JP4488684B2 - 多層プリント配線板 - Google Patents

多層プリント配線板 Download PDF

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Publication number
JP4488684B2
JP4488684B2 JP2003064986A JP2003064986A JP4488684B2 JP 4488684 B2 JP4488684 B2 JP 4488684B2 JP 2003064986 A JP2003064986 A JP 2003064986A JP 2003064986 A JP2003064986 A JP 2003064986A JP 4488684 B2 JP4488684 B2 JP 4488684B2
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JP
Japan
Prior art keywords
layer
conductor layer
conductor
core substrate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003064986A
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English (en)
Japanese (ja)
Other versions
JP2004134724A5 (enExample
JP2004134724A (ja
Inventor
靖 稲垣
克幸 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003064986A priority Critical patent/JP4488684B2/ja
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to CNB038189763A priority patent/CN100461383C/zh
Priority to KR1020117007314A priority patent/KR20110040991A/ko
Priority to PCT/JP2003/003561 priority patent/WO2004015765A1/ja
Priority to CN2008101881858A priority patent/CN101471323B/zh
Priority to EP12154254A priority patent/EP2458631A2/en
Priority to KR1020097001794A priority patent/KR20090014425A/ko
Priority to EP03712876A priority patent/EP1553626A4/en
Priority to KR1020117007312A priority patent/KR20110040990A/ko
Priority to US10/522,335 priority patent/US7507913B2/en
Publication of JP2004134724A publication Critical patent/JP2004134724A/ja
Publication of JP2004134724A5 publication Critical patent/JP2004134724A5/ja
Priority to US12/124,635 priority patent/US20080296052A1/en
Priority to US12/649,038 priority patent/US8592688B2/en
Application granted granted Critical
Publication of JP4488684B2 publication Critical patent/JP4488684B2/ja
Priority to US13/872,650 priority patent/US20130248234A1/en
Priority to US13/936,420 priority patent/US9226397B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2003064986A 2002-08-09 2003-03-11 多層プリント配線板 Expired - Lifetime JP4488684B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2003064986A JP4488684B2 (ja) 2002-08-09 2003-03-11 多層プリント配線板
US10/522,335 US7507913B2 (en) 2002-08-09 2003-03-24 Multilayer printed wiring board
PCT/JP2003/003561 WO2004015765A1 (ja) 2002-08-09 2003-03-24 多層プリント配線板
CN2008101881858A CN101471323B (zh) 2002-08-09 2003-03-24 多层印刷线路板
EP12154254A EP2458631A2 (en) 2002-08-09 2003-03-24 Multilayer printed wiring board
KR1020097001794A KR20090014425A (ko) 2002-08-09 2003-03-24 다층프린트배선판
EP03712876A EP1553626A4 (en) 2002-08-09 2003-03-24 MULTILAYER CONDUCTOR PLATE
KR1020117007312A KR20110040990A (ko) 2002-08-09 2003-03-24 다층프린트배선판
CNB038189763A CN100461383C (zh) 2002-08-09 2003-03-24 多层印刷线路板
KR1020117007314A KR20110040991A (ko) 2002-08-09 2003-03-24 다층프린트배선판
US12/124,635 US20080296052A1 (en) 2002-08-09 2008-05-21 Multilayer printed wiring board
US12/649,038 US8592688B2 (en) 2002-08-09 2009-12-29 Multilayer printed wiring board
US13/872,650 US20130248234A1 (en) 2002-08-09 2013-04-29 Multilayer Printed Wiring Board
US13/936,420 US9226397B2 (en) 2002-08-09 2013-07-08 Multilayer printed wiring board having multilayer core substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002233775 2002-08-09
JP2003064986A JP4488684B2 (ja) 2002-08-09 2003-03-11 多層プリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009252024A Division JP4947121B2 (ja) 2002-08-09 2009-11-02 多層プリント配線板

Publications (3)

Publication Number Publication Date
JP2004134724A JP2004134724A (ja) 2004-04-30
JP2004134724A5 JP2004134724A5 (enExample) 2005-02-03
JP4488684B2 true JP4488684B2 (ja) 2010-06-23

Family

ID=31719878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003064986A Expired - Lifetime JP4488684B2 (ja) 2002-08-09 2003-03-11 多層プリント配線板

Country Status (6)

Country Link
US (5) US7507913B2 (enExample)
EP (2) EP2458631A2 (enExample)
JP (1) JP4488684B2 (enExample)
KR (3) KR20110040990A (enExample)
CN (1) CN100461383C (enExample)
WO (1) WO2004015765A1 (enExample)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2081419B1 (en) * 1999-09-02 2013-08-07 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
CN101232776B (zh) * 1999-09-02 2011-04-20 揖斐电株式会社 印刷布线板
JP4488684B2 (ja) 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
JP4501464B2 (ja) * 2003-04-25 2010-07-14 株式会社デンソー 厚膜回路基板、その製造方法および集積回路装置
TWI335195B (en) * 2003-12-16 2010-12-21 Ngk Spark Plug Co Multilayer wiring board
WO2005076682A1 (ja) 2004-02-04 2005-08-18 Ibiden Co., Ltd. 多層プリント配線板
KR101107976B1 (ko) 2004-02-04 2012-01-30 이비덴 가부시키가이샤 다층프린트배선판
JP4605446B2 (ja) * 2004-09-08 2011-01-05 日立化成工業株式会社 多層配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法
JP4551730B2 (ja) 2004-10-15 2010-09-29 イビデン株式会社 多層コア基板及びその製造方法
US7353490B2 (en) 2004-10-29 2008-04-01 Synopsys, Inc. Power network synthesizer for an integrated circuit design
US7536658B2 (en) * 2004-10-29 2009-05-19 Synopsys, Inc. Power pad synthesizer for an integrated circuit design
US7346869B2 (en) * 2004-10-29 2008-03-18 Synopsys, Inc. Power network analyzer for an integrated circuit design
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
JP2006216714A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2006216711A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2007027683A (ja) * 2005-06-15 2007-02-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US7621041B2 (en) 2005-07-11 2009-11-24 E. I. Du Pont De Nemours And Company Methods for forming multilayer structures
KR101477604B1 (ko) * 2006-03-06 2014-12-30 스테블코, 인코포레이티드 전기 도전성 제한 코어를 갖는 인쇄 배선 기판을 제조하는 방법
JP2007242879A (ja) * 2006-03-08 2007-09-20 Nec Toppan Circuit Solutions Inc サブユニット基板
WO2007142138A1 (ja) * 2006-06-08 2007-12-13 Nec Corporation ２t２mtjセルを用いたmram
JP2008016630A (ja) * 2006-07-06 2008-01-24 Matsushita Electric Ind Co Ltd プリント配線板およびその製造方法
JP4870584B2 (ja) * 2007-01-19 2012-02-08 ルネサスエレクトロニクス株式会社 半導体装置
US8440916B2 (en) * 2007-06-28 2013-05-14 Intel Corporation Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
US8877565B2 (en) * 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
CN101527266B (zh) * 2008-03-06 2012-03-07 钰桥半导体股份有限公司 增层线路板的制作方法
JP2009290124A (ja) * 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板
JP5217639B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 コア基板およびプリント配線板
JP2009290135A (ja) * 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板の製造方法および導電性接合剤
JP5217640B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
US20090321119A1 (en) * 2008-06-30 2009-12-31 Yasuhiro Kohara Device mounting board, semiconductor module, mobile device, and manufacturing method of device mounting board
KR20110047795A (ko) * 2009-10-30 2011-05-09 삼성전기주식회사 범프가 구비된 인쇄회로기판의 제조방법
JP5351201B2 (ja) * 2011-03-25 2013-11-27 株式会社東芝 不揮発性半導体記憶装置及びその製造方法
US8895873B2 (en) * 2011-09-28 2014-11-25 Ibiden Co., Ltd. Printed wiring board
US20130146345A1 (en) * 2011-12-12 2013-06-13 Kazuki KAJIHARA Printed wiring board and method for manufacturing the same
JP6208411B2 (ja) * 2012-06-15 2017-10-04 新光電気工業株式会社 配線基板及びその製造方法
JP5994484B2 (ja) * 2012-08-24 2016-09-21 イビデン株式会社 プリント配線板
JP6036837B2 (ja) * 2012-09-26 2016-11-30 日立化成株式会社 多層配線板、及び、多層配線板の製造方法
JP6282425B2 (ja) * 2012-10-29 2018-02-21 新光電気工業株式会社 配線基板の製造方法
JP2014216375A (ja) * 2013-04-23 2014-11-17 イビデン株式会社 プリント配線板及び多層コア基板の製造方法
KR20150070810A (ko) * 2013-12-17 2015-06-25 삼성전기주식회사 캐패시터 내장 기판 및 그 제조 방법
US10420204B2 (en) * 2014-03-07 2019-09-17 Bridge Semiconductor Corporation Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same
US11291146B2 (en) 2014-03-07 2022-03-29 Bridge Semiconductor Corp. Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same
JP6341714B2 (ja) 2014-03-25 2018-06-13 新光電気工業株式会社 配線基板及びその製造方法
JP2016063130A (ja) * 2014-09-19 2016-04-25 イビデン株式会社 プリント配線板および半導体パッケージ
CN104392934A (zh) * 2014-10-31 2015-03-04 华进半导体封装先导技术研发中心有限公司 封装基板的阻焊制作方法
KR102268781B1 (ko) * 2014-11-12 2021-06-28 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
CN104505383B (zh) * 2014-12-16 2017-11-07 大连理工大学 减小肌肤效应的高频信号金属导线和基底之间的布局方法
JP6657609B2 (ja) * 2015-06-12 2020-03-04 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法および半導体装置の製造方法
KR101702446B1 (ko) 2015-06-17 2017-02-03 주식회사 포스코 금속 소재의 절단부 절삭 장치
CN108369832B (zh) * 2015-07-15 2020-02-21 印刷电路板公司 制造印刷电路板的方法
TWI599003B (zh) * 2015-09-07 2017-09-11 鈺橋半導體股份有限公司 具有內建金屬塊以及防潮蓋之散熱增益型線路板及其製備方法
TWI611541B (zh) * 2015-09-07 2018-01-11 鈺橋半導體股份有限公司 具有內建電性隔離件以及防潮蓋之線路板製備方法及其半導體組體
JP6531603B2 (ja) * 2015-10-01 2019-06-19 富士通株式会社 電子部品、電子装置及び電子装置の製造方法
JP2017103282A (ja) * 2015-11-30 2017-06-08 イビデン株式会社 プリント配線板
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
US10804251B2 (en) 2016-11-22 2020-10-13 Cree, Inc. Light emitting diode (LED) devices, components and methods
MY192082A (en) * 2016-12-27 2022-07-26 Intel Corp Interconnect core
KR20190012485A (ko) * 2017-07-27 2019-02-11 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US11291164B2 (en) 2018-08-24 2022-04-05 Seoul Viosys Co., Ltd. Light source for plant cultivation
US10624213B1 (en) * 2018-12-20 2020-04-14 Intel Corporation Asymmetric electronic substrate and method of manufacture
CN111508926B (zh) * 2019-01-31 2022-08-30 奥特斯(中国)有限公司 一种部件承载件以及制造部件承载件的方法
JP2021022615A (ja) * 2019-07-25 2021-02-18 イビデン株式会社 プリント配線板
CN113545170A (zh) * 2019-10-31 2021-10-22 鹏鼎控股(深圳)股份有限公司 薄型电路板及其制造方法
CN110792657B (zh) * 2019-11-20 2021-06-04 兰州理工大学 一种表面织构化复合型液压静音罩板材
CN112867243A (zh) * 2021-01-06 2021-05-28 英韧科技(上海)有限公司 多层电路板
KR20250030585A (ko) * 2023-08-25 2025-03-05 삼성전기주식회사 인쇄회로기판
US12538427B2 (en) * 2023-09-26 2026-01-27 Garuda Technology Co., Ltd. Circuit board and method of manufacturing the same

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE124599T1 (de) * 1990-04-05 1995-07-15 Dyconex Ag Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte.
US5306670A (en) * 1993-02-09 1994-04-26 Texas Instruments Incorporated Multi-chip integrated circuit module and method for fabrication thereof
JPH06260756A (ja) 1993-03-04 1994-09-16 Ibiden Co Ltd プリント配線板の製造方法
JPH06275959A (ja) 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法
TW331698B (en) * 1996-06-18 1998-05-11 Hitachi Chemical Co Ltd Multi-layered printed circuit board
JP3961092B2 (ja) 1997-06-03 2007-08-15 株式会社東芝 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
US6165892A (en) * 1998-07-31 2000-12-26 Kulicke & Soffa Holdings, Inc. Method of planarizing thin film layers deposited over a common circuit base
US6323435B1 (en) * 1998-07-31 2001-11-27 Kulicke & Soffa Holdings, Inc. Low-impedance high-density deposited-on-laminate structures having reduced stress
US6440641B1 (en) * 1998-07-31 2002-08-27 Kulicke & Soffa Holdings, Inc. Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
MY128333A (en) * 1998-09-14 2007-01-31 Ibiden Co Ltd Printed wiring board and its manufacturing method
JP4117951B2 (ja) * 1998-11-20 2008-07-16 イビデン株式会社 多層プリント配線板の製造方法及び多層プリント配線板
JP2000244130A (ja) * 1998-12-25 2000-09-08 Ngk Spark Plug Co Ltd 配線基板、コア基板及びその製造方法
US6214445B1 (en) * 1998-12-25 2001-04-10 Ngk Spark Plug Co., Ltd. Printed wiring board, core substrate, and method for fabricating the core substrate
JP3694601B2 (ja) * 1998-12-25 2005-09-14 京セラ株式会社 多層配線基板
US6333857B1 (en) * 1998-12-25 2001-12-25 Ngk Spark Plug Co., Ltd. Printing wiring board, core substrate, and method for fabricating the core substrate
JP3592129B2 (ja) * 1999-04-15 2004-11-24 新光電気工業株式会社 多層配線基板の製造方法
EP2081419B1 (en) * 1999-09-02 2013-08-07 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
JP3608990B2 (ja) * 1999-10-19 2005-01-12 新光電気工業株式会社 多層回路基板およびその製造方法
JP4468527B2 (ja) * 1999-11-26 2010-05-26 イビデン株式会社 多層プリント配線板およびその製造方法。
JP4863546B2 (ja) 2000-07-21 2012-01-25 イビデン株式会社 コンデンサ内蔵プリント配線板及びコンデンサ内蔵プリント配線板の製造方法
JP4023076B2 (ja) * 2000-07-27 2007-12-19 富士通株式会社 表裏導通基板及びその製造方法
TW533758B (en) * 2000-07-31 2003-05-21 Ngk Spark Plug Co Printed wiring substrate and method for manufacturing the same
JP2002204076A (ja) * 2000-12-28 2002-07-19 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2001244591A (ja) * 2001-02-06 2001-09-07 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
WO2002067638A1 (en) * 2001-02-19 2002-08-29 Sony Corporation Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board
US6713860B2 (en) * 2002-02-01 2004-03-30 Intel Corporation Electronic assembly and system with vertically connected capacitors
JP2003023250A (ja) * 2001-07-06 2003-01-24 Denso Corp 多層基板のおよびその製造方法
US7129158B2 (en) * 2001-09-28 2006-10-31 Ibiden Co., Ltd. Printed wiring board and production method for printed wiring board
JP4488684B2 (ja) * 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
WO2005032227A1 (ja) * 2003-09-29 2005-04-07 Ibiden Co., Ltd. プリント配線板用層間絶縁層、プリント配線板およびその製造方法
KR101107976B1 (ko) 2004-02-04 2012-01-30 이비덴 가부시키가이샤 다층프린트배선판
WO2005076682A1 (ja) 2004-02-04 2005-08-18 Ibiden Co., Ltd. 多層プリント配線板

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US20130248234A1 (en) 2013-09-26
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US20080296052A1 (en) 2008-12-04
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EP2458631A2 (en) 2012-05-30
WO2004015765A1 (ja) 2004-02-19
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US9226397B2 (en) 2015-12-29
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