JP4525676B2 - 露光装置、露光方法、及びデバイス製造方法 - Google Patents

露光装置、露光方法、及びデバイス製造方法 Download PDF

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Publication number
JP4525676B2
JP4525676B2 JP2006511475A JP2006511475A JP4525676B2 JP 4525676 B2 JP4525676 B2 JP 4525676B2 JP 2006511475 A JP2006511475 A JP 2006511475A JP 2006511475 A JP2006511475 A JP 2006511475A JP 4525676 B2 JP4525676 B2 JP 4525676B2
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Japan
Prior art keywords
nozzle member
liquid
substrate
exposure apparatus
optical system
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Expired - Fee Related
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JP2006511475A
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English (en)
Japanese (ja)
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JPWO2005093791A1 (ja
Inventor
英明 原
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Nikon Corp
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Nikon Corp
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    • H10P76/204—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H10P72/0402—
    • H10P76/2041—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microscoopes, Condenser (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2006511475A 2004-03-25 2005-03-23 露光装置、露光方法、及びデバイス製造方法 Expired - Fee Related JP4525676B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004089348 2004-03-25
JP2004089348 2004-03-25
PCT/JP2005/005254 WO2005093791A1 (ja) 2004-03-25 2005-03-23 露光装置及びデバイス製造方法

Related Child Applications (1)

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JP2010087336A Division JP5310632B2 (ja) 2004-03-25 2010-04-05 露光装置、露光方法、及びデバイス製造方法

Publications (2)

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JPWO2005093791A1 JPWO2005093791A1 (ja) 2008-02-14
JP4525676B2 true JP4525676B2 (ja) 2010-08-18

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JP2006511475A Expired - Fee Related JP4525676B2 (ja) 2004-03-25 2005-03-23 露光装置、露光方法、及びデバイス製造方法
JP2010087336A Expired - Fee Related JP5310632B2 (ja) 2004-03-25 2010-04-05 露光装置、露光方法、及びデバイス製造方法
JP2011129493A Expired - Fee Related JP5545270B2 (ja) 2004-03-25 2011-06-09 露光装置、露光方法、及びデバイス製造方法
JP2012083156A Expired - Fee Related JP5545315B2 (ja) 2004-03-25 2012-03-30 露光装置、露光方法、及びデバイス製造方法
JP2013146581A Expired - Fee Related JP5673747B2 (ja) 2004-03-25 2013-07-12 露光装置及びデバイス製造方法
JP2014018562A Expired - Fee Related JP5790803B2 (ja) 2004-03-25 2014-02-03 露光装置、露光方法及びデバイス製造方法
JP2015005854A Expired - Fee Related JP5971358B2 (ja) 2004-03-25 2015-01-15 露光装置、露光方法及びデバイス製造方法
JP2015237657A Expired - Fee Related JP6160681B2 (ja) 2004-03-25 2015-12-04 露光装置及びデバイス製造方法
JP2016192920A Expired - Lifetime JP6315050B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2016192923A Expired - Lifetime JP6315052B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2016192922A Expired - Lifetime JP6315051B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2016192921A Expired - Fee Related JP6304335B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2017232520A Pending JP2018041107A (ja) 2004-03-25 2017-12-04 露光装置及びデバイス製造方法

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JP2010087336A Expired - Fee Related JP5310632B2 (ja) 2004-03-25 2010-04-05 露光装置、露光方法、及びデバイス製造方法
JP2011129493A Expired - Fee Related JP5545270B2 (ja) 2004-03-25 2011-06-09 露光装置、露光方法、及びデバイス製造方法
JP2012083156A Expired - Fee Related JP5545315B2 (ja) 2004-03-25 2012-03-30 露光装置、露光方法、及びデバイス製造方法
JP2013146581A Expired - Fee Related JP5673747B2 (ja) 2004-03-25 2013-07-12 露光装置及びデバイス製造方法
JP2014018562A Expired - Fee Related JP5790803B2 (ja) 2004-03-25 2014-02-03 露光装置、露光方法及びデバイス製造方法
JP2015005854A Expired - Fee Related JP5971358B2 (ja) 2004-03-25 2015-01-15 露光装置、露光方法及びデバイス製造方法
JP2015237657A Expired - Fee Related JP6160681B2 (ja) 2004-03-25 2015-12-04 露光装置及びデバイス製造方法
JP2016192920A Expired - Lifetime JP6315050B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2016192923A Expired - Lifetime JP6315052B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2016192922A Expired - Lifetime JP6315051B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2016192921A Expired - Fee Related JP6304335B2 (ja) 2004-03-25 2016-09-30 露光装置、露光方法及びデバイス製造方法
JP2017232520A Pending JP2018041107A (ja) 2004-03-25 2017-12-04 露光装置及びデバイス製造方法

Country Status (5)

Country Link
US (7) US8111373B2 (enExample)
JP (13) JP4525676B2 (enExample)
KR (8) KR101504445B1 (enExample)
TW (7) TWI486719B (enExample)
WO (1) WO2005093791A1 (enExample)

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KR101636632B1 (ko) 2004-01-05 2016-07-05 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR101504445B1 (ko) * 2004-03-25 2015-03-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4623095B2 (ja) * 2004-06-17 2011-02-02 株式会社ニコン 液浸リソグラフィレンズの流体圧力補正
US7426014B2 (en) 2004-07-01 2008-09-16 Nikon Corporation Dynamic fluid control system for immersion lithography
TWI610340B (zh) * 2004-09-17 2018-01-01 尼康股份有限公司 曝光裝置、曝光方法及元件製造方法
US7180571B2 (en) 2004-12-08 2007-02-20 Asml Netherlands B.V. Lithographic projection apparatus and actuator
CN100555568C (zh) * 2005-04-28 2009-10-28 株式会社尼康 曝光方法及曝光装置、以及元件制造方法
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US7411658B2 (en) * 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4514225B2 (ja) * 2005-11-16 2010-07-28 キヤノン株式会社 露光装置及びデバイス製造方法
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
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US7701551B2 (en) 2006-04-14 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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KR101408783B1 (ko) 2007-12-07 2014-06-17 삼성전자주식회사 반도체 소자의 제조장치 및 이를 이용한 반도체 소자의제조방법
US8233139B2 (en) * 2008-03-27 2012-07-31 Nikon Corporation Immersion system, exposure apparatus, exposing method, and device fabricating method
NL2003392A (en) 2008-09-17 2010-03-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US9494870B2 (en) 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
NL2011457A (en) * 2012-10-15 2014-04-16 Asml Netherlands Bv Actuation mechanism, optical apparatus, lithography apparatus and method of manufacturing devices.
JP6119242B2 (ja) * 2012-12-27 2017-04-26 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US10534277B2 (en) * 2014-03-26 2020-01-14 Nikon Corporation Movable body apparatus, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method
US10802260B2 (en) 2014-05-29 2020-10-13 Rarecyte, Inc. Automated substrate loading
US11422352B2 (en) 2014-05-29 2022-08-23 Rarecyte, Inc. Automated substrate loading
US10890748B2 (en) 2014-05-29 2021-01-12 Rarecyte, Inc. Automated substrate loading
US9857580B2 (en) * 2014-05-29 2018-01-02 Rarecyte, Inc. Apparatus for holding a substrate within a secondary device
US11300769B2 (en) 2014-05-29 2022-04-12 Rarecyte, Inc. Automated substrate loading
AU2017330346C1 (en) 2016-09-21 2025-03-06 Nextcure, Inc. Antibodies for Siglec-15 and methods of use thereof
JP6506785B2 (ja) * 2017-02-02 2019-04-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ リソグラフィ用テンプレートの製造方法、プログラム及び基板処理装置
KR20190116305A (ko) 2017-02-08 2019-10-14 히타치가세이가부시끼가이샤 전하 수송성 재료 및 그 이용
CN113678046B (zh) 2019-03-01 2024-08-13 瑞尔赛特股份有限公司 将基底保持在辅助装置中
CN112684665B (zh) * 2020-12-25 2024-06-25 浙江启尔机电技术有限公司 一种浸液供给回收装置
CN114690577B (zh) * 2020-12-31 2024-10-25 上海微电子装备（集团）股份有限公司 一种管路柔性适应装置及浸没式光刻机
KR102584513B1 (ko) * 2020-12-31 2023-10-06 세메스 주식회사 온도 변화가 수반되는 분위기에 제공되는 기판 지지 부재의 수평 측정용 기판형 센서, 이를 이용한 수평 측정 방법 및 비일시적 컴퓨터 판독가능 매체

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