JP4596925B2 - 集積回路および集積回路用の相互接続構造 - Google Patents

集積回路および集積回路用の相互接続構造 Download PDF

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JP4596925B2
JP4596925B2 JP2005006181A JP2005006181A JP4596925B2 JP 4596925 B2 JP4596925 B2 JP 4596925B2 JP 2005006181 A JP2005006181 A JP 2005006181A JP 2005006181 A JP2005006181 A JP 2005006181A JP 4596925 B2 JP4596925 B2 JP 4596925B2
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contact
metal layer
contact portion
transistor
integrated circuit
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JP2005210114A (ja
JP2005210114A5 (enExample
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サハット スタルジャ
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マーベル ワールド トレード リミテッド
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    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
JP2005006181A 2004-01-26 2005-01-13 集積回路および集積回路用の相互接続構造 Expired - Fee Related JP4596925B2 (ja)

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US10/765,474 US7265448B2 (en) 2004-01-26 2004-01-26 Interconnect structure for power transistors

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JP2005276912A Division JP2006093712A (ja) 2004-01-26 2005-09-22 アルミニウム・コアを有する相互接続構造
JP2005276911A Division JP5502255B2 (ja) 2004-01-26 2005-09-22 集積回路を接続するための相互接続構造

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JP2005210114A5 JP2005210114A5 (enExample) 2005-11-17
JP4596925B2 true JP4596925B2 (ja) 2010-12-15

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JP2005276912A Pending JP2006093712A (ja) 2004-01-26 2005-09-22 アルミニウム・コアを有する相互接続構造
JP2005276911A Expired - Lifetime JP5502255B2 (ja) 2004-01-26 2005-09-22 集積回路を接続するための相互接続構造

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JP2005276911A Expired - Lifetime JP5502255B2 (ja) 2004-01-26 2005-09-22 集積回路を接続するための相互接続構造

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US (2) US7265448B2 (enExample)
EP (3) EP1727200B1 (enExample)
JP (3) JP4596925B2 (enExample)
CN (3) CN1805137A (enExample)
TW (3) TWI354368B (enExample)

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US7960833B2 (en) 2003-10-22 2011-06-14 Marvell World Trade Ltd. Integrated circuits and interconnect structure for integrated circuits
US7851872B2 (en) 2003-10-22 2010-12-14 Marvell World Trade Ltd. Efficient transistor structure
US7414275B2 (en) * 2005-06-24 2008-08-19 International Business Machines Corporation Multi-level interconnections for an integrated circuit chip
JP4424331B2 (ja) * 2005-08-01 2010-03-03 セイコーエプソン株式会社 静電アクチュエータ、液滴吐出ヘッド、液滴吐出ヘッドの駆動方法及び静電アクチュエータの製造方法
WO2007050990A2 (en) * 2005-10-27 2007-05-03 Rosetta Inpharmatics Llc Nucleic acid amplification using non-random primers
US8786072B2 (en) * 2007-02-27 2014-07-22 International Rectifier Corporation Semiconductor package
US9147644B2 (en) 2008-02-26 2015-09-29 International Rectifier Corporation Semiconductor device and passive component integration in a semiconductor package
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