JPS57126971A - Method for precisely processing metal wafer - Google Patents
Method for precisely processing metal waferInfo
- Publication number
- JPS57126971A JPS57126971A JP1084481A JP1084481A JPS57126971A JP S57126971 A JPS57126971 A JP S57126971A JP 1084481 A JP1084481 A JP 1084481A JP 1084481 A JP1084481 A JP 1084481A JP S57126971 A JPS57126971 A JP S57126971A
- Authority
- JP
- Japan
- Prior art keywords
- metal wafer
- toner
- pattern
- solvent
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To simplify a preparation process and reduce a preparation cost to a large extent by forming a mask pattern by using electrostatic printing technique.
CONSTITUTION: A metal wafer 1 of which the back surface is coated with a layer withstanding an etching liquid is prepared and a pattern image is projected onto a charged photoconductive plate 6 such as a ZnO plate or the like to form an electrostatic latent image and a positive image of said pattern is obtained by developing said latent image with a toner 7. After this treatment, the toner 7 of said positive image is transferred to the surface of the metal wafer 1 to be fixed with a solvent or a solvent vapor and the exposed metal wafer 1 not masked with the toner 7 is removed by etching technique. Finally, when the mask coating layer 2 of the toner 7 is chemically peeled by mechanical brushing or by using a solvent, the metal wafer 1 with a desired pattern is obtained.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1084481A JPS57126971A (en) | 1981-01-29 | 1981-01-29 | Method for precisely processing metal wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1084481A JPS57126971A (en) | 1981-01-29 | 1981-01-29 | Method for precisely processing metal wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57126971A true JPS57126971A (en) | 1982-08-06 |
Family
ID=11761653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1084481A Pending JPS57126971A (en) | 1981-01-29 | 1981-01-29 | Method for precisely processing metal wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57126971A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4755257A (en) * | 1986-04-17 | 1988-07-05 | Dainippon Screen Mfg. Co., Ltd. | Method of processing thin metal sheets by photoetching |
CN100430810C (en) * | 2002-04-24 | 2008-11-05 | 希毕克斯影像有限公司 | Process for forming a patterned thin film conductive structure on a substrate |
-
1981
- 1981-01-29 JP JP1084481A patent/JPS57126971A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4755257A (en) * | 1986-04-17 | 1988-07-05 | Dainippon Screen Mfg. Co., Ltd. | Method of processing thin metal sheets by photoetching |
CN100430810C (en) * | 2002-04-24 | 2008-11-05 | 希毕克斯影像有限公司 | Process for forming a patterned thin film conductive structure on a substrate |
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