ES2217812T3 - Metodo electroquimico para formar una capa de recubrimiento inorganica sobre la superficie de un material de cobre. - Google Patents
Metodo electroquimico para formar una capa de recubrimiento inorganica sobre la superficie de un material de cobre.Info
- Publication number
- ES2217812T3 ES2217812T3 ES99947849T ES99947849T ES2217812T3 ES 2217812 T3 ES2217812 T3 ES 2217812T3 ES 99947849 T ES99947849 T ES 99947849T ES 99947849 T ES99947849 T ES 99947849T ES 2217812 T3 ES2217812 T3 ES 2217812T3
- Authority
- ES
- Spain
- Prior art keywords
- copper
- layer
- anodic oxidation
- current density
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011247 coating layer Substances 0.000 title claims abstract description 12
- 238000002848 electrochemical method Methods 0.000 title claims abstract description 6
- 239000000463 material Substances 0.000 title claims description 18
- 238000000034 method Methods 0.000 claims abstract description 73
- 239000010949 copper Substances 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052802 copper Inorganic materials 0.000 claims abstract description 57
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 46
- 230000003647 oxidation Effects 0.000 claims abstract description 30
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 30
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 10
- 239000005751 Copper oxide Substances 0.000 claims abstract description 9
- 239000007864 aqueous solution Substances 0.000 claims abstract description 9
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 9
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 229940112669 cuprous oxide Drugs 0.000 claims abstract description 6
- 230000004048 modification Effects 0.000 claims abstract description 5
- 238000012986 modification Methods 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 claims abstract description 4
- 159000000011 group IA salts Chemical class 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims abstract description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 51
- 230000003287 optical effect Effects 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 4
- 239000012670 alkaline solution Substances 0.000 claims description 4
- 238000011282 treatment Methods 0.000 claims description 4
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 abstract description 5
- 229960004643 cupric oxide Drugs 0.000 description 20
- 239000000126 substance Substances 0.000 description 12
- 230000001464 adherent effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007743 anodising Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000001888 Peptone Substances 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- UETZVSHORCDDTH-UHFFFAOYSA-N iron(2+);hexacyanide Chemical compound [Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] UETZVSHORCDDTH-UHFFFAOYSA-N 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002478 γ-tocopherol Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000009435 building construction Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001223 reverse osmosis Methods 0.000 description 1
- 229910001112 rose gold Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Treatment Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemically Coating (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IT1999/000307 WO2001023646A1 (en) | 1999-09-29 | 1999-09-29 | An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2217812T3 true ES2217812T3 (es) | 2004-11-01 |
Family
ID=11333125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES99947849T Expired - Lifetime ES2217812T3 (es) | 1999-09-29 | 1999-09-29 | Metodo electroquimico para formar una capa de recubrimiento inorganica sobre la superficie de un material de cobre. |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US6749738B2 (enExample) |
| EP (1) | EP1226289B1 (enExample) |
| JP (1) | JP4637428B2 (enExample) |
| KR (1) | KR20020074143A (enExample) |
| CN (1) | CN1236109C (enExample) |
| AT (1) | ATE261006T1 (enExample) |
| AU (1) | AU6120999A (enExample) |
| CA (1) | CA2386129C (enExample) |
| DE (1) | DE69915395D1 (enExample) |
| DK (1) | DK1226289T3 (enExample) |
| ES (1) | ES2217812T3 (enExample) |
| HU (1) | HU224454B1 (enExample) |
| PL (1) | PL192904B1 (enExample) |
| PT (1) | PT1226289E (enExample) |
| RU (1) | RU2232212C2 (enExample) |
| WO (1) | WO2001023646A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4870699B2 (ja) * | 2008-03-10 | 2012-02-08 | 日立ビアメカニクス株式会社 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
| CN102157592A (zh) * | 2011-01-06 | 2011-08-17 | 上海晶澳太阳能科技有限公司 | 一种太阳能电池组件内用导线及其加工工艺 |
| RU2483146C1 (ru) * | 2011-10-03 | 2013-05-27 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг РФ) | Способ микродугового оксидирования присадочных прутков из титанового сплава для антифрикционной наплавки |
| ES2619427T3 (es) * | 2012-10-30 | 2017-06-26 | Hydro Aluminium Rolled Products Gmbh | Banda de aluminio revestido y método de fabricación |
| CN103014815B (zh) * | 2012-11-28 | 2016-05-04 | 常州大学 | 铜导线辊式快速阳极氧化处理方法 |
| WO2015040998A1 (ja) * | 2013-09-20 | 2015-03-26 | 三井金属鉱業株式会社 | 銅箔、キャリア箔付銅箔及び銅張積層板 |
| JP5870148B2 (ja) * | 2013-11-27 | 2016-02-24 | Ｊｘ金属株式会社 | キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
| CA2957525A1 (en) | 2014-08-07 | 2016-02-11 | Henkel Ag & Co. Kgaa | Continuous coating apparatus for electroceramic coating of metal coil or wire |
| CA2957522A1 (en) * | 2014-08-07 | 2016-02-11 | Henkel Ag & Co. Kgaa | Apparatus for electroceramic coating of high tension cable wire |
| CN104233433B (zh) * | 2014-10-03 | 2016-09-14 | 上海工程技术大学 | 一种制备氧化亚铜薄膜的方法 |
| US10636924B2 (en) * | 2014-11-26 | 2020-04-28 | Sunpower Corporation | Solar module interconnect |
| CN106410227B (zh) * | 2016-12-12 | 2019-01-15 | 珠海格力电器股份有限公司 | 一种氧化铜及其制备方法 |
| CN106591922B (zh) * | 2017-02-05 | 2018-05-08 | 桂林理工大学 | 一种Cu2O纳米薄膜的制备方法 |
| CN107177876A (zh) * | 2017-05-11 | 2017-09-19 | 云南民族大学 | 一种电沉积制备氧化亚铜锂电池薄膜材料的方法 |
| JP6985745B2 (ja) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| CN112601473B (zh) | 2018-09-06 | 2023-02-03 | Ykk株式会社 | 紧固件部件 |
| JP7409602B2 (ja) * | 2019-05-09 | 2024-01-09 | ナミックス株式会社 | 複合銅部材 |
| CN113649042B (zh) * | 2021-07-20 | 2023-10-10 | 青岛农业大学 | 光催化电极制备方法、光催化反应器及污染流体处理方法 |
| JP7095193B1 (ja) | 2022-03-29 | 2022-07-04 | セイコーホールディングス株式会社 | 装飾部品及び装飾部品の製造方法 |
| JP7685553B2 (ja) * | 2022-05-31 | 2025-05-29 | コリア インスティテュート オブ マテリアルズ サイエンス | 殺菌性銅酸化物の形成方法及び殺菌性銅系物品 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1052729A (enExample) * | 1964-10-06 | |||
| US3528896A (en) * | 1968-04-17 | 1970-09-15 | Olin Corp | Process for electrochemically cleaning and brightening copper alloy and brass strip |
| SU658187A1 (ru) * | 1975-09-23 | 1979-04-25 | Предприятие П/Я А-7186 | Способ электрохимического оксидировани меди |
| DD131044B1 (de) * | 1977-02-21 | 1982-11-24 | Heinz Fink | Verfahren zur elektrolytischen erzeugung eines oxidischen haftbelages auf kupferfolien |
| JPS558487A (en) * | 1978-07-05 | 1980-01-22 | Mitsubishi Electric Corp | Surface treating method of copper |
| JPS55106670U (enExample) * | 1979-01-23 | 1980-07-25 | ||
| IL58214A (en) * | 1979-09-10 | 1982-11-30 | Yeda Res & Dev | Process for the production of optically selective surfaces |
| JPS607038B2 (ja) * | 1980-03-19 | 1985-02-21 | 積水化学工業株式会社 | 銅もしくは銅合金材の着色方法 |
| JPS607037B2 (ja) * | 1980-03-19 | 1985-02-21 | 積水化学工業株式会社 | 銅もしくは銅合金材の着色方法 |
| JPS5831099A (ja) * | 1981-08-18 | 1983-02-23 | Furukawa Electric Co Ltd:The | 銅線、条体の黒色化法 |
| JPS63250494A (ja) * | 1987-04-03 | 1988-10-18 | Kobe Steel Ltd | 黒色被膜付き銅 |
| JPH0750566B2 (ja) * | 1987-07-27 | 1995-05-31 | 古河電気工業株式会社 | コイル巻線用耐熱耐酸化性導体 |
| DD264718A1 (de) * | 1987-10-22 | 1989-02-08 | Akad Wissenschaften Ddr | Verfahren zur in- situ- erzeugung einer sehr duennen korrosionsschutzschicht |
| JP2866697B2 (ja) * | 1990-02-19 | 1999-03-08 | 臼井国際産業株式会社 | 銅材表面における強靭な電気絶縁層の形成方法 |
-
1999
- 1999-09-29 EP EP99947849A patent/EP1226289B1/en not_active Expired - Lifetime
- 1999-09-29 RU RU2002111346/02A patent/RU2232212C2/ru active
- 1999-09-29 KR KR1020027004139A patent/KR20020074143A/ko not_active Withdrawn
- 1999-09-29 CA CA2386129A patent/CA2386129C/en not_active Expired - Fee Related
- 1999-09-29 WO PCT/IT1999/000307 patent/WO2001023646A1/en not_active Ceased
- 1999-09-29 DE DE69915395T patent/DE69915395D1/de not_active Expired - Lifetime
- 1999-09-29 DK DK99947849T patent/DK1226289T3/da active
- 1999-09-29 PL PL354489A patent/PL192904B1/pl unknown
- 1999-09-29 AU AU61209/99A patent/AU6120999A/en not_active Abandoned
- 1999-09-29 HU HU0203533A patent/HU224454B1/hu active IP Right Grant
- 1999-09-29 JP JP2001527022A patent/JP4637428B2/ja not_active Expired - Fee Related
- 1999-09-29 AT AT99947849T patent/ATE261006T1/de active
- 1999-09-29 PT PT99947849T patent/PT1226289E/pt unknown
- 1999-09-29 CN CNB998169277A patent/CN1236109C/zh not_active Expired - Fee Related
- 1999-09-29 ES ES99947849T patent/ES2217812T3/es not_active Expired - Lifetime
-
2002
- 2002-03-27 US US10/107,596 patent/US6749738B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| PT1226289E (pt) | 2004-07-30 |
| CA2386129A1 (en) | 2001-04-05 |
| RU2002111346A (ru) | 2004-02-27 |
| PL354489A1 (en) | 2004-01-26 |
| HUP0203533A2 (en) | 2003-05-28 |
| PL192904B1 (pl) | 2006-12-29 |
| JP2003510466A (ja) | 2003-03-18 |
| RU2232212C2 (ru) | 2004-07-10 |
| DE69915395D1 (de) | 2004-04-08 |
| CN1236109C (zh) | 2006-01-11 |
| CA2386129C (en) | 2010-03-16 |
| DK1226289T3 (da) | 2004-07-12 |
| JP4637428B2 (ja) | 2011-02-23 |
| EP1226289A1 (en) | 2002-07-31 |
| EP1226289B1 (en) | 2004-03-03 |
| KR20020074143A (ko) | 2002-09-28 |
| US20030102227A1 (en) | 2003-06-05 |
| WO2001023646A1 (en) | 2001-04-05 |
| CN1380914A (zh) | 2002-11-20 |
| ATE261006T1 (de) | 2004-03-15 |
| AU6120999A (en) | 2001-04-30 |
| US6749738B2 (en) | 2004-06-15 |
| HU224454B1 (hu) | 2005-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2217812T3 (es) | Metodo electroquimico para formar una capa de recubrimiento inorganica sobre la superficie de un material de cobre. | |
| JP4673903B2 (ja) | 金属酸化物及び／又は金属水酸化物被覆導電性材料 | |
| KR101108312B1 (ko) | 캔용 도금 강판 및 그 제조 방법 | |
| KR102137193B1 (ko) | 플렉시블 디바이스용 기판 및 그 제조 방법 | |
| IE48597B1 (en) | Copper foil suitable for use in making printed circuits | |
| CN102797024B (zh) | 一种铝合金微弧氧化着蓝色膜层的方法 | |
| CN102196675A (zh) | 处理铜箔 | |
| TWI280079B (en) | Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil | |
| CN110786078B (zh) | 柔性装置用基板 | |
| Raj et al. | Formation and surface characterization of nanostructured Al2O3-TiO2 coatings | |
| US3989605A (en) | Method for continuous electrolytic coloring of aluminum articles | |
| KR100297348B1 (ko) | 구리재의표면상에의강인한전기절연층의형성방법 | |
| JP5520151B2 (ja) | 銅材料の表面上に無機被覆層を形成するための電気化学的方法 | |
| WO1992019795A1 (en) | Process for producing articles comprising anodized films exhibiting areas of different colour and the articles thus produced | |
| TWI337207B (en) | Peel strength enhancement of copper laminates | |
| EP1445352A1 (en) | A method for forming a passivation layer on an article having at least one tin-plated surface | |
| WO2016159748A1 (es) | Piezas de acero recubiertas y sus procesos de fabricación | |
| JPH11217693A (ja) | グレー発色アルミニウム材とその着色体の製造方法 | |
| JP7735298B2 (ja) | ブリキストリップを不動態化する方法及び不動態化されたブリキストリップを製造するための装置 | |
| Balasubramanian et al. | Influence of addition agents for ac anodizing in sulphuric acid electrolytes | |
| WO1996038600A1 (en) | Nickelled steel sheet proofed against tight adhesion during annealing and process for production thereof | |
| KR20110117395A (ko) | 고강도 및 검은색 착색 효과를 갖는 알루미늄재의 표면 처리 방법 | |
| KR850004131A (ko) | 전기저항 용접에 적절한 표면처리된 강스트립 제조방법 | |
| Thein Kyaw et al. | Study on Anodizing Processes for Formation of Nano Porous Aluminum Oxide Thin Films | |
| KR20230038427A (ko) | 3가 크롬 전해질로부터 기능성 또는 장식용 크롬층을 전착하는 방법 |