JP4637428B2 - 銅材料の表面上に無機被覆層を形成するための電気化学的方法 - Google Patents

銅材料の表面上に無機被覆層を形成するための電気化学的方法 Download PDF

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JP4637428B2
JP4637428B2 JP2001527022A JP2001527022A JP4637428B2 JP 4637428 B2 JP4637428 B2 JP 4637428B2 JP 2001527022 A JP2001527022 A JP 2001527022A JP 2001527022 A JP2001527022 A JP 2001527022A JP 4637428 B2 JP4637428 B2 JP 4637428B2
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Prior art keywords
copper
layer
current density
aqueous solution
anodization
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Expired - Fee Related
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JP2001527022A
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Japanese (ja)
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JP2003510466A (ja
JP2003510466A5 (enExample
Inventor
ビッリ、アルベルト
ホーフェリンク、ステファン
プリッゲ−マイアー、ステファン
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カッパエンメエ イタリー ソシエタ ペル アチオニ
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemically Coating (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
JP2001527022A 1999-09-29 1999-09-29 銅材料の表面上に無機被覆層を形成するための電気化学的方法 Expired - Fee Related JP4637428B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT1999/000307 WO2001023646A1 (en) 1999-09-29 1999-09-29 An electrochemical method for forming an inorganic covering layer on a surface of a copper material

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010158142A Division JP5520151B2 (ja) 2010-07-12 2010-07-12 銅材料の表面上に無機被覆層を形成するための電気化学的方法

Publications (3)

Publication Number Publication Date
JP2003510466A JP2003510466A (ja) 2003-03-18
JP2003510466A5 JP2003510466A5 (enExample) 2009-06-18
JP4637428B2 true JP4637428B2 (ja) 2011-02-23

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JP2001527022A Expired - Fee Related JP4637428B2 (ja) 1999-09-29 1999-09-29 銅材料の表面上に無機被覆層を形成するための電気化学的方法

Country Status (16)

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US (1) US6749738B2 (enExample)
EP (1) EP1226289B1 (enExample)
JP (1) JP4637428B2 (enExample)
KR (1) KR20020074143A (enExample)
CN (1) CN1236109C (enExample)
AT (1) ATE261006T1 (enExample)
AU (1) AU6120999A (enExample)
CA (1) CA2386129C (enExample)
DE (1) DE69915395D1 (enExample)
DK (1) DK1226289T3 (enExample)
ES (1) ES2217812T3 (enExample)
HU (1) HU224454B1 (enExample)
PL (1) PL192904B1 (enExample)
PT (1) PT1226289E (enExample)
RU (1) RU2232212C2 (enExample)
WO (1) WO2001023646A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4870699B2 (ja) * 2008-03-10 2012-02-08 日立ビアメカニクス株式会社 銅の表面処理方法およびプリント配線板の表面処理方法
CN102157592A (zh) * 2011-01-06 2011-08-17 上海晶澳太阳能科技有限公司 一种太阳能电池组件内用导线及其加工工艺
RU2483146C1 (ru) * 2011-10-03 2013-05-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг РФ) Способ микродугового оксидирования присадочных прутков из титанового сплава для антифрикционной наплавки
ES2619427T3 (es) * 2012-10-30 2017-06-26 Hydro Aluminium Rolled Products Gmbh Banda de aluminio revestido y método de fabricación
CN103014815B (zh) * 2012-11-28 2016-05-04 常州大学 铜导线辊式快速阳极氧化处理方法
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP5870148B2 (ja) * 2013-11-27 2016-02-24 Ｊｘ金属株式会社 キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法
CA2957525A1 (en) 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Continuous coating apparatus for electroceramic coating of metal coil or wire
CA2957522A1 (en) * 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Apparatus for electroceramic coating of high tension cable wire
CN104233433B (zh) * 2014-10-03 2016-09-14 上海工程技术大学 一种制备氧化亚铜薄膜的方法
US10636924B2 (en) * 2014-11-26 2020-04-28 Sunpower Corporation Solar module interconnect
CN106410227B (zh) * 2016-12-12 2019-01-15 珠海格力电器股份有限公司 一种氧化铜及其制备方法
CN106591922B (zh) * 2017-02-05 2018-05-08 桂林理工大学 一种Cu2O纳米薄膜的制备方法
CN107177876A (zh) * 2017-05-11 2017-09-19 云南民族大学 一种电沉积制备氧化亚铜锂电池薄膜材料的方法
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN112601473B (zh) 2018-09-06 2023-02-03 Ykk株式会社 紧固件部件
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
CN113649042B (zh) * 2021-07-20 2023-10-10 青岛农业大学 光催化电极制备方法、光催化反应器及污染流体处理方法
JP7095193B1 (ja) 2022-03-29 2022-07-04 セイコーホールディングス株式会社 装飾部品及び装飾部品の製造方法
JP7685553B2 (ja) * 2022-05-31 2025-05-29 コリア インスティテュート オブ マテリアルズ サイエンス 殺菌性銅酸化物の形成方法及び殺菌性銅系物品

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GB1052729A (enExample) * 1964-10-06
US3528896A (en) * 1968-04-17 1970-09-15 Olin Corp Process for electrochemically cleaning and brightening copper alloy and brass strip
SU658187A1 (ru) * 1975-09-23 1979-04-25 Предприятие П/Я А-7186 Способ электрохимического оксидировани меди
DD131044B1 (de) * 1977-02-21 1982-11-24 Heinz Fink Verfahren zur elektrolytischen erzeugung eines oxidischen haftbelages auf kupferfolien
JPS558487A (en) * 1978-07-05 1980-01-22 Mitsubishi Electric Corp Surface treating method of copper
JPS55106670U (enExample) * 1979-01-23 1980-07-25
IL58214A (en) * 1979-09-10 1982-11-30 Yeda Res & Dev Process for the production of optically selective surfaces
JPS607038B2 (ja) * 1980-03-19 1985-02-21 積水化学工業株式会社 銅もしくは銅合金材の着色方法
JPS607037B2 (ja) * 1980-03-19 1985-02-21 積水化学工業株式会社 銅もしくは銅合金材の着色方法
JPS5831099A (ja) * 1981-08-18 1983-02-23 Furukawa Electric Co Ltd:The 銅線、条体の黒色化法
JPS63250494A (ja) * 1987-04-03 1988-10-18 Kobe Steel Ltd 黒色被膜付き銅
JPH0750566B2 (ja) * 1987-07-27 1995-05-31 古河電気工業株式会社 コイル巻線用耐熱耐酸化性導体
DD264718A1 (de) * 1987-10-22 1989-02-08 Akad Wissenschaften Ddr Verfahren zur in- situ- erzeugung einer sehr duennen korrosionsschutzschicht
JP2866697B2 (ja) * 1990-02-19 1999-03-08 臼井国際産業株式会社 銅材表面における強靭な電気絶縁層の形成方法

Also Published As

Publication number Publication date
PT1226289E (pt) 2004-07-30
CA2386129A1 (en) 2001-04-05
RU2002111346A (ru) 2004-02-27
PL354489A1 (en) 2004-01-26
HUP0203533A2 (en) 2003-05-28
PL192904B1 (pl) 2006-12-29
ES2217812T3 (es) 2004-11-01
JP2003510466A (ja) 2003-03-18
RU2232212C2 (ru) 2004-07-10
DE69915395D1 (de) 2004-04-08
CN1236109C (zh) 2006-01-11
CA2386129C (en) 2010-03-16
DK1226289T3 (da) 2004-07-12
EP1226289A1 (en) 2002-07-31
EP1226289B1 (en) 2004-03-03
KR20020074143A (ko) 2002-09-28
US20030102227A1 (en) 2003-06-05
WO2001023646A1 (en) 2001-04-05
CN1380914A (zh) 2002-11-20
ATE261006T1 (de) 2004-03-15
AU6120999A (en) 2001-04-30
US6749738B2 (en) 2004-06-15
HU224454B1 (hu) 2005-09-28

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