmospheric side.Many chamber profile treatment system so for example discloses in patent documentation 1 to some extent.
Yet in recent years, the requirement that the LCD glass substrate is maximized becomes strongly, has occurred surpassing the epimegetic glass substrate of 2m even on one side, and is corresponding, and device also requires to maximize, and the various structural elements of Shi Yonging also require to maximize therein.Particularly, the carrying device that in carrying room, uses, have and comprise by the conveyance unit of driving and reversing mechanism of forming as the single oil cylinder of the pick-up of the substrate supporting member of for example carrying out the substrate transmission and the rotational structure that makes this driving and reversing mechanism rotation and make the lifting unit of such conveyance unit lifting, when substrate maximizes, make whole carrying device also become very big.
In the prior art, when the maintenance carrying device, when from carrying room, taking out carrying device, use hoisting equipment that it is hung upward, along with the maximization of carrying device, be subjected to the restriction of clean room height, be difficult to use such method to take out carrying device from carrying room.
For this reason, considered the method for below carrying room, taking out, but, because carrying room is around treatment chamber and load locking room, there is not the space that to take out carrying device at the downside of treatment chamber and the downside of load locking room, so it also is very difficult taking out of carrying device below carrying room.That is, below treatment chamber, have vacuum exhaust mechanism etc., below load locking room, be provided with the mechanism of the cover body opening/closing that makes the substrate reception room that is divided into the lower floor in the two-layer substrate reception room up and down.
Consideration should be avoided these mechanisms, make the lid of load locking room bottom make rotary type, but, under with the situation of end on one side as rotating shaft " singly opening ", lid can not be opened fully, can not guarantee enough service clearances, and under the situation of " two opening ", the lid of opening can hinder the passage of maintenance and operating characteristics is worsened.
[patent documentation] Japanese kokai publication hei 9-223727
Summary of the invention
In view of the above problems, the object of the present invention is to provide the method for taking out of of a kind of substrate board treatment and carrying device, make no matter in carrying room, be provided with carrying device the place limitation in height how, can both be with the outside of its conveyance to substrate board treatment.
In addition, another object of the present invention is to provide a kind of load-lock chamber unit that uses in substrate board treatment, can guarantee the space below load locking room, and maintainability is good.
In order to address the above problem, in a first aspect of the present invention, provide a kind of substrate board treatment, it is characterized in that, comprising: the process chamber of in a vacuum substrate being implemented predetermined processing; Be connected with above-mentioned process chamber, be held in a vacuum, and have the carrying room of in above-mentioned process chamber, moving into the carrying device of substrate; And be arranged on above-mentioned carrying room and between the substrate accommodation container of atmospheric side, and atmospheric side between be maintained at during transferring substrates near the atmospheric pressure, and above-mentioned carrying room between be maintained at load locking room under the vacuum state during transferring substrates, wherein, below above-mentioned load locking room, have the space, above-mentioned carrying device can be divided into superstructure and substructure, above-mentioned superstructure can be taken out of outside the substrate board treatment from the top of above-mentioned carrying room, above-mentioned substructure can be from the downside of above-mentioned carrying room, and take out of outside the substrate board treatment in the space of the below by above-mentioned load locking room.
In the aforesaid substrate processing unit, above-mentioned carrying room constitutes has the lid that can open and close at an upper portion thereof, the above-mentioned superstructure of above-mentioned carrying device, can open taken out of under the state of this lid above-mentioned carrying room above.
And, in above-mentioned carrying device, above-mentioned superstructure constitute include be arranged in the above-mentioned carrying room, supporting substrate and the conveyance unit that carries out conveyance, above-mentioned substructure comprises the mechanism that is used to make above-mentioned conveyance unit lifting, is arranged on the downside of above-mentioned carrying room.
And above-mentioned load locking room comprises: the lid that can open and close that is arranged on the bottom; With the switching mechanism that makes cover body opening/closing, wherein, above-mentioned switching mechanism comprises: a plurality of ball-screws of corner portion that are separately positioned on the following side space of above-mentioned load locking room; Be screwed with ball-screw respectively, support above-mentioned lid and the lifting support component of lifting along with the rotation of ball-screw; Be arranged on the following side space outside of above-mentioned load locking room, be used to make the driving mechanism of above-mentioned ball-screw rotation; And has a Poewr transmission mechanism that the actuating force of above-mentioned driving mechanism is passed to the power transmission shaft that can freely load and unload of above-mentioned ball-screw, wherein, when above-mentioned lid is closed, form the space that the above-mentioned substructure of above-mentioned carrying device can be passed through at the lower position of above-mentioned load locking room, by unload above-mentioned power transmission shaft with the above-mentioned substructure of above-mentioned carrying device by the following side space of above-mentioned load locking room conveyance outside the aforesaid substrate processing unit, when above-mentioned lid descends unlatching, can carry out the indoor maintenance of above-mentioned load-lock.
Above-mentioned load locking room constitutes has bilevel substrate reception room, and above-mentioned lid can use when above-mentioned following laminar substrate reception room keeps in repair.
In a second aspect of the present invention, a kind of load-lock chamber unit is provided, it is characterized in that, comprise: be arranged between the vacuum chamber and atmospheric side that is held in a vacuum, between vacuum chamber and atmosphere during the conveyance substrate, and atmospheric side between be maintained at during transferring substrates near the atmospheric pressure, and above-mentioned vacuum chamber between be maintained at load locking room under the vacuum state during transferring substrates; Be arranged on the lid that can open and close of the bottom of load locking room; With the switching mechanism that makes cover body opening/closing, wherein, above-mentioned switching mechanism has elevating mechanism, above-mentioned lid can be maintained level and makes its lifting, and when above-mentioned lid is closed, can guarantee above-mentioned lid below the space.
In addition, in a third aspect of the present invention, a kind of load-lock chamber unit is provided, it is characterized in that, comprise: be arranged between the vacuum chamber and atmospheric side that is held in a vacuum, between vacuum chamber and atmospheric side during the conveyance substrate, and atmospheric side between be maintained at during transferring substrates near the atmospheric pressure, and above-mentioned vacuum chamber between be maintained at load locking room under the vacuum state during transferring substrates; Be arranged on the lid that can open and close of the bottom of load locking room; With the switching mechanism that makes cover body opening/closing, wherein, above-mentioned switching mechanism comprises: a plurality of ball-screws that are separately positioned on the corner portion of above-mentioned load locking room below part; Be screwed with above-mentioned ball-screw respectively, support above-mentioned lid, and the lifting support component of the lifting along with the rotation of above-mentioned ball-screw; With the lower zone outside that is arranged on above-mentioned load locking room, be used to make the driving mechanism of above-mentioned ball-screw rotation, wherein, when above-mentioned lid is closed, below above-mentioned load locking room, formed the space in the above-mentioned ball-screw area surrounded, when above-mentioned Cover opening, above-mentioned lid drops in the above-mentioned space.
In the above-mentioned third aspect, above-mentioned switching mechanism has Poewr transmission mechanism, the actuating force that this Poewr transmission mechanism has above-mentioned driving mechanism passes to the power transmission shaft that above-mentioned ball-screw also can freely load and unload, by unloading above-mentioned power transmission shaft, above-mentioned space is used as the conveyance passage.
In addition, above-mentioned load locking room has bilevel substrate reception room, and above-mentioned lid can use when above-mentioned following laminar substrate reception room keeps in repair.
In a fourth aspect of the present invention, a kind of method of taking out of of carrying device is provided, be that the carrying device of in substrate board treatment above-mentioned carrying device being taken out of outside the aforesaid substrate processing unit is taken out of method, wherein, above-mentioned carrying device comprises: the process chamber of in a vacuum substrate being implemented predetermined processing; Be connected with above-mentioned process chamber, be held in a vacuum, and comprise the carrying room of substrate being moved into the carrying device in the above-mentioned process chamber; And be arranged between the substrate accommodation container of above-mentioned carrying room and atmospheric side, and atmosphere between during transferring substrates, be maintained near the atmospheric pressure, and above-mentioned carrying room between be held the load locking room of vacuum state during transferring substrates, it is characterized in that: below above-mentioned load locking room, be formed with the space, above-mentioned carrying device can be divided into superstructure and substructure, when above above-mentioned carrying room, taking out of above-mentioned superstructure outside the substrate board treatment, from the downside of above-mentioned carrying room above-mentioned substructure is taken out of outside the substrate board treatment by the space of above-mentioned load locking room below.
Taking out of in the method for such carrying device, above-mentioned carrying room has the lid that can open and close at an upper portion thereof, the above-mentioned superstructure of above-mentioned carrying device, can taken out of under the state of this Cover opening above-mentioned carrying room above.
Taking out of in the method for above-mentioned carrying device, above-mentioned superstructure is arranged in the above-mentioned carrying room, comprises to support the also conveyance unit of conveyance substrate, and above-mentioned substructure comprises the mechanism that is used to make above-mentioned conveyance unit lifting, is arranged on the downside of above-mentioned carrying room.
According to the present invention, owing to below load locking room, have the space, carrying device can be divided into superstructure and substructure, superstructure can be taken out of the outside of substrate board treatment from the top of carrying room, substructure can the space below load locking room be taken out of the outside of substrate board treatment from the downside of carrying room, so, it can both be taken out of the outside of substrate board treatment in carrying room no matter the limitation in height that the carrying device place is set how.
Be provided with the lid that can open and close in the bottom of load locking room, because having to keep at the above-mentioned lid of maintenance, the switching mechanism of this lid carries out lifting under the level, and when closing above-mentioned lid, can guarantee the elevating mechanism in the space below the above-mentioned lid, so, can guarantee to make maintainability good in the space of load locking room downside.Typically say, have a plurality of ball-screws as the corner portion that is separately positioned on load locking room below part of switching mechanism, screw togather with ball-screw respectively, when supporting lid, make the ball-screw rotation and make the lifting support component of its lifting and be arranged on outside the lower zone of load locking room, make the driving mechanism of ball-screw rotation, by when lid is closed, below load locking room by forming the space in the ball-screw area surrounded, when Cover opening, make lid drop to structure in the above-mentioned space, and can guarantee like that as mentioned above in the space of load locking room downside, make maintainability good.
Description of drawings
Fig. 1 is the stereogram of plasma processing apparatus of an execution mode of schematic representation substrate board treatment of the present invention.
Fig. 2 is the horizontal sectional view of the plasma processing apparatus of Fig. 1.
Fig. 3 is the block diagram of expression control part brief configuration.
Fig. 4 is the vertical cross-section diagram that is illustrated in the carrying device that is provided with in the carrying room of plasma processing apparatus of Fig. 1.
Fig. 5 is the stereogram of conveyance unit of the carrying device of presentation graphs 4.
Fig. 6 is that the ideograph of taking out of the carrying device state in the carrying room is cut apart in expression.
Fig. 7 is the front elevation that is illustrated in the load locking room in the plasma processing apparatus of Fig. 1.
Fig. 8 is the longitudinal section that is illustrated in the load locking room in the plasma processing apparatus of Fig. 1.
Fig. 9 is the stereogram that is illustrated in the load locking room in the plasma processing apparatus of Fig. 1.
Figure 10 is the figure of the switching mechanism of the expression lid that is used for opening and closing load locking room.
Figure 11 is the figure that schematically the outer method for opening and closing of the switching form of the load locking room lid in the embodiments of the present invention and the scope of the invention is compared.
Figure 12 schematically shows the switching mechanism figure of load locking room lid always.
Figure 13 is used for illustrating the figure that takes out of passage of the substructure of carrying device.
Symbol description
1: plasma processing apparatus
10a, 10b, 10c: treatment chamber
20: carrying room
30: load locking room
31a, 31b: substrate reception room
50: carrying device
60: control part
303,305: lid
310: the space
400: switching mechanism
401a～401d: ball-screw (ball screw) mechanism
402: the lifting support component
403: the line slideway parts
404: engine (driving mechanism)
405: Poewr transmission mechanism
413,414,417: power transmission shaft
500A: superstructure
500B: substructure
501: the conveyance unit
502: elevating mechanism
S: substrate
Embodiment
Below, with reference to accompanying drawing, preferred implementation of the present invention is described.Here, to elevating mechanism of the present invention is used for the example that FPD carries out with glass substrate (below, only be called " substrate ") in the carrying device of many chamber profile plasma treatment appts of plasma treatment is described.At this, as FPD, illustration have LCD (LCD), light-emitting diode (LED) display, electroluminescence (Electro Luminescence:EL) display, fluorescent display tube (Vacuum Fluorescent Display, VFD) and plasma display panel (PDP) etc.
Fig. 1 is the stereogram of plasma processing apparatus of an execution mode of schematic representation substrate board treatment of the present invention, and Fig. 2 is a horizontal sectional view of representing that roughly it is inner.
For this plasma treatment device 1, portion is connected with carrying room 20 and load locking room 30 in the central.Around carrying room 20, be equipped with three process cavity 10a, 10b, 10c.
Be communicated with between conveyance container 20 and the load locking room 30, the peristome of the atmospheric environment between conveyance container 20 and each process cavity 10a, 10b, the 10c and the load locking room 30 and the outside, insert gas-tight seal respectively between them and the gate valve 22 that can constitute with opening and closing.
Arranged outside at load locking room 30 has two cartridge dispenser 41, and mounting has the box body 40 of accommodating substrate S respectively in the above.In one of them of these box bodys 40, for example can accommodate untreatment base, among another, accommodate treatment substrate.These box bodys 40 can carry out lifting by elevating mechanism 42.
Between these two box bodys 40, brace table 44 is provided with base board delivery device 43, and this base board delivery device 43 possesses and is arranged on bilevel pick- up 45,46 and can makes their turnover keep out of the way and support rotatably their pedestal 47 integratedly.
For above-mentioned process cavity 10a, 10b, 10c, its inner space can remain on specific reduced pressure atmosphere, and portion carries out plasma treatment, for example etch processes or annealing in process etc. within it.Like this, owing to have three process cavity, therefore, for example can be with two process cavity wherein as the structure of etch process chamber, with the structure of a remaining process cavity as annealing chamber, perhaps, with three process cavity all as the structure of etch process chamber of carrying out same processing or annealing chamber.In addition, the quantity of process cavity is not limited to three, also can be more than four.
For carrying room 20.It is identical with vacuum processing chamber, can remain on specific reduced pressure atmosphere, and as shown in Figure 2, portion is equipped with carrying device 50 within it.In addition, by this carrying device 50, conveyance substrate S between load locking room 30 and three process cavity 10a, 10b, 10c.About carrying device 50, describe in detail in the back.
For each structure portion of plasma treatment appts 1, itself and control part 60 are formed by connecting and are controlled structure (omitting diagram among Fig. 1).The brief description of expression control part 60 among Fig. 3.Control part 60 comprises the machining control device 61 with CPU, and this machining control device 61 is connected with keyboard of input operation that process management person instructs in order to manage plasma treatment appts 1 etc. or the user interface 62 that is made of display of the working condition of visualization display plasma treatment appts 1 etc.
In addition, control part 60 has stored record and is used for the storage part 63 that control by machining control device 61 realizes the handling procedure of the control program (software) of the various processing that plasma treatment appts 1 is carried out or treatment conditions data etc., and this storage part 63 is connected on the machining control device 61.
In addition, as required, access handling procedure arbitrarily from storage part 63, carry out, like this, under the control of machining control device 61, carry out the processing of the expectation on the plasma treatment appts 1 by machining control device 61 by the indication of sending etc. from user interface 62.
Handling procedures such as above-mentioned control program or treatment conditions data, can utilize and be stored in for example data of states such as CD-ROM, hard disk, disk, flash memories of computer read/write memory medium, perhaps, utilize, for example transmit at any time and carry out online utilization by special circuit from other devices.
Below, the carrying device 50 of detailed description carrying room 20.
Fig. 4 is the vertical cross-section diagram of this carrying device 50 of expression, and Fig. 5 is the stereogram of this conveyance unit of expression.This carrying device 50 has conveyance unit 501 that carries out the conveyance action and the elevating mechanism 502 that makes 501 liftings of conveyance unit.
Upper strata transport mechanism portion 510 comprises: base portion 511, be slidably disposed on the base portion 511 travelling arm 512 and as being slidably disposed on the slip pick-up 513 of the brace table that is used for supporting substrate on this travelling arm 512.In addition, on the side arm of travelling arm 512, be provided with and be used for slide relative arm 512 and make the guide rail 515 that slip pick-up 513 slides and be used for the guide rail 516 that relative base portion 511 is slided travelling arm 512.In addition, on pick-up 513, be provided with the slide block 517 that slides along guide rail 515, on base portion 511, be provided with the slide block 518 that slides along guide rail 516.
Hypomere transport mechanism portion 520 comprises: base portion 521, be slidably disposed on the base portion 521 travelling arm 522 and as being slidably disposed on the slip pick-up 523 of the brace table that is used for supporting substrate on this travelling arm 522.In addition, on the side arm of travelling arm 522, be provided with and be used for slide relative arm 522 and make the guide rail 525 that slip pick-up 523 slides and be used for the guide rail 526 that relative base portion 521 is slided travelling arm 522.In addition, on pick-up 523, be provided with the slide block 527 that slides along guide rail 525, on base portion 521, be provided with the slide block 528 that slides along guide rail 526.
Base portion 511 and base portion 521 link by linking part 531 and 532, constitute box-like support portion 530 by base portion 511,521, linking part 531,532, this box-like support portion 530 can be rotatably set on the supporting bracket 551 described later, be rotated by box-like support portion 530, top transport mechanism portion 510 and bottom transport mechanism portion 520 are rotated.Three cylinder rotating shafts 540 of coaxial shape configuration extend to the below of the base plate 201 of carrying room 20 from the bottom of box-like support portion 530, are connecting drive division 541 in its lower end.In drive division 541, be built-in with the travelling arm 512 and the driving mechanism of the driving mechanism of slip pick-up 513, the travelling arm 522 that drives hypomere transport mechanism 520 and slip pick-up 523 and the rotary drive mechanism (all not shown) that makes 530 rotations of box-like support portion that drive epimere transport mechanism 510, the actuating force of these driving mechanisms passes to each several part by three cylinder rotating shafts 540.Wherein, drive division 541 is configured in the positive upper/lower positions of lifter plate 553 described later.From the base plate 201 of cylinder rotating shaft 540 to be provided with bellows 543 around the lower part as sealing mechanism.In addition, sealed by magnet fluid sealing 542 between cylinder rotating shaft 540 and the lifter plate described later 553.
In hypomere transport mechanism 520, from a plurality of pulleys and volume extension thereon the transmission such as band of power by being built in travelling arm 522 that driving mechanism sends, in view of the above, travelling arm 522 and slip pick-up 523 slide point-blank.At this moment, by adjusting the diameter ratio of pulley, for the mobile stroke of travelling arm 522, can enlarge the mobile stroke of slip pick-up 523, reply large substrate easily becomes.
In top transport mechanism 510, the Poewr transmission mechanism transmission of power from driving mechanism by constituting by pulley that is built in base portion 521, linking part 531, base portion 511 and band etc., and, by a plurality of pulleys and the transmission such as band thereon of volume extension that is built in travelling arm 512, in view of the above, travelling arm 512 and slip pick-up 513 slide point-blank.Identical with hypomere transport mechanism 520, by adjusting the diameter ratio of pulley,, can enlarge the mobile stroke of slip pick-up 513 with respect to the mobile stroke of travelling arm 522.
Elevating mechanism 502 comprises: the below of liftably supporting the lifting platform 550 of conveyance unit 501 and being arranged on the base plate 201 of carrying room 20, and by the ball screw framework 560 of lifting platform 550 lifting conveyance unit 501.
Ball screw framework 560 has three (only two of diagrams) ball-screws 561 that extend downwards below base plate 201.The below of base plate 201 is a belfry, is provided with base framework 202 at foot, and the lower end of ball-screw 561 connects this base framework 202 and is provided with.Base framework 202 is provided with engine 562.Extend the axial below of this engine 562, and the tip of the axis is installed on the pulley 563.In addition, the lower end of each ball-screw 561 is provided with pulley 564, and volume hangs with and is with 565 on the pulley 564 of the pulley 563 of engine 562 and each ball-screw 561, and by the driving of engine 562, each ball-screw 561 is rotated.
Lifting platform 550 comprises: four rotating shafts 552 that support the supporting bracket 551 of box-like support portion 530, extend to the below of supporting bracket 551 and the lower end of supporting rotating shaft 552 also are screwed on the lifter plate 553 that carries out lifting on above-mentioned three each ball-screws 561.In addition, make each ball-screw 561 rotation by engine 562, like this, lifter plate 553 is directed rotating shaft 566 guiding by slide block 567 and carries out lifting, accompanies with it, and the conveyance unit 501 on the supporting bracket 551 carries out lifting, when lifter plate 553 is positioned at the solid line position of Fig. 4, conveyance unit 501 is positioned at topmost, and when lifter plate 553 was positioned at two pecked lines, conveyance unit 501 was positioned at foot.In addition, around the rotating shaft 552 between base plate 201 and the lifter plate 553, be provided with bellows 554 as sealing mechanism.
For carrying device 50, on the position shown in the dotted line A of Fig. 4, can cut apart, when maintenance, superstructure 500A more than dotted line A, under the state that the lid that can open and close 202 that is provided with on the top of as shown in Figure 6 carrying room 20 is opened, can be sling above carrying room 20 and taken out of by hoisting equipment, the substructure 500B below dotted line A can take out of by the downside of load locking room as described below 30.Wherein, in elevating mechanism 502, the drive division of engine 562 grades also can be placed on the top of elevating mechanism 502.
Below, load locking room 30 is described.
Fig. 7 is the front elevation of load locking room 30, and Fig. 8 is its longitudinal section, and Fig. 9 is its stereogram.Load locking room is two-layer substrate reception room 31a and the 31b of being provided with about in the of 30 minutes, and the centre is separated by dividing plate 34.In this substrate reception room 31a, 31b, be respectively formed at opening 301a, the 301b of atmosphere one side and at opening 302a, the 302b of carrying room one side.In addition, the top of top substrate layer reception room 31a becomes lid 303, and as shown in Fig. 8 and Fig. 9, this lid 303 can be opened from the mediad both sides as rotating shaft with the hinge 304 that is arranged on opening part.In addition, the bottom wall portion of following laminar substrate reception room 31b becomes lid 305, makes this lid 305 move down the state that becomes unlatching by switching mechanism 400.Load locking room 30 is placed on the framework pallet 306, and switching mechanism 400 makes lifting in the space of lid 305 in framework pallet 306.Then, load locking room 30 and switching mechanism 400 constitute load-lock chamber unit.Wherein, the switching of lid 303 and lid 305 part is all sealed by the encapsulant that does not show among the figure.
The inside of load locking room 30 can vacuumize by the exhaust gear that does not show among the figure, also is provided with the inert gas feed mechanism that does not show among the figure, can promptly turn back to atmospheric pressure from the state that keeps vacuum.
In load locking room 30, on dividing plate 34, be provided with and be used for a plurality of buffers 32 of in substrate reception room 31a supporting substrate S, what form carrying arm between these buffers 32 withdraws from groove 32a.In addition, also be provided with on the lid 305 of following laminar substrate reception room 31b and be used for a plurality of buffers 32 of in laminar substrate reception room 31b down supporting substrate S, what form carrying arm between these buffers 32 withdraws from groove 32a.And the base plate supports face of each buffer 32 is provided with a plurality of orbicules 308, makes that substrate can move smoothly when substrate S locatees, and can position easier position to substrate S.
In substrate reception room 31a, 31b, near the bight that rectangular substrate S faces toward mutually, be provided with locator 33, each limit of pushing down substrate S makes its location.The compressing member of each locator 33 is moved by the electric hydaulic cylinder 307 on the sidewall that is arranged on load locking room 30.
Below, based on above-mentioned Fig. 7 and Figure 10, the switching mechanism 400 of the lid 305 that is used for opening and closing substrate reception room 31b is described.
This switching mechanism 400 comprises: be vertically set on four jiaos of four ball-screw 401a～401d that locate by following framework pallet 306 partitioning portions of load locking room 30 respectively; Combine by screw thread with ball-screw 401a～401d respectively, when supporting lid 305, the Lift Part 402 of lifting along with the rotation of ball-screw 401a～401d; Guide the straight line guide member 403 of each Lift Part 402; Be used for driving the engine 404 of ball-screw 401 rotations; And the actuating force of engine 404 is delivered to four Poewr transmission mechanisms 405 on the ball-screw 401.
Poewr transmission mechanism 405 comprises: have the gear box 411 that the actuating force of engine 404 is delivered to the gear on the nearest ball-screw 401a; Contain the power distribution that to transmit by gear box 411 to the adjacent ball-screw 401b and the gear box 412 of the gear on the ball-screw 401d; Will be by the transmission of power of the gear transmission in the gear box 412 power transmission shaft 413 to the ball-screw 401b; Will be by the transmission of power of the gear transmission in the gear box 412 power transmission shaft 414 to the ball-screw 401d; Contain and to give the gear box 415 of the gear on ball-screw 401b and the ball-screw 401c by the power distribution that power transmission shaft 413 transmits; Contain the gear box 416 of the transmission of power that will transmit by gear box 415 gear to the ball-screw 401b; Will be by the transmission of power of the gear transmission in the gear box 415 power transmission shaft 417 to the ball-screw 401c; Contain the transmission of power that to transmit by power transmission shaft 417 gear box 418 to the ball-screw 401c; Contain the transmission of power that to transmit by gear box 418 gear box 419 to the gear of ball-screw 401c; Contain the gear box 420 of the transmission of power that will transmit by power transmission shaft 414 gear to the ball-screw 401d; And the gear box 421 that contains the transmission of power that to transmit by gear box 420 gear to the ball-screw 401d.
In switching mechanism 400, owing to be to descend by lid 305 to coming opening cover 305, so the space can fully guarantee under maintenance in the laminar substrate reception room 31b time in lifting support component 402 upper supports that make ball-screw 401a～401d rotation.
In addition, because four jiaos in load locking room 30 following parts are provided with ball-screw 401a～401d and line slideway 403, and engine 404 is placed in beyond the following zone of load locking room 30, so, under lid 305 closing state, the space 310 that formation is very big below load locking room 30.And, be used for the axle of transferring power 413,414,417 can both unload.Thereby, just can effectively utilize these spaces by unloading these axles.In the present embodiment, as described in below, can utilize the passage of this space as the substructure of taking out of the carrying device 50 in the carrying room 20.
Below, the as above action of the plasma processing apparatus 1 of structure is described.
At first, two pick- ups 45,46 of conveyance structure 43 are driven forward-reverse, from the side's that contains untreatment base box body 40 two plate base S are moved into the reception room of two-layer substrate up and down 31a, the 31b of load locking room 30.
Pick- up 45,46 retreats, and then, closes the gate valve 22 that load locking room 30 leads to atmosphere.After this, discharge the gas in the load locking room 30, with inner pressure relief to stipulating vacuum degree.After vacuumizing end, push down substrate by locator 33, make the location positioning of substrate S.
After locating as mentioned above, open the gate valve 22 between carrying room 20 and the load locking room 30, accept to be housed in the substrate S in the substrate reception room 31 of load locking room 30 by the carrying devices in the carrying room 20 50, move into any one among treatment chamber 10a, 10b, the 10c.In addition, the S of treatment substrate in treatment chamber 10a, 10b, 10c is taken out of by carrying device 50, via load locking room 30, is taken in the box body 40 by conveyance structure 43.At this moment, also can return in the original box body 40, also can take in other the box body 40.
In addition, when from load locking room 30, taking out of substrate S, the slip pick-up 513 of the upper strata conveyance structure 510 in carrying device 50 and/or the slip pick-up of lower floor's conveyance structure 520 523 insert in the load locking room 30, receive substrate S by slip pick-up 513 and/or 523.Slip pick-up 513 and/or 523 is delivered to the substrate S that receive among treatment chamber 10a, 10b, the 10c any one.At this moment,, in treatment chamber, have under the situation that the substrate handled well exists, can its substrate S be taken out of and will move in the treatment chamber being positioned over another substrate S above slip pick-up by a slip pick-up if move into substrate S.The substrate S that handled is slided after pick-up 513 and/or 523 receives, and is delivered in the load locking room 30.
When as above carrying out conveyance by the carrying device in the carrying room 20 50, make upper strata conveyance structure 510 or 520 rotations of lower floor's conveyance structure by rotary drive mechanism through box-like support portion 530, make their location.In addition, because have the relation of bilevel transport mechanism portion 510,520, so the lifting action of the 502 pairs of conveyance unit 501 of lifting unit by carrying device 50 makes the height and position location of slip pick-up.
At above positioning stage, advancing or retreating substrate S is carried out conveyance by travelling arm 512,522, slip pick-up 513,523.
In the plasma processing apparatus 1 that as above moves, when the inside of load locking room 30 is keeped in repair, make the ball-screw 401a～401d rotation that is arranged on four jiaos of load locking room 30 lower areas by engine 404 and Poewr transmission mechanism 405, thereby the lid 305 by four jiaos of lifting support component 402 supports is descended.As shown in Figure 11 (a), by like this, make lid 305 carry out straight line and descend, lid 305 is separated fully with load locking room 30, can guarantee enough service clearance M.
As opening and closing the method for the lid of laminar substrate reception room 31b down, can use the end as shown in Figure 11 (b) to be rotated the method that lid 305a " is singly opened ", also can consider to use the method that makes lid 305b " two opening " as shown in Figure 11 (c) as rotating shaft with a side.But the former can not open lid 305a fully, is difficult to guarantee enough service clearances.If the lid 305a of this spline structure is opened fully, framework pallet 306 just must improve, but is wishing that this is unpractical under the present situation of equipment miniaturization.In addition, though the latter can not produce such problem, when opening lid 305b, stop and make the operability variation owing to passage is subjected to two places.In contrast, as present embodiment, move the lid of opening 305 owing to be provided with downward straight line, and such problem can not take place.
In addition, though prior art also adopted the downward straight line of lid of the following laminar substrate reception room 31b that makes load locking room 30 to move the method for opening, but prior art is such as shown in Figure 12, under lid 305, be provided with a switching mechanism 400a lid 305 liftings are opened and closed, below load locking room 30, do not have wide space.
In contrast, in the present embodiment, be configured to open and close the ball-screw 401a～401d and the line slideway 403 of the switching mechanism 400 of lid 305, be arranged on four jiaos of zone below the load locking room 30, because engine 404 is arranged on outside the spatial dimension that load locking room 30 forms below, so, under lid 305 closing state, below load locking room 30, have wide space 310.And the axle 413,414,417 that in addition is used for transferring power especially can both unload.Thereby,, and can effectively utilize this space 310 by taking off these axles.
In the present embodiment, utilize the take out of passage of this space as the substructure 500B of the carrying device 50 in the carrying room 20.As mentioned above, in the present embodiment, part that can with dashed lines A is divided into superstructure 500A and substructure 500B with carrying device 50, above carrying room 20, utilize hoisting equipment only to hang out the superstructure 500A of carrying device 50, and as shown in Figure 13, unload the axle 414 in the Poewr transmission mechanism 405 that is arranged on the switching mechanism 400 below the load locking room 30, guarantee the space of substructure 500B below the bottom process load locking room 30 of carrying room 30 taken out of the passage of outside, the substructure of carrying device 50 is taken out of the outside by this conveyance passage.
Like this, as the structure of cutting apart carrying device 50, just superstructure 500A is sling from above and take out of with hoisting equipment, substructure 500B also can use hoisting equipment to sling and take out of, if do not consider the restriction of room height, carrying device 50 can be fetched into the outside.
Wherein, the present invention is not limited to above-mentioned execution mode, and all distortion can be arranged.For example, in the above-described embodiment,, used at four jiaos of the lower region thereof ball-screws that are provided with etc., still, just be not limited thereto as long as can take out of the substructure of carrying device in order to form the following space of load locking room.In addition, the space below the load locking room in load-lock chamber unit also is not limited to take out of the substructure of carrying device, and it can be used for the various purposes such as maintenance of various other parts.
Claims (10)
1. a substrate board treatment is characterized in that, comprising:
In a vacuum substrate is implemented the process chamber of predetermined processing; And
Be connected with described process chamber, be held in a vacuum, and have the carrying room of in described process chamber, moving into the carrying device of substrate,
Described carrying device can be divided into superstructure and substructure, and described superstructure can be taken out of outside the substrate board treatment from the top of described carrying room, and described substructure can be taken out of outside the substrate board treatment from the downside of described carrying room.
2. substrate board treatment as claimed in claim 1 is characterized in that:
Described carrying room has the lid that can open and close at an upper portion thereof, the described superstructure of described carrying device, can open taken out of under the state of this lid described carrying room above.
3. substrate board treatment as claimed in claim 1 or 2 is characterized in that:
In described carrying device, described superstructure include be arranged in the described carrying room, supporting substrate and the conveyance unit that carries out conveyance, described substructure comprises the mechanism that is used to make described conveyance unit lifting, is arranged on the downside of described carrying room.
4. substrate board treatment as claimed in claim 1 is characterized in that, comprising:
Be arranged on described carrying room and between the substrate accommodation container of atmospheric side, and atmospheric side between be maintained at during transferring substrates near the atmospheric pressure, and described carrying room between be maintained at load locking room under the vacuum state during transferring substrates,
Described substructure can be from the downside of described carrying room, and take out of outside the substrate board treatment in the space of the below by described load locking room.
5. substrate board treatment as claimed in claim 4 is characterized in that:
Described load locking room comprises:
Be arranged on the bottom lid that can open and close of bottom; With
Make the switching mechanism of described bottom cover body opening/closing, wherein,
Described switching mechanism comprises:
Be separately positioned on a plurality of ball-screws of corner portion of the following side space of described load locking room;
Be screwed with ball-screw respectively, support described bottom lid and the lifting support component of lifting along with the rotation of ball-screw;
Be arranged on the following side space outside of described load locking room, be used to make the driving mechanism of described ball-screw rotation; And
Have the Poewr transmission mechanism that the actuating force of described driving mechanism is passed to the power transmission shaft that can freely load and unload of described ball-screw, wherein,
When described bottom lid is closed, form the space that the described substructure of described carrying device can be passed through at the lower position of described load locking room, by unload described power transmission shaft with the described substructure of described carrying device by the following side space of described load locking room conveyance outside described substrate board treatment.
6. substrate board treatment as claimed in claim 5 is characterized in that:
Described load locking room has bilevel substrate reception room, and described lower cover body can use when described following laminar substrate reception room keeps in repair.
7. the method for taking out of of a carrying device is that the carrying device of in substrate board treatment described carrying device being taken out of outside the described substrate board treatment is taken out of method, and wherein, described carrying device comprises:
In a vacuum substrate is implemented the process chamber of predetermined processing; With
Be connected with described process chamber, be held in a vacuum, and comprise the carrying room of substrate being moved into the carrying device in the described process chamber, it is characterized in that:
Described carrying device can be divided into superstructure and substructure, when above described carrying room, taking out of described superstructure outside the substrate board treatment, described substructure be taken out of outside the substrate board treatment from the downside of described carrying room.
8. carrying device as claimed in claim 7 is taken out of method, it is characterized in that:
Described carrying room has the lid that can open and close at an upper portion thereof, the described superstructure of described carrying device, can taken out of under the state of this Cover opening described carrying room above.
9. the carrying device described in claim 7 or 8 is taken out of method, it is characterized in that:
Described superstructure is arranged in the described carrying room, comprises to support the also conveyance unit of conveyance substrate, and described substructure comprises the mechanism that is used to make described conveyance unit lifting, is arranged on the downside of described carrying room.
10. carrying device as claimed in claim 7 is taken out of method, it is characterized in that:
Described carrying device comprises between the substrate accommodation container that is arranged on described carrying room and atmospheric side, and atmosphere between during transferring substrates, be maintained near the atmospheric pressure, and described carrying room between be held the load locking room of vacuum state during transferring substrates,
Take out of described substructure outside the substrate board treatment from the downside of described carrying room in space by described load locking room below.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-255291 | 2005-09-02 | ||
| JP2005255291A JP4754304B2 (en) | 2005-09-02 | 2005-09-02 | Substrate processing apparatus, load lock chamber unit, and carrying-out method of transfer apparatus |
| JP2005255291 | 2005-09-02 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101289245A Division CN100458515C (en) | 2005-09-02 | 2006-09-04 | Substrate processing device, load locking chamber unit and moving method for conveyer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101359588A true CN101359588A (en) | 2009-02-04 |
| CN101359588B CN101359588B (en) | 2010-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101289245A Active CN100458515C (en) | 2005-09-02 | 2006-09-04 | Substrate processing device, load locking chamber unit and moving method for conveyer |
| CN2008101451421A Active CN101359588B (en) | 2005-09-02 | 2006-09-04 | Substrate processing apparatus, load-lock chamber unit, and method of carrying out a transfer device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101289245A Active CN100458515C (en) | 2005-09-02 | 2006-09-04 | Substrate processing device, load locking chamber unit and moving method for conveyer |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4754304B2 (en) |
| KR (1) | KR100830730B1 (en) |
| CN (2) | CN100458515C (en) |
| TW (1) | TWI417978B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103765571A (en) * | 2012-01-10 | 2014-04-30 | 株式会社日立高新技术 | Vacuum processing device |
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| JP4903728B2 (en) * | 2008-01-11 | 2012-03-28 | 株式会社アルバック | A transfer chamber in which a transfer robot is installed and a maintenance method thereof. |
| US20090194026A1 (en) * | 2008-01-31 | 2009-08-06 | Burrows Brian H | Processing system for fabricating compound nitride semiconductor devices |
| JP4993614B2 (en) * | 2008-02-29 | 2012-08-08 | 東京エレクトロン株式会社 | Teaching method for conveying means, storage medium, and substrate processing apparatus |
| JP5190303B2 (en) * | 2008-06-04 | 2013-04-24 | 東京エレクトロン株式会社 | Conveying device and processing device |
| KR20100136711A (en) * | 2009-06-19 | 2010-12-29 | 주식회사 테라세미콘 | Apparatus for transferring substrate in large area substrate treating system |
| EP2315236B1 (en) | 2009-10-22 | 2014-05-14 | VAT Holding AG | Flap transfer valve |
| JP5425656B2 (en) * | 2010-02-15 | 2014-02-26 | 東京エレクトロン株式会社 | Substrate processing apparatus and load lock apparatus |
| WO2011161888A1 (en) * | 2010-06-21 | 2011-12-29 | 株式会社アルバック | Transfer apparatus and method for manufacturing transfer apparatus |
| KR101136728B1 (en) * | 2010-10-18 | 2012-04-20 | 주성엔지니어링(주) | Apparatus for treating substrate and method of disassembling and assembling the same |
| KR101136729B1 (en) * | 2011-10-20 | 2012-04-19 | 주성엔지니어링(주) | Means for opening and closing apparatus for treating substrate |
| JP2013126707A (en) * | 2011-12-19 | 2013-06-27 | Yaskawa Electric Corp | Robot and robot installation method |
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-
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- 2006-09-01 TW TW095132467A patent/TWI417978B/en not_active IP Right Cessation
- 2006-09-04 CN CNB2006101289245A patent/CN100458515C/en active Active
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| CN103765571A (en) * | 2012-01-10 | 2014-04-30 | 株式会社日立高新技术 | Vacuum processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200715450A (en) | 2007-04-16 |
| KR20070026220A (en) | 2007-03-08 |
| KR100830730B1 (en) | 2008-05-20 |
| CN1924660A (en) | 2007-03-07 |
| CN101359588B (en) | 2010-08-11 |
| CN100458515C (en) | 2009-02-04 |
| TWI417978B (en) | 2013-12-01 |
| JP2007073540A (en) | 2007-03-22 |
| JP4754304B2 (en) | 2011-08-24 |
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