JPS6473087A - Formation of metallic pattern - Google Patents

Abstract

PURPOSE:To form a desired metallic pattern with high accuracy by substituting the resist pattern formed on the surface of a metallic substrate with a thin metallic film pattern and subjecting the substrate surface to a wet etching treatment with said pattern as a mask. CONSTITUTION:A resist film 2 is formed on the surface 1a of the iron substrate 1 and is subjected to patterning and exposing by using a mask 3 having the pattern reversed in groove parts and peak parts from the pattern of a grooved scale to be obtd. This substrate 1 is then subjected to an immersing treatment with a developing soln. to form the resist pattern 4 consisting of opening parts 4a from which the exposed parts are dissolved away and residual parts 4b. The substrate is then treated in a vacuum deposition device to form the thin metallic film 5 by evaporation on the resist pattern 4 consisting of the residual parts 4b and the opening parts 4a; thereafter, the substrate is immersed in a stripping soln. to remove the residual parts 4b together with the thin metallic films 5a thereon. Only the thin metallic films 5b in the opening parts 4a are, therefore, left and the thin film mask 6 of the reverse pattern is formed. The substrate surface 1a protected with this mask 6 is etched to form the metallic pattern 7 having the grooves 7a of a semicircular shape in section.