JP4611198B2 - 光情報記録媒体用の非晶質性保護膜を形成するためのスパッタリングターゲット、光情報記録媒体用の非晶質性保護膜及びその製造方法 - Google Patents
光情報記録媒体用の非晶質性保護膜を形成するためのスパッタリングターゲット、光情報記録媒体用の非晶質性保護膜及びその製造方法 Download PDFInfo
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- JP4611198B2 JP4611198B2 JP2005502990A JP2005502990A JP4611198B2 JP 4611198 B2 JP4611198 B2 JP 4611198B2 JP 2005502990 A JP2005502990 A JP 2005502990A JP 2005502990 A JP2005502990 A JP 2005502990A JP 4611198 B2 JP4611198 B2 JP 4611198B2
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- protective film
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- information recording
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- Y10T428/00—Stock material or miscellaneous articles
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003056884 | 2003-03-04 | ||
| JP2003056884 | 2003-03-04 | ||
| PCT/JP2004/001051 WO2004079038A1 (ja) | 2003-03-04 | 2004-02-03 | スパッタリングターゲット、光情報記録媒体用薄膜及びその製造方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008258076A Division JP4965540B2 (ja) | 2003-03-04 | 2008-10-03 | スパッタリングターゲット、光情報記録媒体用薄膜及びその製造方法 |
| JP2008258075A Division JP4699504B2 (ja) | 2003-03-04 | 2008-10-03 | スパッタリングターゲット、光情報記録媒体用薄膜及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2004079038A1 JPWO2004079038A1 (ja) | 2006-06-08 |
| JP4611198B2 true JP4611198B2 (ja) | 2011-01-12 |
Family
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005502990A Expired - Lifetime JP4611198B2 (ja) | 2003-03-04 | 2004-02-03 | 光情報記録媒体用の非晶質性保護膜を形成するためのスパッタリングターゲット、光情報記録媒体用の非晶質性保護膜及びその製造方法 |
| JP2008258076A Expired - Lifetime JP4965540B2 (ja) | 2003-03-04 | 2008-10-03 | スパッタリングターゲット、光情報記録媒体用薄膜及びその製造方法 |
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| JP (3) | JP4611198B2 (enExample) |
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| CN (2) | CN1756857B (enExample) |
| TW (1) | TW200417619A (enExample) |
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| JP4430014B2 (ja) * | 2003-09-30 | 2010-03-10 | 日鉱金属株式会社 | 高純度酸化亜鉛粉末の製造方法 |
| EP1717335A4 (en) * | 2004-02-17 | 2010-07-21 | Nippon Mining Co | SPUTTERTARGET, OPTICAL INFORMATION RECORDING MATERIAL AND MANUFACTURING METHOD THEREFOR |
| JP4628685B2 (ja) * | 2004-02-17 | 2011-02-09 | Jx日鉱日石金属株式会社 | 光情報記録媒体用スパッタリングターゲット及び光情報記録媒体 |
| JP4376868B2 (ja) * | 2004-02-17 | 2009-12-02 | 日鉱金属株式会社 | 光情報記録媒体薄膜製造用スパッタリングターゲット並びに光情報記録媒体及びその製造方法 |
| JP4697404B2 (ja) * | 2005-04-18 | 2011-06-08 | 三菱マテリアル株式会社 | 光記録媒体保護膜形成用スパッタリングターゲット |
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| KR101004981B1 (ko) * | 2005-06-28 | 2011-01-04 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 산화갈륨-산화아연계 스퍼터링 타겟, 투명 도전막의 형성방법 및 투명 도전막 |
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| CN101317224B (zh) * | 2005-12-02 | 2015-06-17 | 松下电器产业株式会社 | 光学信息记录介质及其记录再生方法、以及记录再生装置 |
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| JP6353369B2 (ja) * | 2013-01-15 | 2018-07-04 | 出光興産株式会社 | スパッタリングターゲット、酸化物半導体薄膜及びそれらの製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2004079038A1 (ja) | 2004-09-16 |
| KR20050106473A (ko) | 2005-11-09 |
| JP4699504B2 (ja) | 2011-06-15 |
| JP2009062618A (ja) | 2009-03-26 |
| TWI304446B (enExample) | 2008-12-21 |
| US20080299415A1 (en) | 2008-12-04 |
| CN101650955B (zh) | 2011-08-24 |
| JP2009080924A (ja) | 2009-04-16 |
| US7718095B2 (en) | 2010-05-18 |
| US7892457B2 (en) | 2011-02-22 |
| CN1756857B (zh) | 2010-09-29 |
| US7897068B2 (en) | 2011-03-01 |
| KR100753328B1 (ko) | 2007-08-29 |
| CN1756857A (zh) | 2006-04-05 |
| JPWO2004079038A1 (ja) | 2006-06-08 |
| US20100167000A1 (en) | 2010-07-01 |
| US7635440B2 (en) | 2009-12-22 |
| JP4965540B2 (ja) | 2012-07-04 |
| US20100240521A1 (en) | 2010-09-23 |
| US20060147740A1 (en) | 2006-07-06 |
| CN101650955A (zh) | 2010-02-17 |
| TW200417619A (en) | 2004-09-16 |
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