MY162382A - Method and device for supplying and discharging carries with elecronic components - Google Patents

Method and device for supplying and discharging carries with elecronic components

Info

Publication number
MY162382A
MY162382A MYPI20061950A MYPI20061950A MY162382A MY 162382 A MY162382 A MY 162382A MY PI20061950 A MYPI20061950 A MY PI20061950A MY PI20061950 A MYPI20061950 A MY PI20061950A MY 162382 A MY162382 A MY 162382A
Authority
MY
Malaysia
Prior art keywords
supplying
processing station
components
elecronic
electronic components
Prior art date
Application number
MYPI20061950A
Inventor
Driel Albertus Franciscus Gerardus Van
Johannes Lambertus Gerardus Maria Venrooij
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of MY162382A publication Critical patent/MY162382A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Abstract

THE INVENTION RELATES TO METHODS FOR DISPLACING A CARRIER (2,32,57,60,65,74) WITH ELECTRONIC COMPONENTS (75) FROM A SUPPLY CONTAINER (73) TO A PROCESSING STATION (20,31,71,72), METHODS FOR DISPLACING A CARRIER (2,32,57,60,65,74) WITH ELECTRONIC COMPONENTS (75) FROM A PROCESSING STATION (20,31,71,72) TO A SUPPLY CONTAINER (73), AS WELL AS TO METHODS FOR SUPPLYING TO A PROCESSING STATION (20,31,71,72) AND DISCHARGING FROM A PROCESSING STATION (20,31,71,72) OF CARRIERS WITH ELECTRONIC COMPONENTS (75). THE INVENTION ALSO RELATES TO DEVICES (30,50,70,85) FOR DISPLACING A CARRIER (2,32,57,60,65,74) WITH ELECTRONIC COMPONENTS (75) BETWEEN A SUPPLY CONTAINER (73) AND A PROCESSING STATION (20,31,71,72), AND TO AN ASSEMBLY OF SUCH DEVICES (30,50,70,85) WITH A PROCESSING STATION (20,31,71,72) FOR CARRIERS WITH ELECTRONIC COMPONENTS (75). THE MOST ILLUSTRATIVE DRAWING IS
MYPI20061950A 2005-04-29 2006-04-27 Method and device for supplying and discharging carries with elecronic components MY162382A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1028907A NL1028907C2 (en) 2005-04-29 2005-04-29 Method and device for supplying and removing carriers with electronic components.

Publications (1)

Publication Number Publication Date
MY162382A true MY162382A (en) 2017-06-15

Family

ID=35756366

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20061950A MY162382A (en) 2005-04-29 2006-04-27 Method and device for supplying and discharging carries with elecronic components

Country Status (6)

Country Link
KR (1) KR101236878B1 (en)
CN (1) CN101167172B (en)
MY (1) MY162382A (en)
NL (1) NL1028907C2 (en)
TW (1) TWI453847B (en)
WO (1) WO2007001179A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6804409B2 (en) * 2017-08-04 2020-12-23 Ｔｏｗａ株式会社 Resin molding equipment and resin molded product manufacturing method
TWI671847B (en) * 2018-02-09 2019-09-11 鴻勁精密股份有限公司 Electronic component working equipment
DE102018205926B3 (en) * 2018-04-18 2019-08-29 Asm Assembly Systems Gmbh & Co. Kg Loading device, assembly system and method for assembling SMT circuit boards with SMT components
JP7068094B2 (en) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 Work transfer device, resin transfer device and resin molding method
KR20220090156A (en) * 2020-12-22 2022-06-29 (주)테크윙 Apparatus for delivering electronic component and handler for testing electronic components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128940A (en) * 1981-02-04 1982-08-10 Sony Corp Heat treating method for substrate
DE3789212T2 (en) * 1986-12-19 1994-06-01 Applied Materials Inc Integrated processing system with multi-chamber.
JPH0783899B2 (en) * 1987-09-30 1995-09-13 三菱重工業株式会社 How to drive a roller leveler
TW257745B (en) * 1993-07-22 1995-09-21 Towa Kk
NL9401930A (en) * 1994-11-18 1996-07-01 Fico Bv Modular enclosure.
NL1003366C2 (en) * 1996-06-18 1997-12-19 Fico Bv Apparatus and method for encapsulating products.
US6069342A (en) * 1996-12-18 2000-05-30 Texas Instruments Incorporated Automated multiple lead frame strip radiant die attach material curing apparatus
US6468353B1 (en) * 1997-06-04 2002-10-22 Applied Materials, Inc. Method and apparatus for improved substrate handling
WO2004046416A1 (en) * 2002-11-15 2004-06-03 Unaxis Balzers Ag Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates
CN100410750C (en) * 2003-06-17 2008-08-13 友达光电股份有限公司 Carrying and inverting platform
NL1028824C2 (en) * 2005-04-20 2006-10-23 Fico Bv Method and device for moving electronic components arranged in a rectangular structure.

Also Published As

Publication number Publication date
KR20080005447A (en) 2008-01-11
NL1028907C2 (en) 2006-10-31
TWI453847B (en) 2014-09-21
CN101167172A (en) 2008-04-23
KR101236878B1 (en) 2013-02-26
TW200727383A (en) 2007-07-16
CN101167172B (en) 2010-05-19
WO2007001179A2 (en) 2007-01-04
WO2007001179A3 (en) 2007-08-16

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