CA2386129C - An electrochemical method for forming an inorganic covering layer on a surface of a copper material - Google Patents
An electrochemical method for forming an inorganic covering layer on a surface of a copper material Download PDFInfo
- Publication number
- CA2386129C CA2386129C CA2386129A CA2386129A CA2386129C CA 2386129 C CA2386129 C CA 2386129C CA 2386129 A CA2386129 A CA 2386129A CA 2386129 A CA2386129 A CA 2386129A CA 2386129 C CA2386129 C CA 2386129C
- Authority
- CA
- Canada
- Prior art keywords
- copper
- anodic oxidation
- layer
- current density
- electrolytic bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 60
- 239000010949 copper Substances 0.000 title claims abstract description 60
- 238000002848 electrochemical method Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 title abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 84
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 45
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims abstract description 35
- 230000003647 oxidation Effects 0.000 claims abstract description 32
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 32
- 239000007864 aqueous solution Substances 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 13
- 238000002203 pretreatment Methods 0.000 claims description 7
- 150000001447 alkali salts Chemical class 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 10
- 230000001464 adherent effect Effects 0.000 abstract description 9
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract description 7
- 239000003513 alkali Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000003086 colorant Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 53
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 45
- 229960004643 cupric oxide Drugs 0.000 description 18
- 239000000126 substance Substances 0.000 description 13
- 238000007743 anodising Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 230000003750 conditioning effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000003869 coulometry Methods 0.000 description 5
- 229940112669 cuprous oxide Drugs 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 239000001888 Peptone Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000009435 building construction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000002478 γ-tocopherol Substances 0.000 description 2
- FFRBMBIXVSCUFS-UHFFFAOYSA-N 2,4-dinitro-1-naphthol Chemical compound C1=CC=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FFRBMBIXVSCUFS-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- HCMVSLMENOCDCK-UHFFFAOYSA-N N#C[Fe](C#N)(C#N)(C#N)(C#N)C#N Chemical compound N#C[Fe](C#N)(C#N)(C#N)(C#N)C#N HCMVSLMENOCDCK-UHFFFAOYSA-N 0.000 description 1
- 241001275902 Parabramis pekinensis Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- UETZVSHORCDDTH-UHFFFAOYSA-N iron(2+);hexacyanide Chemical compound [Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] UETZVSHORCDDTH-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Treatment Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemically Coating (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IT1999/000307 WO2001023646A1 (en) | 1999-09-29 | 1999-09-29 | An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2386129A1 CA2386129A1 (en) | 2001-04-05 |
| CA2386129C true CA2386129C (en) | 2010-03-16 |
Family
ID=11333125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2386129A Expired - Fee Related CA2386129C (en) | 1999-09-29 | 1999-09-29 | An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US6749738B2 (enExample) |
| EP (1) | EP1226289B1 (enExample) |
| JP (1) | JP4637428B2 (enExample) |
| KR (1) | KR20020074143A (enExample) |
| CN (1) | CN1236109C (enExample) |
| AT (1) | ATE261006T1 (enExample) |
| AU (1) | AU6120999A (enExample) |
| CA (1) | CA2386129C (enExample) |
| DE (1) | DE69915395D1 (enExample) |
| DK (1) | DK1226289T3 (enExample) |
| ES (1) | ES2217812T3 (enExample) |
| HU (1) | HU224454B1 (enExample) |
| PL (1) | PL192904B1 (enExample) |
| PT (1) | PT1226289E (enExample) |
| RU (1) | RU2232212C2 (enExample) |
| WO (1) | WO2001023646A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4870699B2 (ja) * | 2008-03-10 | 2012-02-08 | 日立ビアメカニクス株式会社 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
| CN102157592A (zh) * | 2011-01-06 | 2011-08-17 | 上海晶澳太阳能科技有限公司 | 一种太阳能电池组件内用导线及其加工工艺 |
| RU2483146C1 (ru) * | 2011-10-03 | 2013-05-27 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг РФ) | Способ микродугового оксидирования присадочных прутков из титанового сплава для антифрикционной наплавки |
| ES2619427T3 (es) * | 2012-10-30 | 2017-06-26 | Hydro Aluminium Rolled Products Gmbh | Banda de aluminio revestido y método de fabricación |
| CN103014815B (zh) * | 2012-11-28 | 2016-05-04 | 常州大学 | 铜导线辊式快速阳极氧化处理方法 |
| WO2015040998A1 (ja) * | 2013-09-20 | 2015-03-26 | 三井金属鉱業株式会社 | 銅箔、キャリア箔付銅箔及び銅張積層板 |
| JP5870148B2 (ja) * | 2013-11-27 | 2016-02-24 | Ｊｘ金属株式会社 | キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
| CA2957525A1 (en) | 2014-08-07 | 2016-02-11 | Henkel Ag & Co. Kgaa | Continuous coating apparatus for electroceramic coating of metal coil or wire |
| CA2957522A1 (en) * | 2014-08-07 | 2016-02-11 | Henkel Ag & Co. Kgaa | Apparatus for electroceramic coating of high tension cable wire |
| CN104233433B (zh) * | 2014-10-03 | 2016-09-14 | 上海工程技术大学 | 一种制备氧化亚铜薄膜的方法 |
| US10636924B2 (en) * | 2014-11-26 | 2020-04-28 | Sunpower Corporation | Solar module interconnect |
| CN106410227B (zh) * | 2016-12-12 | 2019-01-15 | 珠海格力电器股份有限公司 | 一种氧化铜及其制备方法 |
| CN106591922B (zh) * | 2017-02-05 | 2018-05-08 | 桂林理工大学 | 一种Cu2O纳米薄膜的制备方法 |
| CN107177876A (zh) * | 2017-05-11 | 2017-09-19 | 云南民族大学 | 一种电沉积制备氧化亚铜锂电池薄膜材料的方法 |
| JP6985745B2 (ja) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| CN112601473B (zh) | 2018-09-06 | 2023-02-03 | Ykk株式会社 | 紧固件部件 |
| JP7409602B2 (ja) * | 2019-05-09 | 2024-01-09 | ナミックス株式会社 | 複合銅部材 |
| CN113649042B (zh) * | 2021-07-20 | 2023-10-10 | 青岛农业大学 | 光催化电极制备方法、光催化反应器及污染流体处理方法 |
| JP7095193B1 (ja) | 2022-03-29 | 2022-07-04 | セイコーホールディングス株式会社 | 装飾部品及び装飾部品の製造方法 |
| JP7685553B2 (ja) * | 2022-05-31 | 2025-05-29 | コリア インスティテュート オブ マテリアルズ サイエンス | 殺菌性銅酸化物の形成方法及び殺菌性銅系物品 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1052729A (enExample) * | 1964-10-06 | |||
| US3528896A (en) * | 1968-04-17 | 1970-09-15 | Olin Corp | Process for electrochemically cleaning and brightening copper alloy and brass strip |
| SU658187A1 (ru) * | 1975-09-23 | 1979-04-25 | Предприятие П/Я А-7186 | Способ электрохимического оксидировани меди |
| DD131044B1 (de) * | 1977-02-21 | 1982-11-24 | Heinz Fink | Verfahren zur elektrolytischen erzeugung eines oxidischen haftbelages auf kupferfolien |
| JPS558487A (en) * | 1978-07-05 | 1980-01-22 | Mitsubishi Electric Corp | Surface treating method of copper |
| JPS55106670U (enExample) * | 1979-01-23 | 1980-07-25 | ||
| IL58214A (en) * | 1979-09-10 | 1982-11-30 | Yeda Res & Dev | Process for the production of optically selective surfaces |
| JPS607038B2 (ja) * | 1980-03-19 | 1985-02-21 | 積水化学工業株式会社 | 銅もしくは銅合金材の着色方法 |
| JPS607037B2 (ja) * | 1980-03-19 | 1985-02-21 | 積水化学工業株式会社 | 銅もしくは銅合金材の着色方法 |
| JPS5831099A (ja) * | 1981-08-18 | 1983-02-23 | Furukawa Electric Co Ltd:The | 銅線、条体の黒色化法 |
| JPS63250494A (ja) * | 1987-04-03 | 1988-10-18 | Kobe Steel Ltd | 黒色被膜付き銅 |
| JPH0750566B2 (ja) * | 1987-07-27 | 1995-05-31 | 古河電気工業株式会社 | コイル巻線用耐熱耐酸化性導体 |
| DD264718A1 (de) * | 1987-10-22 | 1989-02-08 | Akad Wissenschaften Ddr | Verfahren zur in- situ- erzeugung einer sehr duennen korrosionsschutzschicht |
| JP2866697B2 (ja) * | 1990-02-19 | 1999-03-08 | 臼井国際産業株式会社 | 銅材表面における強靭な電気絶縁層の形成方法 |
-
1999
- 1999-09-29 EP EP99947849A patent/EP1226289B1/en not_active Expired - Lifetime
- 1999-09-29 RU RU2002111346/02A patent/RU2232212C2/ru active
- 1999-09-29 KR KR1020027004139A patent/KR20020074143A/ko not_active Withdrawn
- 1999-09-29 CA CA2386129A patent/CA2386129C/en not_active Expired - Fee Related
- 1999-09-29 WO PCT/IT1999/000307 patent/WO2001023646A1/en not_active Ceased
- 1999-09-29 DE DE69915395T patent/DE69915395D1/de not_active Expired - Lifetime
- 1999-09-29 DK DK99947849T patent/DK1226289T3/da active
- 1999-09-29 PL PL354489A patent/PL192904B1/pl unknown
- 1999-09-29 AU AU61209/99A patent/AU6120999A/en not_active Abandoned
- 1999-09-29 HU HU0203533A patent/HU224454B1/hu active IP Right Grant
- 1999-09-29 JP JP2001527022A patent/JP4637428B2/ja not_active Expired - Fee Related
- 1999-09-29 AT AT99947849T patent/ATE261006T1/de active
- 1999-09-29 PT PT99947849T patent/PT1226289E/pt unknown
- 1999-09-29 CN CNB998169277A patent/CN1236109C/zh not_active Expired - Fee Related
- 1999-09-29 ES ES99947849T patent/ES2217812T3/es not_active Expired - Lifetime
-
2002
- 2002-03-27 US US10/107,596 patent/US6749738B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| PT1226289E (pt) | 2004-07-30 |
| CA2386129A1 (en) | 2001-04-05 |
| RU2002111346A (ru) | 2004-02-27 |
| PL354489A1 (en) | 2004-01-26 |
| HUP0203533A2 (en) | 2003-05-28 |
| PL192904B1 (pl) | 2006-12-29 |
| ES2217812T3 (es) | 2004-11-01 |
| JP2003510466A (ja) | 2003-03-18 |
| RU2232212C2 (ru) | 2004-07-10 |
| DE69915395D1 (de) | 2004-04-08 |
| CN1236109C (zh) | 2006-01-11 |
| DK1226289T3 (da) | 2004-07-12 |
| JP4637428B2 (ja) | 2011-02-23 |
| EP1226289A1 (en) | 2002-07-31 |
| EP1226289B1 (en) | 2004-03-03 |
| KR20020074143A (ko) | 2002-09-28 |
| US20030102227A1 (en) | 2003-06-05 |
| WO2001023646A1 (en) | 2001-04-05 |
| CN1380914A (zh) | 2002-11-20 |
| ATE261006T1 (de) | 2004-03-15 |
| AU6120999A (en) | 2001-04-30 |
| US6749738B2 (en) | 2004-06-15 |
| HU224454B1 (hu) | 2005-09-28 |
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