PT1226289E - Metodo electroquimico para formar uma camada de cobertura inorganica numa superficie de um material de cobre - Google Patents
Metodo electroquimico para formar uma camada de cobertura inorganica numa superficie de um material de cobreInfo
- Publication number
- PT1226289E PT1226289E PT99947849T PT99947849T PT1226289E PT 1226289 E PT1226289 E PT 1226289E PT 99947849 T PT99947849 T PT 99947849T PT 99947849 T PT99947849 T PT 99947849T PT 1226289 E PT1226289 E PT 1226289E
- Authority
- PT
- Portugal
- Prior art keywords
- copper
- copper material
- forming
- inorganic
- cu2o
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 3
- 238000002848 electrochemical method Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 5
- 239000010949 copper Substances 0.000 abstract 5
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 abstract 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract 2
- 230000001464 adherent effect Effects 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Treatment Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IT1999/000307 WO2001023646A1 (en) | 1999-09-29 | 1999-09-29 | An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT1226289E true PT1226289E (pt) | 2004-07-30 |
Family
ID=11333125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT99947849T PT1226289E (pt) | 1999-09-29 | 1999-09-29 | Metodo electroquimico para formar uma camada de cobertura inorganica numa superficie de um material de cobre |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US6749738B2 (enExample) |
| EP (1) | EP1226289B1 (enExample) |
| JP (1) | JP4637428B2 (enExample) |
| KR (1) | KR20020074143A (enExample) |
| CN (1) | CN1236109C (enExample) |
| AT (1) | ATE261006T1 (enExample) |
| AU (1) | AU6120999A (enExample) |
| CA (1) | CA2386129C (enExample) |
| DE (1) | DE69915395D1 (enExample) |
| DK (1) | DK1226289T3 (enExample) |
| ES (1) | ES2217812T3 (enExample) |
| HU (1) | HU224454B1 (enExample) |
| PL (1) | PL192904B1 (enExample) |
| PT (1) | PT1226289E (enExample) |
| RU (1) | RU2232212C2 (enExample) |
| WO (1) | WO2001023646A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4870699B2 (ja) * | 2008-03-10 | 2012-02-08 | 日立ビアメカニクス株式会社 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
| CN102157592A (zh) * | 2011-01-06 | 2011-08-17 | 上海晶澳太阳能科技有限公司 | 一种太阳能电池组件内用导线及其加工工艺 |
| RU2483146C1 (ru) * | 2011-10-03 | 2013-05-27 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг РФ) | Способ микродугового оксидирования присадочных прутков из титанового сплава для антифрикционной наплавки |
| DK2728041T3 (en) * | 2012-10-30 | 2017-03-20 | Hydro Aluminium Rolled Prod | Coated aluminum strip and method of manufacture |
| CN103014815B (zh) * | 2012-11-28 | 2016-05-04 | 常州大学 | 铜导线辊式快速阳极氧化处理方法 |
| MY182166A (en) * | 2013-09-20 | 2021-01-18 | Namics Corp | Copper foil, copper foil with carrier foil, and copper-clad laminate |
| JP5870148B2 (ja) * | 2013-11-27 | 2016-02-24 | Ｊｘ金属株式会社 | キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
| CA2957522A1 (en) * | 2014-08-07 | 2016-02-11 | Henkel Ag & Co. Kgaa | Apparatus for electroceramic coating of high tension cable wire |
| WO2016022871A1 (en) | 2014-08-07 | 2016-02-11 | Henkel Ag & Co. Kgaa | High temperature insulated aluminum conductor |
| CN104233433B (zh) * | 2014-10-03 | 2016-09-14 | 上海工程技术大学 | 一种制备氧化亚铜薄膜的方法 |
| US10636924B2 (en) | 2014-11-26 | 2020-04-28 | Sunpower Corporation | Solar module interconnect |
| CN106410227B (zh) * | 2016-12-12 | 2019-01-15 | 珠海格力电器股份有限公司 | 一种氧化铜及其制备方法 |
| CN106591922B (zh) * | 2017-02-05 | 2018-05-08 | 桂林理工大学 | 一种Cu2O纳米薄膜的制备方法 |
| CN107177876A (zh) * | 2017-05-11 | 2017-09-19 | 云南民族大学 | 一种电沉积制备氧化亚铜锂电池薄膜材料的方法 |
| JP6985745B2 (ja) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| CN112601473B (zh) | 2018-09-06 | 2023-02-03 | Ykk株式会社 | 紧固件部件 |
| JP7409602B2 (ja) * | 2019-05-09 | 2024-01-09 | ナミックス株式会社 | 複合銅部材 |
| CN113649042B (zh) * | 2021-07-20 | 2023-10-10 | 青岛农业大学 | 光催化电极制备方法、光催化反应器及污染流体处理方法 |
| JP7095193B1 (ja) | 2022-03-29 | 2022-07-04 | セイコーホールディングス株式会社 | 装飾部品及び装飾部品の製造方法 |
| JP7685553B2 (ja) * | 2022-05-31 | 2025-05-29 | コリア インスティテュート オブ マテリアルズ サイエンス | 殺菌性銅酸化物の形成方法及び殺菌性銅系物品 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1052729A (enExample) * | 1964-10-06 | |||
| US3528896A (en) * | 1968-04-17 | 1970-09-15 | Olin Corp | Process for electrochemically cleaning and brightening copper alloy and brass strip |
| SU658187A1 (ru) * | 1975-09-23 | 1979-04-25 | Предприятие П/Я А-7186 | Способ электрохимического оксидировани меди |
| DD131044B1 (de) * | 1977-02-21 | 1982-11-24 | Heinz Fink | Verfahren zur elektrolytischen erzeugung eines oxidischen haftbelages auf kupferfolien |
| JPS558487A (en) * | 1978-07-05 | 1980-01-22 | Mitsubishi Electric Corp | Surface treating method of copper |
| JPS55106670U (enExample) * | 1979-01-23 | 1980-07-25 | ||
| IL58214A (en) * | 1979-09-10 | 1982-11-30 | Yeda Res & Dev | Process for the production of optically selective surfaces |
| JPS607038B2 (ja) * | 1980-03-19 | 1985-02-21 | 積水化学工業株式会社 | 銅もしくは銅合金材の着色方法 |
| JPS607037B2 (ja) * | 1980-03-19 | 1985-02-21 | 積水化学工業株式会社 | 銅もしくは銅合金材の着色方法 |
| JPS5831099A (ja) * | 1981-08-18 | 1983-02-23 | Furukawa Electric Co Ltd:The | 銅線、条体の黒色化法 |
| JPS63250494A (ja) * | 1987-04-03 | 1988-10-18 | Kobe Steel Ltd | 黒色被膜付き銅 |
| JPH0750566B2 (ja) * | 1987-07-27 | 1995-05-31 | 古河電気工業株式会社 | コイル巻線用耐熱耐酸化性導体 |
| DD264718A1 (de) * | 1987-10-22 | 1989-02-08 | Akad Wissenschaften Ddr | Verfahren zur in- situ- erzeugung einer sehr duennen korrosionsschutzschicht |
| JP2866697B2 (ja) * | 1990-02-19 | 1999-03-08 | 臼井国際産業株式会社 | 銅材表面における強靭な電気絶縁層の形成方法 |
-
1999
- 1999-09-29 RU RU2002111346/02A patent/RU2232212C2/ru active
- 1999-09-29 PL PL354489A patent/PL192904B1/pl unknown
- 1999-09-29 CA CA2386129A patent/CA2386129C/en not_active Expired - Fee Related
- 1999-09-29 PT PT99947849T patent/PT1226289E/pt unknown
- 1999-09-29 KR KR1020027004139A patent/KR20020074143A/ko not_active Withdrawn
- 1999-09-29 WO PCT/IT1999/000307 patent/WO2001023646A1/en not_active Ceased
- 1999-09-29 DK DK99947849T patent/DK1226289T3/da active
- 1999-09-29 CN CNB998169277A patent/CN1236109C/zh not_active Expired - Fee Related
- 1999-09-29 DE DE69915395T patent/DE69915395D1/de not_active Expired - Lifetime
- 1999-09-29 AU AU61209/99A patent/AU6120999A/en not_active Abandoned
- 1999-09-29 HU HU0203533A patent/HU224454B1/hu active IP Right Grant
- 1999-09-29 EP EP99947849A patent/EP1226289B1/en not_active Expired - Lifetime
- 1999-09-29 ES ES99947849T patent/ES2217812T3/es not_active Expired - Lifetime
- 1999-09-29 AT AT99947849T patent/ATE261006T1/de active
- 1999-09-29 JP JP2001527022A patent/JP4637428B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-27 US US10/107,596 patent/US6749738B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| HUP0203533A2 (en) | 2003-05-28 |
| DE69915395D1 (de) | 2004-04-08 |
| HU224454B1 (hu) | 2005-09-28 |
| US20030102227A1 (en) | 2003-06-05 |
| KR20020074143A (ko) | 2002-09-28 |
| US6749738B2 (en) | 2004-06-15 |
| CN1236109C (zh) | 2006-01-11 |
| WO2001023646A1 (en) | 2001-04-05 |
| EP1226289A1 (en) | 2002-07-31 |
| JP4637428B2 (ja) | 2011-02-23 |
| ES2217812T3 (es) | 2004-11-01 |
| AU6120999A (en) | 2001-04-30 |
| ATE261006T1 (de) | 2004-03-15 |
| PL354489A1 (en) | 2004-01-26 |
| DK1226289T3 (da) | 2004-07-12 |
| CA2386129C (en) | 2010-03-16 |
| CN1380914A (zh) | 2002-11-20 |
| CA2386129A1 (en) | 2001-04-05 |
| RU2232212C2 (ru) | 2004-07-10 |
| JP2003510466A (ja) | 2003-03-18 |
| EP1226289B1 (en) | 2004-03-03 |
| PL192904B1 (pl) | 2006-12-29 |
| RU2002111346A (ru) | 2004-02-27 |
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