JP2001007456A5 - - Google Patents

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Publication number
JP2001007456A5
JP2001007456A5 JP1999171695A JP17169599A JP2001007456A5 JP 2001007456 A5 JP2001007456 A5 JP 2001007456A5 JP 1999171695 A JP1999171695 A JP 1999171695A JP 17169599 A JP17169599 A JP 17169599A JP 2001007456 A5 JP2001007456 A5 JP 2001007456A5
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JP
Japan
Prior art keywords
wiring
circuit board
conductor pattern
insulating substrate
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999171695A
Other languages
English (en)
Japanese (ja)
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JP2001007456A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP17169599A priority Critical patent/JP2001007456A/ja
Priority claimed from JP17169599A external-priority patent/JP2001007456A/ja
Publication of JP2001007456A publication Critical patent/JP2001007456A/ja
Publication of JP2001007456A5 publication Critical patent/JP2001007456A5/ja
Pending legal-status Critical Current

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JP17169599A 1999-06-17 1999-06-17 配線回路基板 Pending JP2001007456A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17169599A JP2001007456A (ja) 1999-06-17 1999-06-17 配線回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17169599A JP2001007456A (ja) 1999-06-17 1999-06-17 配線回路基板

Publications (2)

Publication Number Publication Date
JP2001007456A JP2001007456A (ja) 2001-01-12
JP2001007456A5 true JP2001007456A5 (enExample) 2005-01-06

Family

ID=15927983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17169599A Pending JP2001007456A (ja) 1999-06-17 1999-06-17 配線回路基板

Country Status (1)

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JP (1) JP2001007456A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4721534B2 (ja) * 2001-02-21 2011-07-13 京セラ株式会社 セラミック回路基板
JP4721533B2 (ja) * 2001-02-21 2011-07-13 京セラ株式会社 セラミック回路基板
JP4614788B2 (ja) * 2005-02-25 2011-01-19 京セラ株式会社 配線基板
JP5010669B2 (ja) * 2009-12-07 2012-08-29 パナソニック株式会社 配線基板及びその製造方法
JP2015208200A (ja) * 2014-04-23 2015-11-19 株式会社デンソー 電源装置
JP2016092053A (ja) * 2014-10-30 2016-05-23 京セラサーキットソリューションズ株式会社 配線基板
JP6640508B2 (ja) * 2015-09-25 2020-02-05 京セラ株式会社 印刷配線板の製造方法
JP6604183B2 (ja) * 2015-12-16 2019-11-13 富士電機株式会社 半導体モジュール
CN106604524A (zh) * 2016-11-21 2017-04-26 努比亚技术有限公司 柔性电路板
JP6946776B2 (ja) * 2017-06-26 2021-10-06 株式会社リコー 回路基板
JP7024331B2 (ja) * 2017-11-02 2022-02-24 三菱マテリアル株式会社 絶縁回路基板の製造方法、ヒートシンク付き絶縁回路基板の製造方法、及び、絶縁回路基板の積層構造体の製造方法
WO2021005683A1 (ja) * 2019-07-08 2021-01-14 株式会社Ｆｕｊｉ 回路パターン作成システム、および回路パターン作成方法
JP7019657B2 (ja) * 2019-12-10 2022-02-15 日東電工株式会社 配線回路基板の製造方法
JP7593055B2 (ja) * 2020-10-29 2024-12-03 大日本印刷株式会社 配線基板および配線基板の製造方法
EP4412083A4 (en) * 2021-09-29 2025-09-03 Murata Manufacturing Co TRACKING MODULE AND COMMUNICATION DEVICE
TWI870161B (zh) * 2023-12-15 2025-01-11 同欣電子工業股份有限公司 複合式線路板結構及其製造方法

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