JP2007096262A5 - - Google Patents

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Publication number
JP2007096262A5
JP2007096262A5 JP2006161700A JP2006161700A JP2007096262A5 JP 2007096262 A5 JP2007096262 A5 JP 2007096262A5 JP 2006161700 A JP2006161700 A JP 2006161700A JP 2006161700 A JP2006161700 A JP 2006161700A JP 2007096262 A5 JP2007096262 A5 JP 2007096262A5
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JP
Japan
Prior art keywords
main surface
chip
ceramic
terminal electrodes
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006161700A
Other languages
English (en)
Japanese (ja)
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JP2007096262A (ja
JP4509972B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2006161700A priority Critical patent/JP4509972B2/ja
Priority claimed from JP2006161700A external-priority patent/JP4509972B2/ja
Priority to US11/508,968 priority patent/US7557440B2/en
Publication of JP2007096262A publication Critical patent/JP2007096262A/ja
Priority to US12/475,648 priority patent/US7956454B2/en
Publication of JP2007096262A5 publication Critical patent/JP2007096262A5/ja
Application granted granted Critical
Publication of JP4509972B2 publication Critical patent/JP4509972B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006161700A 2005-09-01 2006-06-09 配線基板、埋め込み用セラミックチップ Expired - Fee Related JP4509972B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006161700A JP4509972B2 (ja) 2005-09-01 2006-06-09 配線基板、埋め込み用セラミックチップ
US11/508,968 US7557440B2 (en) 2005-09-01 2006-08-24 Wiring board and ceramic chip to be embedded
US12/475,648 US7956454B2 (en) 2005-09-01 2009-06-01 Wiring board and ceramic chip to be embedded

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005254031 2005-09-01
JP2006161700A JP4509972B2 (ja) 2005-09-01 2006-06-09 配線基板、埋め込み用セラミックチップ

Publications (3)

Publication Number Publication Date
JP2007096262A JP2007096262A (ja) 2007-04-12
JP2007096262A5 true JP2007096262A5 (enExample) 2009-09-10
JP4509972B2 JP4509972B2 (ja) 2010-07-21

Family

ID=37802920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006161700A Expired - Fee Related JP4509972B2 (ja) 2005-09-01 2006-06-09 配線基板、埋め込み用セラミックチップ

Country Status (2)

Country Link
US (2) US7557440B2 (enExample)
JP (1) JP4509972B2 (enExample)

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KR101530109B1 (ko) * 2008-03-24 2015-06-18 니혼도꾸슈도교 가부시키가이샤 부품내장 배선기판
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JP5217584B2 (ja) * 2008-04-07 2013-06-19 株式会社村田製作所 積層セラミック電子部品
JP5185683B2 (ja) * 2008-04-24 2013-04-17 パナソニック株式会社 Ｌｅｄモジュールの製造方法および照明器具の製造方法
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TWI366906B (en) * 2009-03-31 2012-06-21 Ind Tech Res Inst Die stacking structure and fabricating method thereof
JP5524715B2 (ja) * 2009-06-01 2014-06-18 日本特殊陶業株式会社 セラミックコンデンサ、配線基板
JP5535765B2 (ja) * 2009-06-01 2014-07-02 日本特殊陶業株式会社 セラミックコンデンサの製造方法
WO2011089936A1 (ja) * 2010-01-22 2011-07-28 日本電気株式会社 機能素子内蔵基板及び配線基板
TW201135980A (en) * 2010-04-02 2011-10-16 Icp Technology Co Ltd Light-emitting diode with substrate having surrounding wall and manufacturing method thereof
JP5548060B2 (ja) * 2010-07-28 2014-07-16 株式会社東芝 半導体装置
TWI446497B (zh) * 2010-08-13 2014-07-21 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法
TWI411073B (zh) * 2010-08-13 2013-10-01 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法
US20120068218A1 (en) * 2010-09-17 2012-03-22 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally efficient packaging for a photonic device
JP2012104557A (ja) * 2010-11-08 2012-05-31 Ngk Spark Plug Co Ltd 電子部品付き配線基板及びその製造方法
JP2012216611A (ja) * 2011-03-31 2012-11-08 Sony Corp 薄膜キャパシタ、実装基板およびその製造方法
US10622310B2 (en) 2012-09-26 2020-04-14 Ping-Jung Yang Method for fabricating glass substrate package
JP6144058B2 (ja) * 2013-01-31 2017-06-07 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP6013960B2 (ja) * 2013-03-28 2016-10-25 京セラ株式会社 配線基板
US9786434B2 (en) * 2013-10-22 2017-10-10 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and printed circuit board having the same
US9331021B2 (en) * 2014-04-30 2016-05-03 Taiwan Semiconductor Manufacturing Company, Ltd. Chip-on-wafer package and method of forming same
JP2016076658A (ja) * 2014-10-08 2016-05-12 イビデン株式会社 電子部品内蔵配線板及びその製造方法
US9601410B2 (en) 2015-01-07 2017-03-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
US9627365B1 (en) 2015-11-30 2017-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Tri-layer CoWoS structure
US9852988B2 (en) 2015-12-18 2017-12-26 Invensas Bonding Technologies, Inc. Increased contact alignment tolerance for direct bonding
JP2017123459A (ja) 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
US9831148B2 (en) * 2016-03-11 2017-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out package including voltage regulators and methods forming same
US10446487B2 (en) 2016-09-30 2019-10-15 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
KR20230156179A (ko) * 2016-12-29 2023-11-13 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 집적된 수동 컴포넌트를 구비한 접합된 구조체
WO2018169968A1 (en) 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
US10784191B2 (en) 2017-03-31 2020-09-22 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10510679B2 (en) 2017-06-30 2019-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device with shield for electromagnetic interference
JP2019067858A (ja) * 2017-09-29 2019-04-25 イビデン株式会社 プリント配線板及びその製造方法
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US11256004B2 (en) 2018-03-20 2022-02-22 Invensas Bonding Technologies, Inc. Direct-bonded lamination for improved image clarity in optical devices
US11515291B2 (en) 2018-08-28 2022-11-29 Adeia Semiconductor Inc. Integrated voltage regulator and passive components
CN109561570B (zh) * 2018-11-21 2020-12-18 奥特斯(中国)有限公司 部件承载件及其制造方法以及使用填料颗粒的方法
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
CN111834354B (zh) 2019-04-18 2024-07-16 三星电子株式会社 半导体封装件
JP7379899B2 (ja) * 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
JP7408975B2 (ja) * 2019-09-19 2024-01-09 Tdk株式会社 セラミック電子部品
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
CN113013125B (zh) * 2019-12-20 2024-07-09 奥特斯奥地利科技与系统技术有限公司 嵌入有在侧向上位于堆叠体的导电结构之间的内插件的部件承载件
US11705378B2 (en) * 2020-07-20 2023-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages and methods of forming the same
CN121100388A (zh) * 2023-06-07 2025-12-09 株式会社村田制作所 层叠陶瓷电容器
WO2024252864A1 (ja) * 2023-06-07 2024-12-12 株式会社村田製作所 積層セラミックコンデンサ
US12347628B1 (en) * 2024-08-27 2025-07-01 Saras Micro Devices, Inc. Stackable and embeddable vertical capacitors in semiconductor devices and method of fabrication

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JP3672169B2 (ja) * 1999-03-05 2005-07-13 日本特殊陶業株式会社 コンデンサ、コア基板本体の製造方法、及び、コンデンサ内蔵コア基板の製造方法
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
JP2004172412A (ja) * 2002-11-20 2004-06-17 Kyocera Corp コンデンサ素子およびコンデンサ素子内蔵多層配線基板
JP2005039217A (ja) 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 中間基板
JP2005039243A (ja) 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 中間基板
US7135534B2 (en) * 2003-07-24 2006-11-14 Rajiv Gandhi Centre For Biotechnology Polymer support for solid phase peptide synthesis and process for preparation thereof
CN100367491C (zh) 2004-05-28 2008-02-06 日本特殊陶业株式会社 中间基板
JP4528062B2 (ja) * 2004-08-25 2010-08-18 富士通株式会社 半導体装置およびその製造方法
TWI264094B (en) * 2005-02-22 2006-10-11 Phoenix Prec Technology Corp Package structure with chip embedded in substrate

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