JP4508863B2 - パターン形成された薄膜導体を基材上に形成する方法 - Google Patents
パターン形成された薄膜導体を基材上に形成する方法 Download PDFInfo
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- JP4508863B2 JP4508863B2 JP2004500109A JP2004500109A JP4508863B2 JP 4508863 B2 JP4508863 B2 JP 4508863B2 JP 2004500109 A JP2004500109 A JP 2004500109A JP 2004500109 A JP2004500109 A JP 2004500109A JP 4508863 B2 JP4508863 B2 JP 4508863B2
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Manufacturing Of Electric Cables (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Methods (AREA)
Description
本発明は一般にディスプレイに関する。基材上に、パターン形成された薄膜導体を形成するための方法を開示する。
プラスチックディスプレイ、例えば電気泳動ディスプレイ等は、一般に、少なくとも一方がパターン形成されている2つの電極及びディスプレイ媒体層を有して構成されている。バイアス電圧は一般に、電極に対して選択的に印加され、バイアス電圧が印加される電極に対応するディスプレイ媒体の部分に状態を制御する。例えば、典型的なパッシブ・マトリックス電気泳動ディスプレイは、ロウ(横列(row))及びカラム(縦列(lolumn))に配されており、並びに頂部側及び底部側の電極層に挟まれた電気泳動セルのアレイ(配列(array))を有してなる。例えば、頂部側電極層は、電気泳動セルのカラムの上側に配される一連の透明なカラム電極を有してよく、底部側電極層は、電気泳動セルのロウ(列)の下側に配される一連のロウ電極を有してなっていてよい。いくつかの種類のパッシブ・マトリックス電気泳動ディスプレイが、2001年9月12日に出願された「An Improved Electrophoretic Display with Gating Electrodes」という標題の米国の仮出願(Provisional U. S. Patent Applications)No. 60/322,635、2001年7月17日に出願された「An Improved Electrophoretic Display with Dualmode Switching」という標題の米国出願No. 60/313,146、及び2001年8月17日に出願された「An Improved Electrophoretic Display with In−Plane Switching」という標題の米国出願No. 60/306, 312に開示されている。これらは、引用することによって本明細書に包含することとする。
本発明の好適な実施態様例についての詳細な説明を以下に記載する。本発明について好適な実施態様に関連して説明するが、本発明はいずれか1つの態様例に限定されるものではないということを理解されたい。その一方で、本発明の範囲は特許請求の範囲の記載によってのみ限定されるのであって、本発明は種々の選択肢、変更点及び均等物を包含している。本発明についての十分な理解を提供するために、例示する目的で、種々の特定の詳細な事項を以下、説明する。本発明は、これらの特定の詳細な事項の一部又は全体を伴うことなく、特許請求の範囲の記載に基づいて実施することができる。この発明が不必要に不明瞭なものとはならないように、そして、この発明を明確にするため、この発明に関連する技術の分野において既知の技術的事項については、特に詳細には説明しない。
図2A〜2Dは、基材上に4つのカラム電極を形成するために用いられる一連の処理工程(ステップ)の模式的平面図を示している。図2Aはプラスチック基材202を示している。図2Bでは、基材202上に、ライン204からなるインクパターンがプリントされている。図2Bにおいて示す例では、ライン204は、基材202上において、以下においてより十分に説明するように、ライン204によって覆われていない基材202の領域に4つのカラム電極が形成されることになる領域を規定している。
1つの態様例では、ITOストリッピング率(ITO stripping rate)は、溶媒の濃度、溶媒の温度及び超音波振動子に対する基材薄膜の相対的な位置に依存する。
以上、理解が容易なように、本発明についていくつかの項目について詳細に説明したが、特許請求の範囲に記載した範囲内で、特定の変更及び修正を行うことができるということは、明らかである。本発明の方法及び装置のいずれを実施するためにも、多くの代替し得る方法及び装置があることに留意されたい。従って、本発明の態様例は、説明のためのものであって、限定するものと考えてはならず、本明細書に記載した詳細な事項に本発明は限定されるものでもなく、本発明は特許請求の範囲に記載した事項及びそれと均等な事項の範囲で変更し得るということに留意されたい。
Claims (4)
- 基材上に薄膜構造を形成する方法であって、
薄膜構造が形成されるべき領域に第1の材料をプリントして、第1の材料を用いて、薄膜構造のポジティブ・イメージを有するパターンを基材上にプリントする工程であって、第1の材料は第1の溶媒を用いてストリッピングすることができる材料である工程;
基材のプリントされた表面を、第1の溶媒を用いてはストリッピングすることができない第2の材料でオーバーコートする工程;
基材上に直接形成された第2の材料をストリッピングすることなく、第1の材料及び該第1の材料上に形成された第2の材料をストリッピングして、第1の材料が存在しない基材上を被覆する第2の材料を残す工程であって、薄膜構造を形成すべき領域に第2の材料が存在しないように薄膜構造のネガティブ・イメージを規定する工程;
基材のパターン形成された表面に薄膜材料をデポジットする工程;並びに
第2の材料及び該第2の材料上にデポジットされた薄膜材料をストリッピングして、薄膜構造を形成する工程
を含む方法。 - 第1の材料は第2の材料を撥く材料であって、基材上において、第1の材料が存在する領域をコーティングすることなく、第1の材料がプリントされていない領域に第2の材料を充填する、請求項1に記載の基材上に薄膜構造を形成する方法。
- 第1の溶媒は水溶液又は水である請求項1に記載の基材上に薄膜構造を形成する方法。
- 第1の溶媒は非水性溶媒又は溶液である請求項1に記載の基材上に薄膜構造を形成する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37590202P | 2002-04-24 | 2002-04-24 | |
PCT/US2003/012692 WO2003091788A2 (en) | 2002-04-24 | 2003-04-23 | Process for forming a patterned thin film conductive structure on a substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005524100A JP2005524100A (ja) | 2005-08-11 |
JP2005524100A5 JP2005524100A5 (ja) | 2006-06-15 |
JP4508863B2 true JP4508863B2 (ja) | 2010-07-21 |
Family
ID=29270720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004500109A Expired - Lifetime JP4508863B2 (ja) | 2002-04-24 | 2003-04-23 | パターン形成された薄膜導体を基材上に形成する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030203101A1 (ja) |
EP (1) | EP1497692A2 (ja) |
JP (1) | JP4508863B2 (ja) |
CN (2) | CN100430810C (ja) |
AU (1) | AU2003231077A1 (ja) |
TW (1) | TWI268813B (ja) |
WO (1) | WO2003091788A2 (ja) |
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US6900876B2 (en) * | 2003-02-13 | 2005-05-31 | Eastman Kodak Company | Process and structures for selective deposition of liquid-crystal emulsion |
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2003
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- 2003-04-23 JP JP2004500109A patent/JP4508863B2/ja not_active Expired - Lifetime
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US20030203101A1 (en) | 2003-10-30 |
CN1256620C (zh) | 2006-05-17 |
CN100430810C (zh) | 2008-11-05 |
AU2003231077A8 (en) | 2003-11-10 |
AU2003231077A1 (en) | 2003-11-10 |
CN1716073A (zh) | 2006-01-04 |
JP2005524100A (ja) | 2005-08-11 |
WO2003091788A2 (en) | 2003-11-06 |
WO2003091788A3 (en) | 2004-03-25 |
TW200404620A (en) | 2004-04-01 |
EP1497692A2 (en) | 2005-01-19 |
TWI268813B (en) | 2006-12-21 |
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