JP2004134724A5 - - Google Patents
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- Publication number
- JP2004134724A5 JP2004134724A5 JP2003064986A JP2003064986A JP2004134724A5 JP 2004134724 A5 JP2004134724 A5 JP 2004134724A5 JP 2003064986 A JP2003064986 A JP 2003064986A JP 2003064986 A JP2003064986 A JP 2003064986A JP 2004134724 A5 JP2004134724 A5 JP 2004134724A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor layer
- core substrate
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 64
- 239000004020 conductor Substances 0.000 claims 37
- 239000000758 substrate Substances 0.000 claims 19
- 239000011229 interlayer Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003064986A JP4488684B2 (ja) | 2002-08-09 | 2003-03-11 | 多層プリント配線板 |
| US10/522,335 US7507913B2 (en) | 2002-08-09 | 2003-03-24 | Multilayer printed wiring board |
| EP12154254A EP2458631A2 (en) | 2002-08-09 | 2003-03-24 | Multilayer printed wiring board |
| PCT/JP2003/003561 WO2004015765A1 (ja) | 2002-08-09 | 2003-03-24 | 多層プリント配線板 |
| CN2008101881858A CN101471323B (zh) | 2002-08-09 | 2003-03-24 | 多层印刷线路板 |
| KR1020117007312A KR20110040990A (ko) | 2002-08-09 | 2003-03-24 | 다층프린트배선판 |
| EP03712876A EP1553626A4 (en) | 2002-08-09 | 2003-03-24 | MULTILAYER CONDUCTOR PLATE |
| KR1020097001794A KR20090014425A (ko) | 2002-08-09 | 2003-03-24 | 다층프린트배선판 |
| KR1020117007314A KR20110040991A (ko) | 2002-08-09 | 2003-03-24 | 다층프린트배선판 |
| CNB038189763A CN100461383C (zh) | 2002-08-09 | 2003-03-24 | 多层印刷线路板 |
| US12/124,635 US20080296052A1 (en) | 2002-08-09 | 2008-05-21 | Multilayer printed wiring board |
| US12/649,038 US8592688B2 (en) | 2002-08-09 | 2009-12-29 | Multilayer printed wiring board |
| US13/872,650 US20130248234A1 (en) | 2002-08-09 | 2013-04-29 | Multilayer Printed Wiring Board |
| US13/936,420 US9226397B2 (en) | 2002-08-09 | 2013-07-08 | Multilayer printed wiring board having multilayer core substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002233775 | 2002-08-09 | ||
| JP2003064986A JP4488684B2 (ja) | 2002-08-09 | 2003-03-11 | 多層プリント配線板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009252024A Division JP4947121B2 (ja) | 2002-08-09 | 2009-11-02 | 多層プリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004134724A JP2004134724A (ja) | 2004-04-30 |
| JP2004134724A5 true JP2004134724A5 (enExample) | 2005-02-03 |
| JP4488684B2 JP4488684B2 (ja) | 2010-06-23 |
Family
ID=31719878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003064986A Expired - Lifetime JP4488684B2 (ja) | 2002-08-09 | 2003-03-11 | 多層プリント配線板 |
Country Status (6)
| Country | Link |
|---|---|
| US (5) | US7507913B2 (enExample) |
| EP (2) | EP1553626A4 (enExample) |
| JP (1) | JP4488684B2 (enExample) |
| KR (3) | KR20090014425A (enExample) |
| CN (1) | CN100461383C (enExample) |
| WO (1) | WO2004015765A1 (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1137332B1 (en) * | 1999-09-02 | 2006-11-22 | Ibiden Co., Ltd. | Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| EP1771050B1 (en) * | 1999-09-02 | 2011-06-15 | Ibiden Co., Ltd. | Printed circuit board and method of manufacturing printed circuit board |
| JP4488684B2 (ja) * | 2002-08-09 | 2010-06-23 | イビデン株式会社 | 多層プリント配線板 |
| JP4501464B2 (ja) * | 2003-04-25 | 2010-07-14 | 株式会社デンソー | 厚膜回路基板、その製造方法および集積回路装置 |
| TWI335195B (en) * | 2003-12-16 | 2010-12-21 | Ngk Spark Plug Co | Multilayer wiring board |
| TW200806144A (en) * | 2004-02-04 | 2008-01-16 | Ibiden Co Ltd | Multilayer printed wiring board |
| KR20080088670A (ko) * | 2004-02-04 | 2008-10-02 | 이비덴 가부시키가이샤 | 다층프린트배선판 |
| JP4605446B2 (ja) * | 2004-09-08 | 2011-01-05 | 日立化成工業株式会社 | 多層配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法 |
| JP4551730B2 (ja) | 2004-10-15 | 2010-09-29 | イビデン株式会社 | 多層コア基板及びその製造方法 |
| US7353490B2 (en) | 2004-10-29 | 2008-04-01 | Synopsys, Inc. | Power network synthesizer for an integrated circuit design |
| US7536658B2 (en) * | 2004-10-29 | 2009-05-19 | Synopsys, Inc. | Power pad synthesizer for an integrated circuit design |
| US7346869B2 (en) | 2004-10-29 | 2008-03-18 | Synopsys, Inc. | Power network analyzer for an integrated circuit design |
| US7778038B2 (en) | 2004-12-21 | 2010-08-17 | E.I. Du Pont De Nemours And Company | Power core devices and methods of making thereof |
| JP2006216711A (ja) * | 2005-02-02 | 2006-08-17 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2006216712A (ja) * | 2005-02-02 | 2006-08-17 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2007027683A (ja) * | 2005-06-15 | 2007-02-01 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
| US7621041B2 (en) | 2005-07-11 | 2009-11-24 | E. I. Du Pont De Nemours And Company | Methods for forming multilayer structures |
| CN101437676B (zh) * | 2006-03-06 | 2014-01-29 | 斯塔布科尔技术公司 | 制作具有导电加强芯板的印刷线路板的程序 |
| JP2007242879A (ja) * | 2006-03-08 | 2007-09-20 | Nec Toppan Circuit Solutions Inc | サブユニット基板 |
| JP5045672B2 (ja) * | 2006-06-08 | 2012-10-10 | 日本電気株式会社 | 2t2mtjセルを用いたmram |
| JP2008016630A (ja) * | 2006-07-06 | 2008-01-24 | Matsushita Electric Ind Co Ltd | プリント配線板およびその製造方法 |
| JP4870584B2 (ja) * | 2007-01-19 | 2012-02-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US8440916B2 (en) | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
| US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
| CN101527266B (zh) * | 2008-03-06 | 2012-03-07 | 钰桥半导体股份有限公司 | 增层线路板的制作方法 |
| JP5217639B2 (ja) * | 2008-05-30 | 2013-06-19 | 富士通株式会社 | コア基板およびプリント配線板 |
| JP5217640B2 (ja) * | 2008-05-30 | 2013-06-19 | 富士通株式会社 | プリント配線板の製造方法およびプリント基板ユニットの製造方法 |
| JP2009290135A (ja) * | 2008-05-30 | 2009-12-10 | Fujitsu Ltd | プリント配線板の製造方法および導電性接合剤 |
| JP2009290124A (ja) * | 2008-05-30 | 2009-12-10 | Fujitsu Ltd | プリント配線板 |
| US20090321119A1 (en) * | 2008-06-30 | 2009-12-31 | Yasuhiro Kohara | Device mounting board, semiconductor module, mobile device, and manufacturing method of device mounting board |
| KR20110047795A (ko) * | 2009-10-30 | 2011-05-09 | 삼성전기주식회사 | 범프가 구비된 인쇄회로기판의 제조방법 |
| JP5351201B2 (ja) * | 2011-03-25 | 2013-11-27 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
| US8895873B2 (en) | 2011-09-28 | 2014-11-25 | Ibiden Co., Ltd. | Printed wiring board |
| US20130146345A1 (en) * | 2011-12-12 | 2013-06-13 | Kazuki KAJIHARA | Printed wiring board and method for manufacturing the same |
| JP6208411B2 (ja) * | 2012-06-15 | 2017-10-04 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP5994484B2 (ja) * | 2012-08-24 | 2016-09-21 | イビデン株式会社 | プリント配線板 |
| WO2014050995A1 (ja) * | 2012-09-26 | 2014-04-03 | 日立化成株式会社 | 多層配線板、及び、多層配線板の製造方法 |
| JP6282425B2 (ja) * | 2012-10-29 | 2018-02-21 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP2014216375A (ja) * | 2013-04-23 | 2014-11-17 | イビデン株式会社 | プリント配線板及び多層コア基板の製造方法 |
| KR20150070810A (ko) * | 2013-12-17 | 2015-06-25 | 삼성전기주식회사 | 캐패시터 내장 기판 및 그 제조 방법 |
| US11291146B2 (en) | 2014-03-07 | 2022-03-29 | Bridge Semiconductor Corp. | Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same |
| US10420204B2 (en) * | 2014-03-07 | 2019-09-17 | Bridge Semiconductor Corporation | Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same |
| JP6341714B2 (ja) * | 2014-03-25 | 2018-06-13 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP2016063130A (ja) * | 2014-09-19 | 2016-04-25 | イビデン株式会社 | プリント配線板および半導体パッケージ |
| CN104392934A (zh) * | 2014-10-31 | 2015-03-04 | 华进半导体封装先导技术研发中心有限公司 | 封装基板的阻焊制作方法 |
| KR102268781B1 (ko) * | 2014-11-12 | 2021-06-28 | 삼성전자주식회사 | 인쇄회로기판 및 이를 포함하는 반도체 패키지 |
| CN104505383B (zh) * | 2014-12-16 | 2017-11-07 | 大连理工大学 | 减小肌肤效应的高频信号金属导线和基底之间的布局方法 |
| JP6657609B2 (ja) * | 2015-06-12 | 2020-03-04 | 凸版印刷株式会社 | 配線回路基板、半導体装置、配線回路基板の製造方法および半導体装置の製造方法 |
| KR101702446B1 (ko) | 2015-06-17 | 2017-02-03 | 주식회사 포스코 | 금속 소재의 절단부 절삭 장치 |
| CN111263535A (zh) * | 2015-07-15 | 2020-06-09 | 印刷电路板公司 | 制造印刷电路板的方法 |
| TWI611541B (zh) * | 2015-09-07 | 2018-01-11 | 鈺橋半導體股份有限公司 | 具有內建電性隔離件以及防潮蓋之線路板製備方法及其半導體組體 |
| TWI599003B (zh) * | 2015-09-07 | 2017-09-11 | 鈺橋半導體股份有限公司 | 具有內建金屬塊以及防潮蓋之散熱增益型線路板及其製備方法 |
| JP6531603B2 (ja) * | 2015-10-01 | 2019-06-19 | 富士通株式会社 | 電子部品、電子装置及び電子装置の製造方法 |
| JP2017103282A (ja) * | 2015-11-30 | 2017-06-08 | イビデン株式会社 | プリント配線板 |
| WO2017154167A1 (ja) * | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
| US10804251B2 (en) | 2016-11-22 | 2020-10-13 | Cree, Inc. | Light emitting diode (LED) devices, components and methods |
| MY192082A (en) * | 2016-12-27 | 2022-07-26 | Intel Corp | Interconnect core |
| KR20190012485A (ko) * | 2017-07-27 | 2019-02-11 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
| US11291164B2 (en) | 2018-08-24 | 2022-04-05 | Seoul Viosys Co., Ltd. | Light source for plant cultivation |
| US10624213B1 (en) * | 2018-12-20 | 2020-04-14 | Intel Corporation | Asymmetric electronic substrate and method of manufacture |
| CN111508926B (zh) * | 2019-01-31 | 2022-08-30 | 奥特斯(中国)有限公司 | 一种部件承载件以及制造部件承载件的方法 |
| JP2021022615A (ja) * | 2019-07-25 | 2021-02-18 | イビデン株式会社 | プリント配線板 |
| CN113545170A (zh) * | 2019-10-31 | 2021-10-22 | 鹏鼎控股(深圳)股份有限公司 | 薄型电路板及其制造方法 |
| CN110792657B (zh) * | 2019-11-20 | 2021-06-04 | 兰州理工大学 | 一种表面织构化复合型液压静音罩板材 |
| CN112867243A (zh) * | 2021-01-06 | 2021-05-28 | 英韧科技(上海)有限公司 | 多层电路板 |
| US20250107005A1 (en) * | 2023-09-26 | 2025-03-27 | Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. | Circuit board and method of manufacturing the same |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE124599T1 (de) * | 1990-04-05 | 1995-07-15 | Dyconex Ag | Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte. |
| US5306670A (en) * | 1993-02-09 | 1994-04-26 | Texas Instruments Incorporated | Multi-chip integrated circuit module and method for fabrication thereof |
| JPH06260756A (ja) | 1993-03-04 | 1994-09-16 | Ibiden Co Ltd | プリント配線板の製造方法 |
| JPH06275959A (ja) | 1993-03-22 | 1994-09-30 | Hitachi Ltd | 多層配線基板とその製造方法および両面プリント配線板の製造方法 |
| TW331698B (en) * | 1996-06-18 | 1998-05-11 | Hitachi Chemical Co Ltd | Multi-layered printed circuit board |
| JP3961092B2 (ja) | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
| US6165892A (en) * | 1998-07-31 | 2000-12-26 | Kulicke & Soffa Holdings, Inc. | Method of planarizing thin film layers deposited over a common circuit base |
| US6323435B1 (en) * | 1998-07-31 | 2001-11-27 | Kulicke & Soffa Holdings, Inc. | Low-impedance high-density deposited-on-laminate structures having reduced stress |
| US6440641B1 (en) * | 1998-07-31 | 2002-08-27 | Kulicke & Soffa Holdings, Inc. | Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| JP4117951B2 (ja) * | 1998-11-20 | 2008-07-16 | イビデン株式会社 | 多層プリント配線板の製造方法及び多層プリント配線板 |
| MY144503A (en) | 1998-09-14 | 2011-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
| US6214445B1 (en) * | 1998-12-25 | 2001-04-10 | Ngk Spark Plug Co., Ltd. | Printed wiring board, core substrate, and method for fabricating the core substrate |
| JP3694601B2 (ja) * | 1998-12-25 | 2005-09-14 | 京セラ株式会社 | 多層配線基板 |
| US6333857B1 (en) * | 1998-12-25 | 2001-12-25 | Ngk Spark Plug Co., Ltd. | Printing wiring board, core substrate, and method for fabricating the core substrate |
| JP2000244130A (ja) * | 1998-12-25 | 2000-09-08 | Ngk Spark Plug Co Ltd | 配線基板、コア基板及びその製造方法 |
| JP3592129B2 (ja) * | 1999-04-15 | 2004-11-24 | 新光電気工業株式会社 | 多層配線基板の製造方法 |
| EP1771050B1 (en) | 1999-09-02 | 2011-06-15 | Ibiden Co., Ltd. | Printed circuit board and method of manufacturing printed circuit board |
| JP3608990B2 (ja) * | 1999-10-19 | 2005-01-12 | 新光電気工業株式会社 | 多層回路基板およびその製造方法 |
| JP4468527B2 (ja) * | 1999-11-26 | 2010-05-26 | イビデン株式会社 | 多層プリント配線板およびその製造方法。 |
| JP4863546B2 (ja) | 2000-07-21 | 2012-01-25 | イビデン株式会社 | コンデンサ内蔵プリント配線板及びコンデンサ内蔵プリント配線板の製造方法 |
| JP4023076B2 (ja) * | 2000-07-27 | 2007-12-19 | 富士通株式会社 | 表裏導通基板及びその製造方法 |
| TW533758B (en) * | 2000-07-31 | 2003-05-21 | Ngk Spark Plug Co | Printed wiring substrate and method for manufacturing the same |
| JP2002204076A (ja) * | 2000-12-28 | 2002-07-19 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| JP2001244591A (ja) * | 2001-02-06 | 2001-09-07 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
| US20040108862A1 (en) * | 2001-02-19 | 2004-06-10 | Kenji Azuma | Printed wiring board, multilayer printed wiring board, and method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
| US6713860B2 (en) * | 2002-02-01 | 2004-03-30 | Intel Corporation | Electronic assembly and system with vertically connected capacitors |
| JP2003023250A (ja) * | 2001-07-06 | 2003-01-24 | Denso Corp | 多層基板のおよびその製造方法 |
| EP1915040A3 (en) * | 2001-09-28 | 2008-04-30 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
| JP4488684B2 (ja) * | 2002-08-09 | 2010-06-23 | イビデン株式会社 | 多層プリント配線板 |
| EP1633175A4 (en) * | 2003-09-29 | 2009-11-11 | Ibiden Co Ltd | INTERLAYER INSULATION LAYER FOR A PCB, PCB AND METHOD OF MANUFACTURING THEREOF |
| KR20080088670A (ko) | 2004-02-04 | 2008-10-02 | 이비덴 가부시키가이샤 | 다층프린트배선판 |
| TW200806144A (en) * | 2004-02-04 | 2008-01-16 | Ibiden Co Ltd | Multilayer printed wiring board |
-
2003
- 2003-03-11 JP JP2003064986A patent/JP4488684B2/ja not_active Expired - Lifetime
- 2003-03-24 CN CNB038189763A patent/CN100461383C/zh not_active Expired - Lifetime
- 2003-03-24 EP EP03712876A patent/EP1553626A4/en not_active Withdrawn
- 2003-03-24 WO PCT/JP2003/003561 patent/WO2004015765A1/ja not_active Ceased
- 2003-03-24 KR KR1020097001794A patent/KR20090014425A/ko not_active Ceased
- 2003-03-24 KR KR1020117007312A patent/KR20110040990A/ko not_active Ceased
- 2003-03-24 US US10/522,335 patent/US7507913B2/en not_active Expired - Lifetime
- 2003-03-24 EP EP12154254A patent/EP2458631A2/en not_active Withdrawn
- 2003-03-24 KR KR1020117007314A patent/KR20110040991A/ko not_active Ceased
-
2008
- 2008-05-21 US US12/124,635 patent/US20080296052A1/en not_active Abandoned
-
2009
- 2009-12-29 US US12/649,038 patent/US8592688B2/en not_active Expired - Lifetime
-
2013
- 2013-04-29 US US13/872,650 patent/US20130248234A1/en not_active Abandoned
- 2013-07-08 US US13/936,420 patent/US9226397B2/en not_active Expired - Fee Related
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