JP4683052B2 - セラミック素子 - Google Patents

セラミック素子 Download PDF

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Publication number
JP4683052B2
JP4683052B2 JP2008016637A JP2008016637A JP4683052B2 JP 4683052 B2 JP4683052 B2 JP 4683052B2 JP 2008016637 A JP2008016637 A JP 2008016637A JP 2008016637 A JP2008016637 A JP 2008016637A JP 4683052 B2 JP4683052 B2 JP 4683052B2
Authority
JP
Japan
Prior art keywords
layer
ceramic
plating
protective layer
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008016637A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009177085A (ja
Inventor
睦子 中野
恭二 小関
尚 相庭
幸弘 村上
和人 竹屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2008016637A priority Critical patent/JP4683052B2/ja
Priority to TW098103063A priority patent/TW200949867A/zh
Priority to CN2009100085136A priority patent/CN101499340B/zh
Priority to US12/359,466 priority patent/US7813104B2/en
Priority to KR1020090006543A priority patent/KR101055161B1/ko
Publication of JP2009177085A publication Critical patent/JP2009177085A/ja
Application granted granted Critical
Publication of JP4683052B2 publication Critical patent/JP4683052B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006—Thick film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
JP2008016637A 2008-01-28 2008-01-28 セラミック素子 Active JP4683052B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008016637A JP4683052B2 (ja) 2008-01-28 2008-01-28 セラミック素子
TW098103063A TW200949867A (en) 2008-01-28 2009-01-23 Ceramic element
CN2009100085136A CN101499340B (zh) 2008-01-28 2009-01-23 陶瓷元件
US12/359,466 US7813104B2 (en) 2008-01-28 2009-01-26 Ceramic element
KR1020090006543A KR101055161B1 (ko) 2008-01-28 2009-01-28 세라믹 소자

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008016637A JP4683052B2 (ja) 2008-01-28 2008-01-28 セラミック素子

Publications (2)

Publication Number Publication Date
JP2009177085A JP2009177085A (ja) 2009-08-06
JP4683052B2 true JP4683052B2 (ja) 2011-05-11

Family

ID=40899551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008016637A Active JP4683052B2 (ja) 2008-01-28 2008-01-28 セラミック素子

Country Status (5)

Country Link
US (1) US7813104B2 (enExample)
JP (1) JP4683052B2 (enExample)
KR (1) KR101055161B1 (enExample)
CN (1) CN101499340B (enExample)
TW (1) TW200949867A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230031615A (ko) * 2021-08-27 2023-03-07 삼성전기주식회사 커패시터 부품 및 커패시터 부품의 제조 방법

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5324390B2 (ja) * 2009-10-22 2013-10-23 Ｔｄｋ株式会社 積層電子部品
JP5387484B2 (ja) * 2010-04-02 2014-01-15 Ｔｄｋ株式会社 チップ部品の製造方法
JP5770539B2 (ja) * 2011-06-09 2015-08-26 Tdk株式会社 電子部品及び電子部品の製造方法
CN102982931A (zh) * 2011-09-06 2013-03-20 弗兰克·魏 电子陶瓷元件的局部涂层及其制作方法
KR101952845B1 (ko) * 2011-12-22 2019-02-28 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조 방법
JP5924543B2 (ja) * 2013-03-19 2016-05-25 株式会社村田製作所 積層セラミックコンデンサ
JP6398349B2 (ja) * 2013-08-23 2018-10-03 Tdk株式会社 積層型セラミック電子部品
TWI629696B (zh) * 2015-06-04 2018-07-11 日商村田製作所股份有限公司 Laminated ceramic electronic parts
TWI628678B (zh) 2016-04-21 2018-07-01 Tdk 股份有限公司 電子零件
KR101981466B1 (ko) * 2016-09-08 2019-05-24 주식회사 모다이노칩 파워 인덕터
KR102789017B1 (ko) * 2016-12-22 2025-04-01 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102319596B1 (ko) * 2017-04-11 2021-11-02 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102527062B1 (ko) 2017-09-21 2023-05-02 다이요 유덴 가부시키가이샤 세라믹 전자 부품 및 그 제조 방법
JP2019067793A (ja) 2017-09-28 2019-04-25 Tdk株式会社 電子部品
JP7431798B2 (ja) 2018-07-18 2024-02-15 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション バリスタパッシベーション層及びその製造方法
JP7070840B2 (ja) * 2019-03-29 2022-05-18 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP7279574B2 (ja) * 2019-08-09 2023-05-23 株式会社村田製作所 電子部品及び電子部品の製造方法
CN111491404B (zh) * 2019-10-29 2022-04-12 珠海泓星科技有限公司 一种导电片作为电极的石墨烯玻璃烧水壶
JP2021182585A (ja) * 2020-05-19 2021-11-25 太陽誘電株式会社 積層セラミック電子部品の製造方法、積層セラミック電子部品及び回路基板
KR20220074263A (ko) 2020-11-27 2022-06-03 삼성전기주식회사 적층형 커패시터
US12308172B2 (en) * 2020-12-08 2025-05-20 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor and board component having the same
JP2022170162A (ja) * 2021-04-28 2022-11-10 Tdk株式会社 電子部品
CN113265636A (zh) * 2021-05-27 2021-08-17 江苏新林芝电子科技股份有限公司 一种提高陶瓷ptc热敏元件的抗还原性的方法
JP7765255B2 (ja) * 2021-11-15 2025-11-06 Tdk株式会社 電子部品
KR20230103058A (ko) * 2021-12-31 2023-07-07 삼성전기주식회사 적층형 전자 부품
JP2023142120A (ja) * 2022-03-24 2023-10-05 パナソニックＩｐマネジメント株式会社 積層セラミック部品の製造方法及び積層セラミック部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282410A (ja) * 1986-05-30 1987-12-08 松下電器産業株式会社 電圧非直線抵抗体素子の製造方法
JP2695639B2 (ja) * 1988-01-21 1998-01-14 日本碍子株式会社 電圧非直線抵抗体の製造方法
JP2695660B2 (ja) * 1989-06-05 1998-01-14 三菱電機株式会社 電圧非直線抵抗体
JP2976250B2 (ja) * 1991-08-08 1999-11-10 株式会社村田製作所 積層型バリスタの製造方法
JP3036567B2 (ja) 1991-12-20 2000-04-24 三菱マテリアル株式会社 導電性チップ型セラミック素子及びその製造方法
JP3255799B2 (ja) * 1994-07-05 2002-02-12 松下電器産業株式会社 電子部品の製造方法
JPH09148108A (ja) * 1995-11-24 1997-06-06 Matsushita Electric Ind Co Ltd 非直線抵抗体の製造方法
JPH11219804A (ja) * 1998-01-30 1999-08-10 Mitsubishi Materials Corp 薄膜サーミスタ
JPH11251120A (ja) * 1998-03-04 1999-09-17 Murata Mfg Co Ltd 積層チップバリスタの製造方法
JP2000164406A (ja) * 1998-11-25 2000-06-16 Murata Mfg Co Ltd チップ型電子部品とその製造方法
JP4637440B2 (ja) 2002-03-18 2011-02-23 太陽誘電株式会社 セラミック素子の製造方法
JP2004088040A (ja) * 2002-08-26 2004-03-18 Maruwa Co Ltd チップ状バリスタの製造方法
KR100564930B1 (ko) * 2002-10-29 2006-03-30 티디케이가부시기가이샤 칩 형상 전자 부품 및 그 제조 방법
JP2007242995A (ja) * 2006-03-10 2007-09-20 Matsushita Electric Ind Co Ltd 積層セラミック電子部品とその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230031615A (ko) * 2021-08-27 2023-03-07 삼성전기주식회사 커패시터 부품 및 커패시터 부품의 제조 방법
KR102895351B1 (ko) * 2021-08-27 2025-12-04 삼성전기주식회사 커패시터 부품 및 커패시터 부품의 제조 방법

Also Published As

Publication number Publication date
CN101499340B (zh) 2011-09-21
KR20090082869A (ko) 2009-07-31
KR101055161B1 (ko) 2011-08-08
TW200949867A (en) 2009-12-01
JP2009177085A (ja) 2009-08-06
US7813104B2 (en) 2010-10-12
US20090191418A1 (en) 2009-07-30
CN101499340A (zh) 2009-08-05
TWI364043B (enExample) 2012-05-11

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