JPS5573892A - Pattern forming method for metal film - Google Patents

Pattern forming method for metal film

Info

Publication number
JPS5573892A
JPS5573892A JP14754878A JP14754878A JPS5573892A JP S5573892 A JPS5573892 A JP S5573892A JP 14754878 A JP14754878 A JP 14754878A JP 14754878 A JP14754878 A JP 14754878A JP S5573892 A JPS5573892 A JP S5573892A
Authority
JP
Japan
Prior art keywords
layer
metal film
substrate
carried out
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14754878A
Other languages
Japanese (ja)
Other versions
JPS5721036B2 (en
Inventor
Kinshiro Kosemura
Eiji Yamamura
Takeshi Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14754878A priority Critical patent/JPS5573892A/en
Publication of JPS5573892A publication Critical patent/JPS5573892A/en
Publication of JPS5721036B2 publication Critical patent/JPS5721036B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To form the minute pattern of thick metal film, by coating the metal film on photosensitive resin layer formed on the substrate covered electric conductive layer and exposing to ultraviolet rays after patterning the metal film and then developing the resin layer and also removing the above film and moreover, plating removing region of the resin layer selectively.
CONSTITUTION: Positive type photosensitive resin is rotating applied after forming the electric conductive layer 2 evaporating Cr.Pt.Au on the insulating substrate 1, such as Al2O3 etc., successively and the resin layer 3 is formed carrying out prebaking. Next, the Au layer 4 having a thickness of 1000W5000Å, is formed on the surface of the layer 3 by vacuum evaporation and prebaking is carried out after applying photosensitive resin on the layer 4. Then, the above prebaked body is exposed to ultraviolet rays and is developed and then, patterning is carried out by etching the Au layer 4 selectively. Developing treatment of the layer 3 is carried out after irradiating the ultraviolet ray on the whole surface of the substrate and exposing the layer 3 and then, exposed part of the layer 3 is removed. Moreover, the substrate is dipped in Au plating bath after etching and removing the layer 4 and current is turned on connecting the cathode with the layer 2 and then, the Au layer 5 is formed at the opening part of the layer 3.
COPYRIGHT: (C)1980,JPO&Japio
JP14754878A 1978-11-29 1978-11-29 Pattern forming method for metal film Granted JPS5573892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14754878A JPS5573892A (en) 1978-11-29 1978-11-29 Pattern forming method for metal film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14754878A JPS5573892A (en) 1978-11-29 1978-11-29 Pattern forming method for metal film

Publications (2)

Publication Number Publication Date
JPS5573892A true JPS5573892A (en) 1980-06-03
JPS5721036B2 JPS5721036B2 (en) 1982-05-04

Family

ID=15432805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14754878A Granted JPS5573892A (en) 1978-11-29 1978-11-29 Pattern forming method for metal film

Country Status (1)

Country Link
JP (1) JPS5573892A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138090A (en) * 1982-02-12 1983-08-16 株式会社日立製作所 Method of producing printed circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61291050A (en) * 1985-06-18 1986-12-20 川崎重工業株式会社 Pressure type upright crusher

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138090A (en) * 1982-02-12 1983-08-16 株式会社日立製作所 Method of producing printed circuit board

Also Published As

Publication number Publication date
JPS5721036B2 (en) 1982-05-04

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