JP2001007456A5 - - Google Patents
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- Publication number
- JP2001007456A5 JP2001007456A5 JP1999171695A JP17169599A JP2001007456A5 JP 2001007456 A5 JP2001007456 A5 JP 2001007456A5 JP 1999171695 A JP1999171695 A JP 1999171695A JP 17169599 A JP17169599 A JP 17169599A JP 2001007456 A5 JP2001007456 A5 JP 2001007456A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- circuit board
- conductor pattern
- insulating substrate
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 description 1
Description
【０００７】
【課題を解決するための手段】
この発明の配線回路基板は、絶縁基板と、前記絶縁基板に導電体パターンとして設けられた配線回路とを具備し、前記配線回路が、第１の厚さを有する前記導電体パターンからなる第１の配線回路部と、前記第１の厚さより厚い第２の厚さを有する前記導電体パターンからなる第２の配線回路部とを備えたことを特徴とする。[0007]
[Means for Solving the Problems]
Printed circuit board of the present invention, the insulation substrate, wherein comprising a wiring circuit provided as a conductor pattern on the insulating substrate, the wiring circuit, the made of the conductor pattern having a first thickness 1 of the wiring circuit section, characterized in that a second wiring circuit portion consisting of the conductor pattern having the first thickness thicker than the second thickness.
【０００８】
ここで、前記第１の配線回路部の前記導電体パターンが有する電流容量が、前記第２の配線回路部の前記導電体パターンが有する電流容量より小さいとすることができる。 [0008]
Here, the current capacity of the conductor pattern of the first wiring circuit section may be smaller than the current capacity of the conductor pattern of the second wiring circuit section.
【０００９】
また、前記配線回路が、前記絶縁基板の表層配線層として設けられたものであり、前記絶縁基板に、内層配線層がさらに設けられるようにしてもよい。 [0009]
The wiring circuit may be provided as a surface wiring layer of the insulating substrate, and an inner wiring layer may be further provided on the insulating substrate.
【００１０】
また、前記配線回路が、前記絶縁基板の内層配線層として設けられたものであり、前記絶縁基板に、表層配線層がさらに設けられるようにしてもよい。 [0010]
The wiring circuit may be provided as an inner wiring layer of the insulating substrate, and a surface wiring layer may be further provided on the insulating substrate.
【００１１】
また、前記絶縁基板が、多層膜からなり、前記配線回路が、前記多層膜の少なくとも２つの層それぞれに存在する、とすることができる。 [0011]
Further, the insulating substrate may be a multilayer film, and the wiring circuit may be present in each of at least two layers of the multilayer film.
【００１２】
また、前記第２の配線回路部は、電源回路に供せられ得る。 [0012]
Further, the second wiring circuit unit may be provided to a power supply circuit.
【００１３】
また、前記第２の配線回路部の前記導電体パターンの厚さが、使用されるべき電流量に応じて部分的に異なっているようにしてもよい。さらに、前記第２の配線回路部が、集合して設けられるようにしてもよい。 [0013]
Further, the thickness of the conductor pattern of the second wiring circuit portion may be partially different depending on the amount of current to be used. Furthermore, the second wiring circuit units may be provided collectively .
【００１４】
また、前記導電体パターンは、幅より厚さが大であるとすることもできる。 [0014]
In addition, the conductor pattern may be thicker than the width.
Claims (9)
前記絶縁基板に導電体パターンとして設けられた配線回路とを具備し、
前記配線回路が、第１の厚さを有する前記導電体パターンからなる第１の配線回路部と、前記第１の厚さより厚い第２の厚さを有する前記導電体パターンからなる第２の配線回路部とを備えたこと
を特徴とする配線回路基板。An insulating substrate,
Comprising a wiring circuit provided as a conductor pattern on the insulating substrate,
A second wiring comprising the first wiring circuit portion including the conductor pattern having a first thickness and the conductor pattern having a second thickness thicker than the first thickness; printed circuit board, characterized in that a circuit portion.
前記絶縁基板に、内層配線層がさらに設けられたこと
を特徴とする請求項２記載の配線回路基板。 The wiring circuit is provided as a surface wiring layer of the insulating substrate;
Wherein the insulating substrate, printed circuit board according to claim 2, wherein the inner wiring layer is further provided.
前記絶縁基板に、表層配線層がさらに設けられたこと
を特徴とする請求項２記載の配線回路基板。 The wiring circuit is provided as an inner wiring layer of the insulating substrate,
Wherein the insulating substrate, printed circuit board according to claim 2, wherein the surface wiring layer is further provided.
前記配線回路が、前記多層膜の少なくとも２つの層それぞれに存在すること
を特徴とする請求項１記載の配線回路基板。 The insulating substrate comprises a multilayer film,
The wiring circuit, printed circuit board according to claim 1, wherein the presence in each of at least two layers of the multilayer film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17169599A JP2001007456A (en) | 1999-06-17 | 1999-06-17 | Wiring circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17169599A JP2001007456A (en) | 1999-06-17 | 1999-06-17 | Wiring circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001007456A JP2001007456A (en) | 2001-01-12 |
| JP2001007456A5 true JP2001007456A5 (en) | 2005-01-06 |
Family
ID=15927983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17169599A Pending JP2001007456A (en) | 1999-06-17 | 1999-06-17 | Wiring circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001007456A (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4721534B2 (en) * | 2001-02-21 | 2011-07-13 | 京セラ株式会社 | Ceramic circuit board |
| JP4721533B2 (en) * | 2001-02-21 | 2011-07-13 | 京セラ株式会社 | Ceramic circuit board |
| JP4614788B2 (en) * | 2005-02-25 | 2011-01-19 | 京セラ株式会社 | Wiring board |
| JP5010669B2 (en) * | 2009-12-07 | 2012-08-29 | パナソニック株式会社 | Wiring board and manufacturing method thereof |
| JP2015208200A (en) * | 2014-04-23 | 2015-11-19 | 株式会社デンソー | Power supply device |
| JP2016092053A (en) * | 2014-10-30 | 2016-05-23 | 京セラサーキットソリューションズ株式会社 | Wiring board |
| JP6640508B2 (en) * | 2015-09-25 | 2020-02-05 | 京セラ株式会社 | Manufacturing method of printed wiring board |
| JP6604183B2 (en) * | 2015-12-16 | 2019-11-13 | 富士電機株式会社 | Semiconductor module |
| CN106604524A (en) * | 2016-11-21 | 2017-04-26 | 努比亚技术有限公司 | Flexible circuit board |
| JP6946776B2 (en) * | 2017-06-26 | 2021-10-06 | 株式会社リコー | Circuit board |
| JP7024331B2 (en) * | 2017-11-02 | 2022-02-24 | 三菱マテリアル株式会社 | A method for manufacturing an insulated circuit board, a method for manufacturing an insulated circuit board with a heat sink, and a method for manufacturing a laminated structure of an insulated circuit board. |
| WO2021005683A1 (en) * | 2019-07-08 | 2021-01-14 | 株式会社Ｆｕｊｉ | Circuit pattern creating system, and method for creating circuit pattern |
| JP7019657B2 (en) * | 2019-12-10 | 2022-02-15 | 日東電工株式会社 | Wiring circuit board manufacturing method |
| KR20240044498A (en) * | 2021-09-29 | 2024-04-04 | 가부시키가이샤 무라타 세이사쿠쇼 | Tracker modules and communication devices |
-
1999
- 1999-06-17 JP JP17169599A patent/JP2001007456A/en active Pending
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