JPS558487A - Surface treating method of copper - Google Patents

Surface treating method of copper

Info

Publication number
JPS558487A
JPS558487A JP8240178A JP8240178A JPS558487A JP S558487 A JPS558487 A JP S558487A JP 8240178 A JP8240178 A JP 8240178A JP 8240178 A JP8240178 A JP 8240178A JP S558487 A JPS558487 A JP S558487A
Authority
JP
Japan
Prior art keywords
copper
oxide
alkali
hydroxide
kinds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8240178A
Other languages
Japanese (ja)
Inventor
Norihiko Inuzuka
Tetsuo Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8240178A priority Critical patent/JPS558487A/en
Publication of JPS558487A publication Critical patent/JPS558487A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form antirust insulation films of superior durability, corrosion resistance and adhesiveness on copper surfaces by anodizing the surfaces in the solution which contains the specific concentration of aluminate ions and has been controlled to the specific pH by the oxide or hydroxide of one or more kinds of alkali metals or alkaline earth metals.
CONSTITUTION: Copper being the object to be treated having undergone pretreatments such as alkali degreasing and pickling is provided as anode in the alkali solution which contains aluminate ions at 0.1 g/l to saturation and has been controlled to pH 9 to 14 by using the oxide or hydroxide of one or more kinds of alkali metals or alkaline earth metals, whereby it is electrolyzed. The electrolysis forms and deposits the oxide film of copper containing the oxide of Al on the surfaces of the copper.
COPYRIGHT: (C)1980,JPO&Japio
JP8240178A 1978-07-05 1978-07-05 Surface treating method of copper Pending JPS558487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8240178A JPS558487A (en) 1978-07-05 1978-07-05 Surface treating method of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8240178A JPS558487A (en) 1978-07-05 1978-07-05 Surface treating method of copper

Publications (1)

Publication Number Publication Date
JPS558487A true JPS558487A (en) 1980-01-22

Family

ID=13773563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8240178A Pending JPS558487A (en) 1978-07-05 1978-07-05 Surface treating method of copper

Country Status (1)

Country Link
JP (1) JPS558487A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003510466A (en) * 1999-09-29 2003-03-18 エウローパ メッタリ ソシエタ ペル アチオニ Electrochemical method for forming an inorganic coating on the surface of copper material
CN111155160A (en) * 2020-02-24 2020-05-15 北京大学 Method for reducing oxidation speed of metal product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003510466A (en) * 1999-09-29 2003-03-18 エウローパ メッタリ ソシエタ ペル アチオニ Electrochemical method for forming an inorganic coating on the surface of copper material
CN111155160A (en) * 2020-02-24 2020-05-15 北京大学 Method for reducing oxidation speed of metal product

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