JPS5573892A - Pattern forming method for metal film - Google Patents
Pattern forming method for metal filmInfo
- Publication number
- JPS5573892A JPS5573892A JP14754878A JP14754878A JPS5573892A JP S5573892 A JPS5573892 A JP S5573892A JP 14754878 A JP14754878 A JP 14754878A JP 14754878 A JP14754878 A JP 14754878A JP S5573892 A JPS5573892 A JP S5573892A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal film
- substrate
- carried out
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To form the minute pattern of thick metal film, by coating the metal film on photosensitive resin layer formed on the substrate covered electric conductive layer and exposing to ultraviolet rays after patterning the metal film and then developing the resin layer and also removing the above film and moreover, plating removing region of the resin layer selectively.
CONSTITUTION: Positive type photosensitive resin is rotating applied after forming the electric conductive layer 2 evaporating Cr.Pt.Au on the insulating substrate 1, such as Al2O3 etc., successively and the resin layer 3 is formed carrying out prebaking. Next, the Au layer 4 having a thickness of 1000W5000Å, is formed on the surface of the layer 3 by vacuum evaporation and prebaking is carried out after applying photosensitive resin on the layer 4. Then, the above prebaked body is exposed to ultraviolet rays and is developed and then, patterning is carried out by etching the Au layer 4 selectively. Developing treatment of the layer 3 is carried out after irradiating the ultraviolet ray on the whole surface of the substrate and exposing the layer 3 and then, exposed part of the layer 3 is removed. Moreover, the substrate is dipped in Au plating bath after etching and removing the layer 4 and current is turned on connecting the cathode with the layer 2 and then, the Au layer 5 is formed at the opening part of the layer 3.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14754878A JPS5573892A (en) | 1978-11-29 | 1978-11-29 | Pattern forming method for metal film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14754878A JPS5573892A (en) | 1978-11-29 | 1978-11-29 | Pattern forming method for metal film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5573892A true JPS5573892A (en) | 1980-06-03 |
JPS5721036B2 JPS5721036B2 (en) | 1982-05-04 |
Family
ID=15432805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14754878A Granted JPS5573892A (en) | 1978-11-29 | 1978-11-29 | Pattern forming method for metal film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5573892A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138090A (en) * | 1982-02-12 | 1983-08-16 | 株式会社日立製作所 | Method of producing printed circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61291050A (en) * | 1985-06-18 | 1986-12-20 | 川崎重工業株式会社 | Pressure type upright crusher |
-
1978
- 1978-11-29 JP JP14754878A patent/JPS5573892A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138090A (en) * | 1982-02-12 | 1983-08-16 | 株式会社日立製作所 | Method of producing printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS5721036B2 (en) | 1982-05-04 |
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