JP2008060342A5 - - Google Patents

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Publication number
JP2008060342A5
JP2008060342A5 JP2006235727A JP2006235727A JP2008060342A5 JP 2008060342 A5 JP2008060342 A5 JP 2008060342A5 JP 2006235727 A JP2006235727 A JP 2006235727A JP 2006235727 A JP2006235727 A JP 2006235727A JP 2008060342 A5 JP2008060342 A5 JP 2008060342A5
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JP
Japan
Prior art keywords
wiring
passive element
wiring board
ceramic substrate
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006235727A
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English (en)
Japanese (ja)
Other versions
JP4722795B2 (ja
JP2008060342A (ja
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Publication date
Application filed filed Critical
Priority to JP2006235727A priority Critical patent/JP4722795B2/ja
Priority claimed from JP2006235727A external-priority patent/JP4722795B2/ja
Priority to KR1020070085318A priority patent/KR100945622B1/ko
Priority to US11/896,036 priority patent/US8345438B2/en
Priority to CN2007101471628A priority patent/CN101136397B/zh
Publication of JP2008060342A publication Critical patent/JP2008060342A/ja
Publication of JP2008060342A5 publication Critical patent/JP2008060342A5/ja
Application granted granted Critical
Publication of JP4722795B2 publication Critical patent/JP4722795B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006235727A 2006-08-31 2006-08-31 配線基板および電子部品モジュール Active JP4722795B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006235727A JP4722795B2 (ja) 2006-08-31 2006-08-31 配線基板および電子部品モジュール
KR1020070085318A KR100945622B1 (ko) 2006-08-31 2007-08-24 전자 부품 모듈
US11/896,036 US8345438B2 (en) 2006-08-31 2007-08-29 Electronic part module and method of making the same
CN2007101471628A CN101136397B (zh) 2006-08-31 2007-08-30 电子部件模块及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006235727A JP4722795B2 (ja) 2006-08-31 2006-08-31 配線基板および電子部品モジュール

Publications (3)

Publication Number Publication Date
JP2008060342A JP2008060342A (ja) 2008-03-13
JP2008060342A5 true JP2008060342A5 (enExample) 2009-01-15
JP4722795B2 JP4722795B2 (ja) 2011-07-13

Family

ID=39151210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006235727A Active JP4722795B2 (ja) 2006-08-31 2006-08-31 配線基板および電子部品モジュール

Country Status (4)

Country Link
US (1) US8345438B2 (enExample)
JP (1) JP4722795B2 (enExample)
KR (1) KR100945622B1 (enExample)
CN (1) CN101136397B (enExample)

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* Cited by examiner, † Cited by third party
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JP4434268B2 (ja) * 2007-11-28 2010-03-17 Ｔｄｋ株式会社 電子部品モジュール
JP5154262B2 (ja) * 2008-02-26 2013-02-27 太陽誘電株式会社 電子部品
US8217514B2 (en) * 2008-04-07 2012-07-10 Stats Chippac Ltd. Integrated circuit packaging system with warpage control system and method of manufacture thereof
JP2010004028A (ja) * 2008-05-23 2010-01-07 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、及び半導体装置
US20100022063A1 (en) * 2008-07-28 2010-01-28 Mete Erturk Method of forming on-chip passive element
US20100019346A1 (en) * 2008-07-28 2010-01-28 Mete Erturk Ic having flip chip passive element and design structure
WO2010095201A1 (ja) * 2009-02-20 2010-08-26 パナソニック株式会社 半導体装置及び半導体装置の製造方法
US9607935B2 (en) * 2009-04-21 2017-03-28 Ati Technologies Ulc Semiconductor chip package with undermount passive devices
US8058934B2 (en) * 2009-06-03 2011-11-15 Qualcomm Incorporated Apparatus and method for frequency generation
JP6039182B2 (ja) * 2009-06-30 2016-12-07 日本電気株式会社 半導体装置、該装置に用いられる実装基板及び該実装基板の製造方法
EP2309829A1 (en) * 2009-09-24 2011-04-13 Harman Becker Automotive Systems GmbH Multilayer circuit board
JP5401292B2 (ja) 2009-12-15 2014-01-29 ルネサスエレクトロニクス株式会社 半導体装置及び通信方法
FR2961345A1 (fr) * 2010-06-10 2011-12-16 St Microelectronics Tours Sas Circuit integre passif
KR101088824B1 (ko) * 2010-06-16 2011-12-06 주식회사 하이닉스반도체 모듈 기판, 이를 갖는 메모리 모듈 및 메모리 모듈 형성방법
KR101436462B1 (ko) 2013-05-06 2014-09-01 한국과학기술원 관통 실리콘 비아 연결성 탐침 소자, 이를 포함하는 연결성 측정 장치 및 방법
CN103681539B (zh) * 2013-12-18 2016-06-08 江阴长电先进封装有限公司 一种集成共模电感的封装结构及其封装方法
JP6310371B2 (ja) * 2014-09-11 2018-04-11 太陽誘電株式会社 弾性波デバイス
US9553079B1 (en) * 2015-12-15 2017-01-24 International Business Machines Corporation Flip chip assembly with connected component
JP7266996B2 (ja) 2018-11-20 2023-05-01 太陽誘電株式会社 インダクタ、フィルタおよびマルチプレクサ
US11495588B2 (en) 2018-12-07 2022-11-08 Advanced Micro Devices, Inc. Circuit board with compact passive component arrangement
CN110176437B (zh) * 2019-05-31 2020-11-03 合肥圣达电子科技实业有限公司 一种窄间距陶瓷接线柱及其制备方法
CN110386586B (zh) * 2019-08-16 2025-02-07 中电科芯片技术(集团)有限公司 一种光电隔离通用片式can总线微系统封装结构
CN111968995B (zh) * 2020-07-13 2024-02-09 深圳市汇芯通信技术有限公司 一种集成无源器件及其制作方法和集成电路
WO2022261571A1 (en) * 2021-06-11 2022-12-15 Microchip Technology Incorporated Sense coil for inductive linear-position sensing, and related devices, systems, and methods
CN117716209A (zh) 2021-08-05 2024-03-15 微芯片技术股份有限公司 感应角位置传感器以及相关设备、系统和方法
US12339139B2 (en) 2021-09-28 2025-06-24 Microchip Technology Incorporated Angular-position sensor
US12411001B2 (en) 2022-04-01 2025-09-09 Microchip Technology Incorporated Target for inductive angular-position sensing
CN118946782A (zh) 2022-04-01 2024-11-12 微芯片技术股份有限公司 用于感应角位置传感器的目标
CN117560860A (zh) * 2022-08-04 2024-02-13 辉达公司 堆叠多个印刷电路板的方法和配置

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JPH0377360A (ja) * 1989-08-18 1991-04-02 Mitsubishi Electric Corp 半導体装置
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