IN2012DN05096A - - Google Patents

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Publication number
IN2012DN05096A
IN2012DN05096A IN5096DEN2012A IN2012DN05096A IN 2012DN05096 A IN2012DN05096 A IN 2012DN05096A IN 5096DEN2012 A IN5096DEN2012 A IN 5096DEN2012A IN 2012DN05096 A IN2012DN05096 A IN 2012DN05096A
Authority
IN
India
Prior art keywords
encapsulated
circuit
protective material
protecting
electrical
Prior art date
Application number
Inventor
Stephan Mazingue-Desailly
Michaei Mueller
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IN2012DN05096A publication Critical patent/IN2012DN05096A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Abstract

A circuit module (10) having a circuit carrier (12), at least one circuit (14) mounted on the circuit carrier (12), which is encapsulated by a protective material (16), and at least one electrical/electronic component (18) encapsulated by a protective coating (20) protecting the at least one electricalfelectronic component (18) from the protective material (16). In an embodiment, the protective coating (20) protecting the at least one electrical/electronic component (1 8) is only partially encapsulated by the protective material (1 6).
IN5096DEN2012 2009-12-08 2010-12-07 IN2012DN05096A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009047681A DE102009047681A1 (en) 2009-12-08 2009-12-08 Circuit module and method for producing such a circuit module
PCT/EP2010/069072 WO2011070015A2 (en) 2009-12-08 2010-12-07 Circuit module and method for producing such a circuit module

Publications (1)

Publication Number Publication Date
IN2012DN05096A true IN2012DN05096A (en) 2015-10-09

Family

ID=43534330

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5096DEN2012 IN2012DN05096A (en) 2009-12-08 2010-12-07

Country Status (8)

Country Link
US (1) US9462696B2 (en)
EP (1) EP2510762B1 (en)
JP (1) JP5638088B2 (en)
CN (1) CN102668732B (en)
DE (1) DE102009047681A1 (en)
ES (1) ES2460625T3 (en)
IN (1) IN2012DN05096A (en)
WO (1) WO2011070015A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015207310A1 (en) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Electronic module and method for encapsulating the same
JP6598511B2 (en) * 2015-05-21 2019-10-30 キヤノン株式会社 Power supply device and image forming apparatus
JP6464984B2 (en) * 2015-10-13 2019-02-06 株式会社デンソー Electronic equipment
DE102015225099A1 (en) * 2015-12-14 2017-06-14 Robert Bosch Gmbh Electronic module, in particular for transmission control unit, and method for manufacturing such
CN112557710A (en) * 2020-12-28 2021-03-26 武汉光迅科技股份有限公司 Test fixture and test device for optical device
US11916489B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter
US11916488B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter
US11916005B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter and method for manufacturing the same
US11916490B2 (en) 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter
US20220256700A1 (en) * 2021-02-10 2022-08-11 Innoscience (Suzhou) Technology Co., Ltd. MULTI-FUNCTIONAL PCB FOR ASSEMBLING GaN-BASED POWER CONVERTER
CN114006539B (en) * 2021-02-10 2022-10-28 英诺赛科(苏州)科技有限公司 High efficiency high density GaN-based power converter

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121514A (en) 1985-11-22 1987-06-02 Mitsubishi Electric Corp Diagnostic system for numerical controller
JPS62121514U (en) * 1986-01-24 1987-08-01
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US5001548A (en) * 1989-03-13 1991-03-19 Coriolis Corporation Multi-chip module cooling
DE4129238A1 (en) * 1991-09-03 1993-03-04 Bosch Gmbh Robert ELECTRICAL DEVICE, ESPECIALLY SWITCHING AND CONTROL UNIT FOR MOTOR VEHICLES
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
DE19626083C2 (en) * 1996-06-28 2000-03-23 Siemens Ag Sensor component
FI963872A (en) * 1996-09-27 1998-03-28 Jari Ruuttu Protective device to protect the electrical equipment from environmental conditions
JP2001102714A (en) 1999-09-30 2001-04-13 Yazaki Corp Resin encapsulated printed wiring board
JP2001293752A (en) 2000-04-10 2001-10-23 Denso Corp Method for insert molding for resin
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
NL1016549C2 (en) * 2000-10-06 2002-04-10 Stork Screens Bv Method for the production of a card protected against interference radiation with a printed circuit.
US6900383B2 (en) 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
DE10252755A1 (en) 2002-11-13 2004-05-27 Robert Bosch Gmbh Thermal and mechanical protection of discrete components in a circuit module
JP5007562B2 (en) 2006-12-27 2012-08-22 セイコーエプソン株式会社 Manufacturing method of timepiece dial, timepiece dial and timepiece
CN201233037Y (en) * 2008-04-11 2009-05-06 浙江苏泊尔家电制造有限公司 Dustproof, insect prevention, water proof and flame proof electromagnetic oven

Also Published As

Publication number Publication date
JP2013513247A (en) 2013-04-18
ES2460625T3 (en) 2014-05-14
JP5638088B2 (en) 2014-12-10
US20130208433A1 (en) 2013-08-15
EP2510762A2 (en) 2012-10-17
DE102009047681A1 (en) 2011-06-09
WO2011070015A2 (en) 2011-06-16
CN102668732A (en) 2012-09-12
US9462696B2 (en) 2016-10-04
WO2011070015A3 (en) 2011-10-13
EP2510762B1 (en) 2014-02-26
CN102668732B (en) 2015-06-17

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