KR950032718A - 구리 호일용 결절상 구리/니켈 합금 처리법 - Google Patents
구리 호일용 결절상 구리/니켈 합금 처리법 Download PDFInfo
- Publication number
- KR950032718A KR950032718A KR1019950000902A KR19950000902A KR950032718A KR 950032718 A KR950032718 A KR 950032718A KR 1019950000902 A KR1019950000902 A KR 1019950000902A KR 19950000902 A KR19950000902 A KR 19950000902A KR 950032718 A KR950032718 A KR 950032718A
- Authority
- KR
- South Korea
- Prior art keywords
- foil
- copper
- metallic
- current density
- metallic foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
호일(10)의 에칭 특성을 변성시키지 않으면서 호일(10)에 어두운 색상을 부여하고 유전 기판(22)에 대한 호일(10)의 결합강도를 개성시키는 구리 호일(10)용 화학처리법이 기재되어 있다. 처리법은 호일(10)의 표면에 결정상 구리/니켈 합금층(14)을 전착시키는 것을 포함한다. 결절상 피복층(14)은 구리가 50중량% 이상이고 펄스 전력 조절기를 사용하여 전착된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 방법에 따라 처리한 금속성 호일의 단면도이고, 제3도는 제2도의 적층 구조물을 금속성 호일의 사진영상화(photoimaging)시킨 단면도이고, 제4도는 본 발명에 따른 금속성 호일을 처리하기 위한 다수의 전해 셀을 개략적으로 나타낸 것이다.
Claims (16)
- 금속성 기판(12)과 금속성 기판(12)의 적어도 한쪽 표면에 인접하며 구리를 50중량% 이상 함유하는 구리와 니켈의 합금인 결절상 피복층(14)을 특징으로 하는 복합 호일(10).
- 유전 기판(22)과 유전 기판의 적어도 한쪽 면에 결합된 제1항의 복합 호일(10)을 특징으로 하는 인쇄 회로 기판(20).
- 제1항 또는 제2항에 있어서, 금속성 기판(12)이 구리 또는 구리 기본 합금임을 특징으로 하는 복합 호일(10).
- 제3항에 있어서, 결절상 피복층(14)이 구리를 약 55 내지 99중량% 함유함을 특징으로 하는 복합 호일(10).
- 제4항에 있어서, 결절상 피복층(14)이 구리를 약 70 내지 95중량% 함유함을 특징으로 하는 복합 호일(10).
- 제4항에 있어서, 결절상 피복층(14)을 형성하는 결절의 평균 가로방향 폭(W)이 약 0.05 내지 약 5μ이고 평균 높이가 약 0.5 내지 약 3μ임을 특징으로 하는 복합 호일(10).
- 제6항에 있어서, 결절의 평균 가로방향 폭(W)이 약 0.1내지 약 1μ이고 평균 높이가 약 0.7 내지 약 0.5μ임을 특징으로 하는 복합 호일(10).
- 구리 이온과 니켈 이온의 수용액을 함유하는 다량의 전해질(60)과 양극(64)을 갖는 전해 셀(48)에 금속성 호일(42)을 침지시키는 단계(a), 음극으로서 금속성 호일(42)을 사용하여 제1전류밀도를 제1시간 동안 전해질(60)을 통해 인가하는 단계(b), 음극으로서 금속성 호일(42)을 사용하여 제2전류밀도를 제2시간 동안 전해질(60)을 통해 인가하는 단계(c)(이때, 제1전류밀도와 제2전류밀도는 둘 다 0보다 크다)및 단계(b) 와 단계(c)를 연속적으로 반복하여 박리강도를 증가시키기에 유효한 두께로 어두운 색 피막을 전착시키는 단계(d)를 특징으로 하여, 금속성 기판(42)에 어두운 색 피막을 전착시키는 방법.
- 제8항에 있어서, 제1전류밀도가 약 100 내지 400mA/㎠이고, 제1시간이 약 10 내지 50msec이며, 제2전류 밀도가 약 10 내지 100mA/㎠이고, 제2시간이 약 5 내지 20msec임을 특징으로 하는 방법.
- 제9항에 있어서, 단계(b)와 단계(c)가 약 5 내지 약 400sec동안 반복됨을 특징으로 하는 방법.
- 제10항에 있어서, 전해질(60)이 금속성 구리의 형태로 구리 약 3 내지 약 20g/ℓ, 금속성 니켈의 형태로 약 3 내지 약 20g/ℓ및 시르트산나트륨.2수화물 약 40 내지 약 210g/ℓ를 함유하도록 선택되고, 작동 pH가 약 4내지 9이며, 작동온도가 약 30 내지 60℃임을 특징으로 하는 방법.
- 제11항에 있어서, 단계(a)에 앞서 금속성 호일(42)을 세정함을 특징으로 하는 방법.
- 제12항에 있어서, 세정단계가, 음극으로서 금속성 호일(42)을 사용하여 전류밀도 약 10 내지 40mA/㎠에서 약 10 내지 약 40sec동안 금속성 호일(42)을 알칼리성 수용액(52)에 침지시킨 다음 세정된 금속성 호일(42)을 전기적으로 에칭시키는 단계를 포함함을 특징으로 하는 방법.
- 제12항에 있어서, 제정단계가, 금속성 호일(42)을 알칼리성 수용액(52)에 침지시키고, 양극으로서 금속성 호일을 사용하여 전류밀도 약 10 내지 약 100mA/㎠에서 약 10 내지 약 40sec동안 전해질 온도 약 40 내지 60℃에서 알칼리성 수용액을 톡해 전류를 인가하는 단계를 포함함을 특징으로 하는 방법.
- 제12항에 있어서, 단계(d)후에 처리된 금속성 호일(44)이 변색방지층으로 피복됨을 특징으로 하는 방법.
- 제15항에 있어서, 변색방지 피복물(66)이, 아연 대 크롬의 중량비가 약 4:1을 초과하는 크롬과 아연의 혼합물임을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18453494A | 1994-01-21 | 1994-01-21 | |
US08/184534 | 1994-01-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950032718A true KR950032718A (ko) | 1995-12-22 |
KR100407732B1 KR100407732B1 (ko) | 2004-03-25 |
Family
ID=22677301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950000902A KR100407732B1 (ko) | 1994-01-21 | 1995-01-20 | 결절상구리/니켈합금피막을포함하는복합호일,이를포함하는인쇄회로기판및결절상구리/니켈합금피막의전착방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5800930A (ko) |
JP (1) | JP3459964B2 (ko) |
KR (1) | KR100407732B1 (ko) |
GB (1) | GB2285813B (ko) |
HK (1) | HK1006065A1 (ko) |
MY (1) | MY111671A (ko) |
TW (1) | TW317575B (ko) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6569543B2 (en) | 2001-02-15 | 2003-05-27 | Olin Corporation | Copper foil with low profile bond enahncement |
US6478943B1 (en) * | 2000-06-01 | 2002-11-12 | Roll Surface Technologies, Inc. | Method of manufacture of electrochemically textured surface having controlled peak characteristics |
US6893742B2 (en) | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
US6610417B2 (en) * | 2001-10-04 | 2003-08-26 | Oak-Mitsui, Inc. | Nickel coated copper as electrodes for embedded passive devices |
TW200404484A (en) * | 2002-09-02 | 2004-03-16 | Furukawa Circuit Foil | Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board |
US20040175582A1 (en) * | 2002-12-05 | 2004-09-09 | Olin Corporation, A Corporation Of The Commonwealth Of Virginia | Laser ablation resistant copper foil |
US7749611B2 (en) * | 2002-12-05 | 2010-07-06 | Gbc Metals, L.L.C. | Peel strength enhancement of copper laminates |
US20040108211A1 (en) * | 2002-12-06 | 2004-06-10 | Industrial Technology Research Institute | Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB) |
KR101065758B1 (ko) * | 2003-02-27 | 2011-09-19 | 후루카와 덴키 고교 가부시키가이샤 | 전자파 실드용 동박, 그 제조방법 및 전자파 실드체 |
US20050026031A1 (en) * | 2003-08-01 | 2005-02-03 | Mckenzie Rodney S. | Nickel-plated screen for electrochemical cell |
US6852427B1 (en) * | 2003-09-02 | 2005-02-08 | Olin Corporation | Chromium-free antitarnish adhesion promoting treatment composition |
US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
JP4532322B2 (ja) * | 2005-03-30 | 2010-08-25 | 古河電気工業株式会社 | ビルトアップ基板内層用銅箔 |
US20070014997A1 (en) * | 2005-07-14 | 2007-01-18 | 3M Innovative Properties Company | Tool and method of making and using the same |
US7976956B2 (en) * | 2005-08-01 | 2011-07-12 | Furukawa Circuit Foil., Ltd. | Laminated circuit board |
JP4609850B2 (ja) * | 2005-08-01 | 2011-01-12 | 古河電気工業株式会社 | 積層回路基板 |
EP2381015B1 (en) | 2005-08-12 | 2019-01-16 | Modumetal, Inc. | Compositionally modulated composite materials |
JP2007103440A (ja) * | 2005-09-30 | 2007-04-19 | Mitsui Mining & Smelting Co Ltd | 配線基板の製造方法および配線基板 |
KR101289803B1 (ko) * | 2008-05-16 | 2013-07-26 | 삼성테크윈 주식회사 | 회로 기판 및 그 제조 방법 |
US8518281B2 (en) * | 2008-06-03 | 2013-08-27 | Kesheng Feng | Acid-resistance promoting composition |
KR101426038B1 (ko) * | 2008-11-13 | 2014-08-01 | 주식회사 엠디에스 | 인쇄회로기판 및 그 제조방법 |
WO2010110092A1 (ja) * | 2009-03-27 | 2010-09-30 | 日鉱金属株式会社 | プリント配線板用銅箔及びその製造方法 |
BR122013014461B1 (pt) | 2009-06-08 | 2020-10-20 | Modumetal, Inc | revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada |
JP5448616B2 (ja) * | 2009-07-14 | 2014-03-19 | 古河電気工業株式会社 | 抵抗層付銅箔、該銅箔の製造方法および積層基板 |
JP4927963B2 (ja) * | 2010-01-22 | 2012-05-09 | 古河電気工業株式会社 | 表面処理銅箔、その製造方法及び銅張積層基板 |
JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
KR20130058051A (ko) | 2010-09-24 | 2013-06-03 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 프린트 배선판용 동박의 제조 방법 및 프린트 배선판용 동박 |
CN106028638B (zh) | 2010-09-27 | 2019-09-03 | 吉坤日矿日石金属株式会社 | 印刷电路板用铜箔、其制造方法以及印刷电路板 |
CN103857833B (zh) | 2011-09-30 | 2018-09-07 | Jx日矿日石金属株式会社 | 与树脂粘着性优良的铜箔、其制造方法以及使用该电解铜箔的印刷布线板或电池用负极材料 |
JP5204908B1 (ja) | 2012-03-26 | 2013-06-05 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
KR101649435B1 (ko) * | 2012-04-19 | 2016-08-19 | 딥솔 가부시키가이샤 | 구리-니켈 합금 전기 도금 욕 및 도금 방법 |
KR102038137B1 (ko) | 2012-12-21 | 2019-10-30 | 주식회사 넥스플렉스 | 다층 연성금속박 적층체 및 이의 제조방법 |
CN105189826B (zh) | 2013-03-15 | 2019-07-16 | 莫杜美拓有限公司 | 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金 |
WO2014146114A1 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | Nanolaminate coatings |
CN105143521B (zh) | 2013-03-15 | 2020-07-10 | 莫杜美拓有限公司 | 用于连续施加纳米叠层金属涂层的方法和装置 |
US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
CN108486622B (zh) | 2013-03-15 | 2020-10-30 | 莫杜美拓有限公司 | 具有高硬度的镍铬纳米层压涂层 |
AR102068A1 (es) | 2014-09-18 | 2017-02-01 | Modumetal Inc | Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva |
EP3194642A4 (en) * | 2014-09-18 | 2018-07-04 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
US10900135B2 (en) * | 2016-02-09 | 2021-01-26 | Weinberg Medical Physics, Inc. | Method and apparatus for manufacturing particles |
US11365488B2 (en) | 2016-09-08 | 2022-06-21 | Modumetal, Inc. | Processes for providing laminated coatings on workpieces, and articles made therefrom |
US20190360116A1 (en) | 2016-09-14 | 2019-11-28 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
US12076965B2 (en) | 2016-11-02 | 2024-09-03 | Modumetal, Inc. | Topology optimized high interface packing structures |
JP7033905B2 (ja) * | 2017-02-07 | 2022-03-11 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
WO2018175975A1 (en) | 2017-03-24 | 2018-09-27 | Modumetal, Inc. | Lift plungers with electrodeposited coatings, and systems and methods for producing the same |
CN110537393B (zh) * | 2017-04-17 | 2022-09-20 | 住友金属矿山株式会社 | 导电性基板、导电性基板的制造方法 |
CA3060619A1 (en) | 2017-04-21 | 2018-10-25 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
US11519093B2 (en) | 2018-04-27 | 2022-12-06 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
CN109536725B (zh) * | 2019-01-14 | 2020-06-16 | 北京康普锡威科技有限公司 | 印刷线路板蚀刻废液处理方法、纳米铜粉及其制备方法 |
CN112921356B (zh) * | 2021-01-22 | 2022-05-27 | 西南科技大学 | 一种从废旧印刷线路板中回收铜的方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1969553A (en) * | 1934-08-07 | Electrolyte for the deposition of | ||
US1750092A (en) * | 1921-11-26 | 1930-03-11 | Crawford Robert Brace Penn | Electroplating process |
GB957808A (en) * | 1962-02-09 | 1964-05-13 | Ass Elect Ind | Electrodeposition of copper-nickel alloy |
US3247082A (en) * | 1962-08-07 | 1966-04-19 | Harshaw Chem Corp | Electrodeposition of a corrosion resistant coating |
US3454376A (en) * | 1966-06-06 | 1969-07-08 | Clevite Corp | Metal composite and method of making same |
US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
USRE30180E (en) * | 1971-10-08 | 1979-12-25 | Yates Industries, Inc. | Plural copper-layer treatment of copper foil and article made thereby |
US3833481A (en) * | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
US3857683A (en) * | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
JPS5224133A (en) * | 1975-08-20 | 1977-02-23 | Nisshin Steel Co Ltd | Plating method of nickellcopper alloy |
JPS52145769A (en) * | 1976-05-31 | 1977-12-05 | Nippon Mining Co | Method of surface treating printed circuit copper foil |
US4131517A (en) * | 1977-06-03 | 1978-12-26 | Nippon Mining Co., Ltd. | Surface treating process for copper foil for use in printed circuit |
JPS5413971A (en) * | 1977-07-01 | 1979-02-01 | Nippon Mining Co | Method of treating copper foil surface for print circuit |
US4190474A (en) * | 1977-12-22 | 1980-02-26 | Gould Inc. | Method of making a printed circuit board having mutually etchable copper and nickel layers |
US4199417A (en) * | 1978-11-13 | 1980-04-22 | Mariano Borruso | Electrodeposition of black deposit and electrolytes therefor |
US4167459A (en) * | 1979-01-08 | 1979-09-11 | The United States Of America As Represented By The Secretary Of The Interior | Electroplating with Ni-Cu alloy |
JPS56155593A (en) * | 1980-04-08 | 1981-12-01 | Furukawa Circuit Foil | Steel foil for printed circuit and method of manufacturing same |
US4394419A (en) * | 1981-06-12 | 1983-07-19 | Oak Industries Inc. | Printed circuit material |
US4387006A (en) * | 1981-07-08 | 1983-06-07 | Fukuda Metal Foil & Powder Co., Ltd. | Method of treating the surface of the copper foil used in printed wire boards |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
JPS6113688A (ja) * | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
US4888574A (en) * | 1985-05-29 | 1989-12-19 | 501 Ohmega Electronics, Inc. | Circuit board material and method of making |
US4689475A (en) * | 1985-10-15 | 1987-08-25 | Raychem Corporation | Electrical devices containing conductive polymers |
US4756795A (en) * | 1986-10-31 | 1988-07-12 | International Business Machines Corporation | Raw card fabrication process with nickel overplate |
US4789438A (en) * | 1987-06-23 | 1988-12-06 | Olin Corporation | Cathode surface treatment for electroforming metallic foil or strip |
JPH0284326A (ja) * | 1988-09-21 | 1990-03-26 | Mitsui Toatsu Chem Inc | フレキシブル銅張り積層板 |
US5019222A (en) * | 1989-05-02 | 1991-05-28 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
JPH0818401B2 (ja) * | 1989-05-17 | 1996-02-28 | 福田金属箔粉工業株式会社 | 複合箔とその製法 |
US5230932A (en) * | 1989-10-13 | 1993-07-27 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil |
KR920002417B1 (ko) * | 1989-12-07 | 1992-03-23 | 간또오 가세이 고오교오 가부시기가이샤 | 내식성이 우수한 구리-니켈-크롬 광택 전기 도금 방법 및 이 방법으로 얻은 도금 피막 |
JPH0819550B2 (ja) * | 1990-06-05 | 1996-02-28 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔の表面処理方法 |
US5304428A (en) * | 1990-06-05 | 1994-04-19 | Fukuda Metal Foil And Powder Co., Ltd. | Copper foil for printed circuit boards |
JPH04284690A (ja) * | 1991-03-13 | 1992-10-09 | Furukawa Saakitsuto Foil Kk | 多層プリント配線板内層回路用銅箔及びその製造方法 |
TW208110B (ko) * | 1990-06-08 | 1993-06-21 | Furukawa Circuit Foil Kk | |
JP3081026B2 (ja) * | 1991-07-18 | 2000-08-28 | 古河サーキットフォイル株式会社 | プリント配線板用電解銅箔 |
JP2717910B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
US5490533A (en) * | 1993-04-05 | 1996-02-13 | Carter Mark C | Collapsible shelter with elevated canopy |
-
1994
- 1994-12-10 TW TW083111508A patent/TW317575B/zh not_active IP Right Cessation
-
1995
- 1995-01-12 MY MYPI95000075A patent/MY111671A/en unknown
- 1995-01-19 GB GB9501075A patent/GB2285813B/en not_active Expired - Lifetime
- 1995-01-20 KR KR1019950000902A patent/KR100407732B1/ko not_active IP Right Cessation
- 1995-01-20 JP JP00750395A patent/JP3459964B2/ja not_active Expired - Lifetime
-
1997
- 1997-06-24 US US08/879,689 patent/US5800930A/en not_active Expired - Lifetime
-
1998
- 1998-06-10 HK HK98105142A patent/HK1006065A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1006065A1 (en) | 1999-02-05 |
TW317575B (ko) | 1997-10-11 |
GB2285813A (en) | 1995-07-26 |
JPH07243088A (ja) | 1995-09-19 |
KR100407732B1 (ko) | 2004-03-25 |
GB2285813B (en) | 1997-12-10 |
MY111671A (en) | 2000-10-31 |
GB9501075D0 (en) | 1995-03-08 |
US5800930A (en) | 1998-09-01 |
JP3459964B2 (ja) | 2003-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR950032718A (ko) | 구리 호일용 결절상 구리/니켈 합금 처리법 | |
EP0180981B1 (en) | A process for the surface treatment of copper products | |
US3998601A (en) | Thin foil | |
US4468293A (en) | Electrochemical treatment of copper for improving its bond strength | |
US4515671A (en) | Electrochemical treatment of copper for improving its bond strength | |
US3654099A (en) | Cathodic activation of stainless steel | |
US5322975A (en) | Universal carrier supported thin copper line | |
GB2030176A (en) | Copper foil suitable for use in making printed circuits | |
JP4637428B2 (ja) | 銅材料の表面上に無機被覆層を形成するための電気化学的方法 | |
EP3460102A1 (en) | Method of producing an electrocatalyst | |
US4293617A (en) | Process for producing strippable copper on an aluminum carrier and the article so obtained | |
KR20040057979A (ko) | 무연 주석합금을 피복하는 방법 | |
US3454376A (en) | Metal composite and method of making same | |
US4551210A (en) | Dendritic treatment of metallic surfaces for improving adhesive bonding | |
WO1990012129A1 (en) | Treatment of metal foil | |
JPH08236930A (ja) | 印刷回路用銅箔及びその製造方法 | |
CN100512595C (zh) | 用于印刷电路板的铜箔 | |
US4549941A (en) | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces | |
IE50821B1 (en) | Process for the selective chemical deposition and/or electrodeposition of metal coatings,especially for the production of printed circuits | |
EP0376447A1 (en) | Electrode for electrochemical use | |
JPS644091A (en) | Plating | |
US4552627A (en) | Preparation for improving the adhesion properties of metal foils | |
KR920019222A (ko) | 인쇄회로용 전해동박 및 그 제조방법 | |
JPS585983B2 (ja) | 無電解金属析出用に安定して金属錯化物を製造する方法及び装置 | |
JPS5921392B2 (ja) | プリント回路用銅箔の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121105 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20131106 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20141105 Year of fee payment: 12 |
|
EXPY | Expiration of term |