JPS558487A - Surface treating method of copper - Google Patents
Surface treating method of copperInfo
- Publication number
- JPS558487A JPS558487A JP8240178A JP8240178A JPS558487A JP S558487 A JPS558487 A JP S558487A JP 8240178 A JP8240178 A JP 8240178A JP 8240178 A JP8240178 A JP 8240178A JP S558487 A JPS558487 A JP S558487A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- oxide
- alkali
- hydroxide
- kinds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To form antirust insulation films of superior durability, corrosion resistance and adhesiveness on copper surfaces by anodizing the surfaces in the solution which contains the specific concentration of aluminate ions and has been controlled to the specific pH by the oxide or hydroxide of one or more kinds of alkali metals or alkaline earth metals.
CONSTITUTION: Copper being the object to be treated having undergone pretreatments such as alkali degreasing and pickling is provided as anode in the alkali solution which contains aluminate ions at 0.1 g/l to saturation and has been controlled to pH 9 to 14 by using the oxide or hydroxide of one or more kinds of alkali metals or alkaline earth metals, whereby it is electrolyzed. The electrolysis forms and deposits the oxide film of copper containing the oxide of Al on the surfaces of the copper.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8240178A JPS558487A (en) | 1978-07-05 | 1978-07-05 | Surface treating method of copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8240178A JPS558487A (en) | 1978-07-05 | 1978-07-05 | Surface treating method of copper |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS558487A true JPS558487A (en) | 1980-01-22 |
Family
ID=13773563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8240178A Pending JPS558487A (en) | 1978-07-05 | 1978-07-05 | Surface treating method of copper |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS558487A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003510466A (en) * | 1999-09-29 | 2003-03-18 | エウローパ メッタリ ソシエタ ペル アチオニ | Electrochemical method for forming an inorganic coating on the surface of copper material |
CN111155160A (en) * | 2020-02-24 | 2020-05-15 | 北京大学 | Method for reducing oxidation speed of metal product |
-
1978
- 1978-07-05 JP JP8240178A patent/JPS558487A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003510466A (en) * | 1999-09-29 | 2003-03-18 | エウローパ メッタリ ソシエタ ペル アチオニ | Electrochemical method for forming an inorganic coating on the surface of copper material |
CN111155160A (en) * | 2020-02-24 | 2020-05-15 | 北京大学 | Method for reducing oxidation speed of metal product |
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