TW498373B - Multilayer ceramic capacitor for three-dimensional mounting - Google Patents

Abstract

A multiterminal multilayer ceramic capacitor having a capacitor body comprised of first internal electrodes and second internal electrodes alternately stacked via rectangular ceramic layers so that the short sides of the ceramic layers register with the height direction of the capacitor body. First external terminals and/or second external terminals connected to the first internal electrodes and/or second internal electrodes are formed on a top face and bottom face of the capacitor body. The first external terminals and second external terminals are connected directly to different circuit patterns of the circuit board so as to enable three-dimensional mounting of the multilayer ceramic capacitor with circuit boards.

Description

49 ^ / J V. Description of the invention (υ _____ Field of the invention: The present invention relates to a multilayer ceramic capacitor which is used for installation in a personal computer or a three-dimensional installation. It is a low equivalent series inductance USi. The electronic device with an operating frequency is suitable for surface-mounted and low-equivalent series resistance (ESR) capacitors, two or more multilayer printed circuit boards. Known technical description: In the past, it was used as a multi-terminal ^ 588 0925 The capacitor ^ ceramic capacitor, for example, is disclosed in the United States of America. It is known that it has two types of internal capacitors. This capacitor has an electrical electrode, and it is laminated and sandwiched between =, that is, the first internal electrode and第二 内 甴 延 # is in the longitudinal direction of the rectangular electromotive layer. These internal electrodes are respectively extended from the main surface of the main surface = layer, and the main surface of the rectangular main portion is composed of patterns. The first two internal ceramic layers are devoid of ceramic layers. The guide pattern on the side of the guide is composed of a plan view = the guide pattern of the male and the external electrode system of the second internal electrode in this one, and is formed at different positions from each other. Thanks for the length of the plural This plot more than one drawer Tokyo Tomoko terminal multilayer ceramic capacitor of the capacitor body,

The external electrode system is located on the surface of the circuit board from the lightning capacity system, so that the lamination direction of the electrodes is perpendicular to the surface of the ceramic substrate. The internal poles are connected to the electrode =: ~ § 'The system is generally perpendicular to the circuit substrate. The external power is combined and fixed by the pads of the circuit pattern of the capacitor C, which is lean; the surface of the circuit board. Layer Product: Square: In a 2-layer ceramic capacitor, the internal electrode and ceramic are in the same height direction as the capacitor used for surface mounting.

498373 V. Description of the invention (2) If the south of the laminated ceramic deformation layer cannot be set to a height direction that is worth noting, except for the US patents shown in Japanese Patent Publication, Japanese Patent Publication, Japanese 8-1 24800 Fair 6-7228 No. Sho 62-35257 keeps the ceramic layer on the surface and the number of amps is kept low by the required degree. However, the smaller the size of the 500 megahertz (MHz) ESL and the low ESR, it is indeed installed in the standing characteristics. However, if the volumetric printed samples become longer, the number of Ί is increased by the electrical characteristics read, and the electronic device remains low. The thing is that the laminated electronic device that is thrown on the surface is made by making the laminated direction of the ceramic layer consistent with the laminated electronic device. There is a lot of knowledge outside No. 5 8 8 0 9 2 5 such as Jie Zhao 6 4 -1 〇9 2 Gazette No. 7, Japanese Patent Laid-Open No. 7 — ί 6 ί 5 6 8 Chihpeung No. 7 -1 6 9 6 4 9 Gazette, Japanese Laid-Open Patent No. 7 — ί 6 9 6 5 1 No. 7 2 9 7 No. 5, Japanese Patent Laid-Open, No. 9-1 481 No. 74, Japan Shikai No. 7, No. 6 1 568, No. 1 568, No. 1 568, and Japanese Patent Publication No. 63-38856. In the laminated electronic device, the height direction of the laminated electronic device is the same. ^ In the laminated electronic device, if the inclusion characteristics of the laminated ceramic layer are increased, it is impossible to make the electronic device a problem. In personal computers and other electronic devices, the operating frequency has been increased from 1 仟 megahertz (G Η z). The power circuit requires a low-layer, ceramic capacitor. In addition, taking into account that electronic devices are increasingly maintaining low-profile multi-terminal multilayer ceramic capacitors that can be printed on circuit boards, etc., and obtain the required multi-layer multilayer ceramic capacitors that are conventionally installed in one or two Circuit boards, etc., the circuit diagrams formed on the circuit board are main and the routing of the bonding pads becomes longer, while the inductance components have

Η 2030-3679-P.ptd Page 6

498373

V. Description of the invention (3) Adverse effects. In particular, the circuit pattern including the pads at the upper position and the solder pads becomes longer, and the detour becomes more π. Inductive elements have an adverse effect, and the generation of noise cannot be avoided. In addition, if surface mounting is known If the capacitor is close to a semiconductor chip to reduce ESL, there is a problem that the effect of the inductive element is caused because the routing of the pad cannot be omitted. In addition, in the conventional capacitor, as described above, the height dimension of the capacitor itself cannot be kept low regardless of the number of layers. It can be seen that the conventional capacitor is not suitable for three-dimensional installation. It is worth noting that, for example, Japanese Unexamined Patent Publication No. 57-6827 (corresponding to US Patent No. 167191, July 9, 1980) and Japanese Patent No. 2657953 (corresponding to US Patent No. 212361 ,-} June 27, 988 =) No, a capacitor is proposed to make the direction of lamination of the ceramic layer coincide with the plane direction of the circuit board on which the lamination shoulder = the surface to be mounted. However, the capacitors disclosed in the 5th report have problems that the capacitors cannot be installed three-dimensionally, and the ESR and / or esl connected to the external circuit of Honggu is easily increased. Summary of the Invention: One of the objects of Thunderhead 1 invention is to provide a multilayer ceramic for three-dimensional installation, where f Γ is installed on a personal computer or other electric power with a high operating frequency: 3 A low ESL and low esr Capacitors, regardless of the number of printed layers of the ceramics, are kept slightly smaller, and the dimensions are kept low, and they are suitable for mounting on a single volume layer. The layer 5 is formed by a + rectangle. The first capacitor of the present invention includes a ceramic first internal electrode having

Page 7 498373 V. Description of the invention (4) ^ The first side of the rectangular first main part extending in the longitudinal direction has a plurality of first leads extending from the first side of the main part to the long side of the ceramic layer. Leading part; one: · * 丨 a second internal electrode having a rectangle j opposite to the first main part of the first internal electrode via the ceramic | I ceramic layer and located on the second surface of the ceramic layer opposite the first surface

The second main portion has a plurality of second guide portions extending from the long side of the second main portion to the long side of the ceramic layer at a different position from the first guide portion provided on the first internal electrode. ; A rectangular hexahedron-shaped capacitor body, including a plurality of | I internal electrodes and a second internal electrode laminated with ceramics so that the short side of the ceramic i I layer is consistent with the height direction of the capacitor body; the first external electrode, I

5 I j is formed on the upper and lower sides of the capacitor body, and is electrically connected to the first guide portion located in the same row along the multilayer direction of the ceramic layer 丨! I ^!; And the second external electric pole, corresponding to The first external electrode is alternately formed on the capacitor body |

I and the bottom, and are respectively electrically connected to the second guide portions located in the same | · row along the lamination direction of the ceramic layer. | | In the first capacitor of the present invention, it is preferable that the first external electrode is connected to the electric |

| The first circuit pattern on the outside of the main body, once the second external electrode is connected to I

I The second circuit pattern is different from the first circuit pattern. I

I I Among the first capacitors of the present invention, five laminated ceramic capacitors are preferably buried in an i-dimensional circuit substrate. ! I According to the first capacitor of the present invention, the height dimension of the capacitor body can be shortened regardless of the number of ceramic laminates. Therefore, the distance between the external electrode formed on the capacitor body | ¥ and the external electrode formed on the lower side can be shortened, and j

丨 can reduce the total inductance due to the pad routing, even if the capacitor is located on a multilayer substrate. In addition, the pads formed on the multilayer substrate can be simplified. Because-

2030-3679-P.ptd Page 8 498373 i V. Description of the invention (5)] Here, the capacitor is suitable for installation in personal electronic devices or other sj electronic devices with high operating frequency, and has a low ESL and low ESR Capacitor. In addition, the capacitor system configuration j has a low height dimension and has electrodes 5 above and below the capacitor, so it is suitable for being embedded and mounted on a three-dimensional multilayer printed circuit board. i I The second capacitor of the present invention includes a ceramic layer composed of a rectangular shape; j I a first internal electrode having a jr rectangular first main portion extending in a longitudinal direction along a first surface of the ceramic layer and having The first long side of the first main part of j I exposed along the first long side of the ceramic layer; a second internal electrode having a longitudinal direction extending along the second side of the ceramic layer opposite to the first | j plane Rectangular second main part | Section i having a second main part exposed along the second long side of the ceramic layer |

i two long sides; a rectangular hexahedron-shaped capacitor body including a plurality of first internal | 1 ^ j electrodes and a second internal electrode by ceramic lamination to make the ceramic layer short i; the side and the height direction of the capacitor body Consistent; the first external electrode, constituted by electricity |

Above or below the container body, and are electrically connected to the first I along the ceramic layer, respectively!

A first internal electrode exposed on the long side of I; and a second external electrode formed above or below the capacitor body, and are respectively electrically connected to the second | j exposed on the long side of the ceramic layer Two internal electrodes. | I In the second capacitor of the present invention, it is preferable that the first external electrode is connected to the electric i

The first circuit pattern on the outside of the main body is accommodated, and the second external electrode is connected to a second circuit pattern different from the first circuit pattern. In the second capacitor of the present invention, it is preferable that the multilayer ceramic capacitor is buried in a |

i stereo circuit board. I

I The second capacitor of the present invention exhibits similar operation and effects as the first capacitor of the present invention.丨

2030-3679-P.ptd Page 9 498373! ----- I. V. Description of the invention (6) δ! The third capacitor of the present invention includes a ceramic layer formed of a rectangle; a first internal electrode having A rectangular first main portion extending in a longitudinal direction along a first surface of the ceramic layer and having a first long side of the first main portion exposed along the first long side of the ceramic layer; a second internal electrode having The second face of the ceramic layer having a first face opposite to the second face extends in the longitudinal direction and has a plurality of guide portions extending from the second long side of the second main portion to the second long side of the ceramic layer. ; A rectangular hexahedral capacitor body, including a plurality of first internal electrodes and a second internal electrode, which are laminated with ceramics so that the short side of the ceramic layer is consistent with the height direction of the capacitor body; A first internal electrode that is exposed above or below the capacitor body and is electrically connected to the first long side of the ceramic I layer; and a second external electrode, I is formed above or below the capacitor body, and is electrically Connected to the second long-side storm along the ceramic | layer Exposed guide. In the third capacitor of the present invention, it is preferable that the plurality of second external electrodes are arranged above or below the capacitor body at a distance substantially equivalent to the short side of the ceramic layer. j In the third capacitor of the present invention, it is preferable that the first external electrode is connected to a circuit pattern on the outside of the capacitor body, and the second external electrode is connected to a second circuit different from the first circuit pattern. pattern. In the third capacitor of the present invention, it is preferable that the multilayer ceramic capacitor is embedded in a three-dimensional circuit substrate. j The third capacitor of the present invention exhibits similar operations and effects as the first capacitor of the present invention, and is arranged at a distance substantially equivalent to the short side of the ceramic layer. A pair of second outer electrodes are connected to the capacitor body. Three terminals allowed above or below

I

2030-3679-P.ptd Page 10 498373 ^ j V. Description of the invention (7) The realization of the j capacitor I The second external electric crack is in a multilayer i, and the composition | The present invention I a first internal j rectangle A first main part is opposite to the ceramic part, and has a pair of guides i an internal electrode | the short side of the layer and the j pole, which is formed on the long side I of the ceramic layer and is formed on the side of the capacitor i * j this invention | of the capacitor body | this invention the first circuit diagram of the capacitor body I this invention. In this capacitor, the pitch between the poles provided on the same early side of the ceramic body can be shortened. Therefore, even with Lei Rongjun's substrate, the total inductance due to the pad routing can be reduced ^ the pads on the multilayer substrate can be simplified. < The fourth electric valley includes a Taurman layer, which is composed of a rectangular electrode. The electrode has a main portion extending in a longitudinal direction along the first surface of the ceramic layer, and has a respective portion exposed along the long side of the ceramic layer. < Two long sides, a second internal electrode, having a rectangular shape extending in the longitudinal direction along the second surface of the first sacral layer. The second main portion extends from the short side of the second main portion to the short portion of the ceramic layer. The planar capacitor body includes a plurality of pens and a second internal electrode laminated by ceramics, and the height direction of the capacitor body is the same; a pair of -C = above and below the body, and are electrically connected to the direction of Tao = -An internal electrode; and a second external electrode, which are electrically connected to the fourth capacitor facing the ceramics layer, respectively, and it is preferable that the second external electrode extends on the entire peripheral surface of the four sides. In the T-shaped cold fourth capacitor, it is preferable that the first external electrode is connected to the first circuit diagram of Gong and the second external electrode is connected to the second circuit pattern with a different shape. Connected to the fourth capacitor, the best multilayer ceramic capacitor is buried 498373 I V. Description of the invention (8)

I I In the fourth capacitor of the present invention, it is preferable that the first external electrode and the second external i electrode are directly connected to a circuit pattern formed on the three-dimensional circuit substrate. j The fourth capacitor of the present invention shows similar operations and effects as the first capacitor of the present invention, and a three-terminal capacitor can be realized. In addition, when a capacitor is provided via a predetermined circuit pattern of a three-dimensional circuit board, and it is used as a so-called through j

The I-hole capacitor allows the second external electrode system I i formed on the side of the capacitor body to be directly connected to the passing circuit pattern. |

I In order to make the above and other objects, features, and advantages of the present invention more obvious! It is easy to understand, a preferred embodiment is described below, and described in detail with the accompanying drawings. .

I j schema brief description: 丨

I FIG. 1 is a perspective view showing the state of the internal structure of the multi-layered ceramic capacitors in the three-dimensional installation according to the first embodiment of the present invention; j I FIG. Terminal |

Illustrative drawing of the shape of the internal electrode of the multilayer ceramic capacitor; I FIG. 3 is a perspective view of the appearance of the external electrode of the multilayer ceramic capacitor including multi-terminal for three-dimensional installation according to this embodiment; i 1 FIG. 4 is based on Multi-terminal laminate for stereo mounting in this embodiment | \ ε

Illustrative drawing of a ceramic capacitor sandwiching a mounting structure in a multilayer substrate; |

FIG. 5 is a perspective view of a multi-layer I / I laminated ceramic capacitor in a three-dimensional installation according to another embodiment of the present invention; j

Fig. 6 shows a multi-terminal for three-dimensional mounting according to the embodiment I

i An illustration of the shape of the internal electrodes of a multilayer ceramic capacitor; I

2030-3679-P.ptd Page 12

/ J V. Invention ~~ * --- * Chapter 7 is an explanatory diagram of a multi-terminal multi-layer laminated structure for three-dimensional mounting in this embodiment, which is a sandwiched mounting structure in a multi-layer substrate; ^ 8 The diagram is a multi-terminal laminated ceramic pottery installed in a three-dimensional installation according to this embodiment = an explanatory diagram of each embedded installation structure in a multi-layer substrate; FIG. 9 is a diagram for three-dimensional installation according to another embodiment of the present invention The three-terminal D-layer ceramic capacitor is a perspective view showing the internal structure state; FIG. 10 is an explanatory diagram of the pattern shape of the internal electrode constituting the three-terminal @S 3 1-man capacitor for three-dimensional installation in this embodiment; 穑禺 It is a perspective view of the external appearance of the three-terminal three-terminally mounted capacitor and the external electrode of the capacitor according to this embodiment; Tao Wanlei 2 In this embodiment, the three-terminal laminated three-dimensionally mounted three-dimensionally mounted substrate is shown in the substrate. Illustrative drawing of the sandwich installation structure; hole-shaped laminated ceramics & gg f ^ κ Example 图 The shape of the internal electrode of the electric valley used for three-dimensional installation is transmitted. The figure is a perspective view of the laminated ceramic capacitor according to this embodiment, and it is a perspective view of the exhaust hole for stereoscopic installation. The ceramic capacitor is: a through-hole type for stereoscopic installation. '· Illustration diagram of the structure of the pinch pin in the substrate. Layer Symbol description: 20 ~ capacitor body; 30 ~ Xishan 7 2 ~ ceramic layer; Xi terminal multilayer ceramic capacitor; L ~ first internal electrode;

2030-3679-P.ptd Page 13 498373 V. Description of the invention (1) 1 a ~ first main part; 12 ~ second internal electrode; la '~ second main part; lb, lc, ld, le ~ first A guide portion; lb ', lc', Id., Le > ~ second guide portion 3b, 3d, 4a, 4c ~ first night electrode; 4d ~ second external electrode 6a 20V 201b 204 208 3 2 0 ~ Capacitor 3 0 2 ~ Ceramic layers 209a, 209b ~ Circuit patterns 3a, 3c, 4b 5 ~ Circuit substrate; 1 2 0 ~ Capacitor body; 102 ~ Ceramic layer; i 02b ~ Second long side of ceramic layer; 101 ~ First internal electrode; 101b ~ First (upper) long side; 103 ~ First external electrode; 105, 106 ~ Circuit board; 10 ~ Solder; 230 ~ Multilayer ceramic capacitor; 202a ~ Second ceramic layer Long side; 2 02c, 202d ~ short edge of Tao Jing layer; second internal electrode; 201c ~ guide bow! 2 05 ~ 2nd external electrode; 6b ~ circuit pattern; i30 ~ multilayer ceramic capacitor; 102a ~ first long side of ceramic layer; 102c, 102d ~ short edge of ceramic layer 10 0 Γ ~ second internal electrode; 101a ~ Second (lower) long side; 104 ~ Second external electrode; 107, 108 ~ Circuit pattern; 220 ~ Capacitor body; 202 ~ Ceramic layer; 202b ~ Ceramic layer first long side; 2 0 1 i ~ first internal electrode; 2 0 ia ~ second main part; 2 3 3 ~ first external electrode; 2 06, 2 7 7 ~ circuit board; 30 ~ through-hole multilayer ceramic capacitors 02a, 302b ~ Short side of ceramic layer;

2030-3679-P.ptd p. 14 498373

3 01, ~ first internal electrode; 301a ~ second main part; I5 'invention description (li) | 302c, 302d ~ long side of ceramic layer * | 30 12 ~ second internal electrode; I 301b, 301c ~ guide 3 0 4 ~ 2nd external electrode; 303, 3 03 '~ 1st external electrode; 305, 306 ~ circuit board; 07a, 307b, 308a, 308b ~ detailed description of the preferred embodiment of the circuit pattern: First implementation The evening of the example: Figure 3 shows the two-dimensional stereo compensation according to this embodiment; the layered ceramic capacitor 30 has-the capacitor body 20,4 rectangular;: the capacity body 2 °, as shown in Figure 2, The system consists of a predetermined pattern alternately formed by: 崎, 2; and 崎 layer 2 in the horizontal direction in the figure—the smart electrode 11 and the second internal electrode 12. That is to say, at least one ceramic sound composed of the sacral electrode 12 is laminated by the sacral layer 2 and the second inner short side and the high-level ceramic layer of the capacitor body 20, which can be integrated. Zhuang Sifei consists of internal electrode faces. 1 is layered on the main body 20 at both ends of the layering direction and has a complex, extending from the long side of the first king main part la as shown in FIG. 2, each first inner main part la is located at The first rectangular first guide portions 1 b, 1 c, 1 d and 1 e of the ceramic layer 2 extend to the long side of the ceramic layer 2. Qiu 1 / outer S ’/ Λ two internal electrodes 12 having the same shape

2030-3679-P.ptd " Facing to the internal electrode% ^ s a main punch a main part la warp a ceramic 498373

Layer 2 is on the rear surface (second side) of the surface opposite to ceramic layer 2. The long sides of the two main portions la are at two positions from the first guide ^, lc, and u disk, and extend to the length of ceramic layer 2. The Plural Second Guide. e,:, as shown in Fig. 1 and Fig. 4, the upper part of the capacitor body 20 is electrically connected to the two layers in the same direction along the direction of the lamination of the ceramic layer 2. I guides lb, 1c, id ^ 4 3 4 C ° with the first external electrodes 3b, 3, and 2 of the le. The upper and lower sides of the capacitor body 2 are electrically connected to a second conductor located in the same row along the ceramic layer 2 stacking direction. Lead 丨 b, v 2 1,》 c H IQ Xing

ie ~ the second external electrodes 3a, 3c, 4b and 4d. That is, as shown in FIGS. 1 and 4, the first external electrodes 3 b, 3 d, 4 a, and 4 c and the second external electrodes 3 a, 3 c, 4 b, and 4 d are disposed in the capacitor). Positions different from each other. In addition, the first external electrodes I 3b, 3d, 4a, and 4c are connected to the first internal electrode of the layer via the first guides lb ~ le, and the second external electrodes 3a, 3c, and 4b are connected through the second The I guides lb, ~ le are connected to the second internal electrodes 2 of the layer. I These internal electrodes 1 and 12 are formed by coating or grilling a nickel or other conductive i coating on the surface of a ceramic green sheet, and include nickel or nickel alloy layers. Note that the internal electrodes may also include base metal copper, precious metal handles, or silver alloy layers, and so on. The ceramic layer 2 includes a barium titanate · salt-based, chin-based, sulphate-based, or other ceramic composition. The laminated layer of the ceramic layer 2 and the internal electrode is formed by coating a ceramic clay on the surface of a base film or other films to form a green sheet and printing one. An electrical coating is applied thereon, and then laminated, cut 5 and fired

2030-3679-P.ptd Page 16 498373 V. Description of the invention (13) The green sheet. After the body 20 is produced, the external electrodes are constructed and grilled. Specifically, the external electrodes 3a ~ 3d and 4a ~ 4d can be coated with a copper coating on the body to form an underlayer, and then cover the lower layer with a nickel and tin bond layer. The multilayer ceramic capacitor 30 produced in this way consists of directly connecting the first external electrodes 3b, 3d, 4a, and 4c and the second external electrodes 3a ,: 3c, 4b, and 4d to different circuit patterns of the circuit board, and supplying voltages of different poles The three-dimensional mounting of the multiple external terminals to the adjacent external electrode 5. The unit size of the multi-terminal multilayer ceramic capacitor of the present embodiment is not particularly limited, but may be, for example, height 0.5 · 0.5 ± 1, width (layer direction) 1 · 6 soil j O.lfflffi, and length 3.2 soil G .lmm. The thickness of the ceramic layer is not particularly limited, but may be, for example, 4 // m. The shape of the ceramic layer is a rectangle with a short side of 0.5 ± 0 · 1 mm and a long side of 3 · 2 ± 0 · 1πΐ! Η. The distance between the upper and lower surfaces of the capacitor body 20 and the facing external electrodes may be set to be approximately the length of the short side of the ceramic layer 2 |. The multi-terminal multilayer ceramic capacitor 30 thus provided can be mounted on a circuit board 5 including a power supply circuit of a semiconductor device D as shown in FIG. This three-dimensional installation can be performed as follows. That is, one set of external electrodes 3a, 3b, 3c, and 3d are connected to any terminal of the hemibody device D, and the other set of external electrodes, 4b, 4c, and 4d are provided directly facing the circuit substrate 5. The different circuit patterns 6a and ❿ are electrically connected with AO as the positive / negative electrode (GND). In stereo installations,

2030-3679-P.ptd Page 17 Η ΐ ΐ Ϊ Η ΗThe overall size is low, the routing of the solder pads becomes shorter, and the effect of the lightning-w inductor 7C on the circuit side is small. 498373 V. Description of the invention (14) In order to reduce the inductance of the circuit pattern, 甴 Anshang has a multilayer ceramic capacitor with a value of 80 ~ 100ρΗ and an ESR value as low as ΙΟιηΩ, and the inductance component of the welding can be ignored. Therefore, 'if the ESL and ESR of a multi-terminal multilayer of conventional technology ^ capacitors are compared with the multi-terminal multilayer ceramic capacitors having the same electrostatic lightning capacity according to the present invention, in accordance with the conventional technology: The condition of the multilayer ceramic capacitor 'the value becomes 8% larger' and the condition of the multi-terminal multilayer ceramic capacitor according to this embodiment is maintained at 2 to 3% lower. This is because in the multi-terminal multilayer Taurman capacitor of this embodiment, since the distance between the facing external electrodes can be set short, and the height of the capacitor device as a whole can be reduced, even if the capacitor is mounted on a multilayer substrate. The total inductance caused by the routing of the bonding pads can be reduced, and the bonding pads formed on the multilayer substrate can be simplified. Second Embodiment Secondly, as shown in FIGS. 5 to 8, the multilayer ceramic capacitor 130 for three-dimensional mounting according to the illustrated embodiment has a capacitor body 120, which is a rectangular hexahedron shape. The capacitor body 120, as shown in FIG. 5 and FIG. 6, includes a plurality of first internal electrodes 1 (n and ^) of a predetermined pattern alternately laminated in the direction of water $ in the figure through ceramic layers i 〇2 formed in a rectangular shape alternately. The two internal electrodes 101. In other words, in this embodiment, as shown in FIG. 5 and FIG. 6, the plurality of first internal electrodes 101 and the second internal electrode 101 are stacked in water via the ceramic layer i02. Thousands of directions, so that the short side of the ceramic layer and the height of the capacitor body 120 are at least one ceramic layer 1 Q 2 that is not composed of internal electrodes, and can be laminated on both ends of the body 120 in the laminated direction.

As shown in FIG. 6, the first-internal electrode 101 has a rectangular first

2030-3679-P.Ptd Page 18 498373 V. Description of the invention (15) The main part is located on the first side (surface) of the ceramic layer 102. Only the upper (first) long side 101b of the first main part j is exposed on the surface of the body 120 along the first long side 102a of the ceramic layer 102. The longitudinal and lateral dimensions of the first electrode iQi are set to 1 such that the other long side and the two short sides of the first electrode 101 do not reach the second long side 102b and the two short sides 102c and i02d of the ceramic layer 102. . The lateral width of the first electrode 101 may be a size having the same width as the lateral width of the ceramic layer 102. One of the short sides of the first electrode 101 may be exposed along the short sides i02c and 102b of the ceramic layer 102. j In addition, each of the second internal electrodes 101 has a rectangular second main portion, and passes through a ceramic layer in a longitudinal direction with respect to the rear surface (second surface) of the first main portion of the first internal electrode 101. The area of the second main portion of the second internal electrode 101 is the same as the area of the first main portion of the first internal electrode 101. However, there is a lower (second) long side I of the first main portion. 1 a is exposed below the body 120 along the second long side 102 b of the ceramic layer I 102. The vertical and lateral dimensions of the second thunder pole | are set so that the other long side | of the second electrode i01, and the two short sides do not reach the first long side i02a of the ceramic layer 102丨: Face. f And the width of the second electrode 101 ′ may be a dimension having the same width as that of the ceramic; One of the short sides of the second electrode 丨 0 ″ may be exposed at the short sides 102c and 102d of the ceramic layer 102. First! As shown in FIG. 5 and FIG. 6, in this embodiment, in the body 丨 2 |, the same rectangular shape but smaller area than the ceramic layer 丨 02 | 101 and 101 'are passed through the ceramic layer 102 is laminated and arranged alternately at different positions on the vertical side j. From the viewpoint of implementing the pattern structure of the internal electrodes on the surface of the ceramic capacitor layer, the internal electrodes 101 ′ and 101 ′ are preferably the same length = shape, but the present invention is not necessarily limited to the same shape. 498373 V. Description of the invention (16) A first external electrode 103 is bonded to the capacitor body 120 to be electrically connected to the first electrode having the long side 101b exposed along the first long side of the ceramic layer 102. An internal electrode 101. A second external electrode 104 is bonded to the lower surface of the capacitor body 丨 2, so as to be electrically connected to a second internal electrode having a long side i〇ia exposed along the second long side 102b of the ceramic layer 丨 〇2 〇ι ,. These external electric poles 103 and 104 are preferably formed on the entire upper or lower surface of the capacitor body 5 above but not necessarily limited to cover the entire rhyme surface. The coverage area can also be determined according to the pad shape of the multilayer substrate on which the capacitor 13 is to be mounted. The area of the external electrode 103 or 104 above or below the body exposed with respect to the long sides of the internal electrodes 101 and 101 'is preferably at least 50% of the area.

I! These internal electrodes 101 and 101 are formed by coating or grilling a nickel or other coating on the surface of a ceramic green sheet, and include a nickel or nickel alloy layer. Note that the internal electrode may also include a base metal copper, a noble metal palladium or a 1ε silver alloy layer, and the like. The ceramic layer 102 includes a barium titanate-based, titanium-based, zirconate-based, or other ceramic-free composition. The laminated layer of the ceramic layer 102 and the internal electrode is formed by coating a clay on the surface of a base film or other films to form a green sheet, and a conductive coating is printed thereon, and then laminated, cut, and fired. Into the green flakes. After the body 1 2 0 is generated, the external electrodes are constructed and grilled. Specifically, the external electrodes 103 and 104 can be coated, dried, and grilled with a copper coating on the capacitor body 120 to form a lower ground layer, and then the lower ground layer is covered with a nickel and tin plating layer. The multilayer ceramic capacitor 130 produced in this way is directly connected to the first external

\-

2030-3679-P.ptd Page 20 Description of the goods (17) Electrode 103 and the first-from the same, and the supply is different: the different circuit diagram of the two electrodes ^ 4 to the circuit board. ~, The external electrode is enclosed and connected, and it is used for multiple restrictions in this embodiment, but it can be, for example, + sn. The unit size of the ceramic capacitor is not special. r self-research = 戸 choose soil 1 position, width 0.8 ± ο.1 ·, and growth. The failure of the pottery layer 5 is not particularly limited, but may be, for example, 4 " once Fang Ping Feng Niuban 〇3 work 〇 · imm and long side 3.2 ± 〇 · imm

The human internal electrodes 101 and 10! Can be composed of two 15M. The number of layered drawers is j 甶 丨 · b on · 2 · β // m of each degree and the inside of the external electrode has a capacitance of, for example, 0 · 22: that is, two ions can be set into a phase, as in Tao The width of the short side of the man layer, 'Ce 3 Wennon's multi-terminal product wide pottery ceramics Lei Ta Zhuang +, + + 7 as shown in Figure 7 has a dominant component = y Fen 130 5 women's clothing or sandwiched as post and 106 Asking '— / this_ The circuit board facing in the body-mounting circuit is connected with the external electrode U3 and capacitor 1 of the capacitor 130 (M is a different circuit pattern m and 106 which are arranged in a straight plate m and 106 and \ Two is the bipolar / negative pole 0. In this three-dimensional installation, the capacitor plate ηΓ6ΓΛ can be kept low. In addition, because the Hr distance of the facing circuit substrate is kept narrow, the winding path of the solder can be shortened, and the circuit A ~ 4 can reduce the effect of ordinary parts. In addition, the external electrode 104 is electrically connected to a circuit pattern formed in an opening of the circuit soil X 0 5.

2030-3679-P.ptd Page 21, the two capacitors 130 shown in the figure can be installed in three dimensions. An external electrode i 0 3 of Taiji 1109, 缟 and capacitor 130 is solder 498373. V. Description of the invention (18) In order to reduce the inductance of the circuit pattern, the ESL value is 10 ~ 20pH. , And the multilayer ceramic capacitor 13 having an ESR value as low as 5 to 7 μmΩ is within the circuit substrate 5 ·, and the inductance component of the bonding pad can be ignored. The right side compares the ESL and ESR of a multilayer Taumman capacitor with a 0.22 aF electrostatic capacitance in the conventional technology to the multilayer Taurman capacitor according to the present embodiment. If the value of the multilayer ceramic capacitor according to the conventional technology is 100%, 5 The value of the multilayer ceramic capacitor in this embodiment can be reduced by 2 ~ 3 ° / 0. This is because in the multilayer ceramic capacitor of this embodiment, since the distance between the external electrodes 103 and 104 can be set to 5 and the height of the capacitor device as a whole can be kept low, even if the capacitor of this embodiment is installed in more than one In the multilayer substrate, the total inductance due to the routing of the bonding pads can be reduced, and the bonding pads formed on the multilayer substrate can be simplified. The second embodiment is as shown in FIG. 9 to FIG. 2. According to the illustrated embodiment, the square-shaped ceramic capacitor 23G has a capacitor body 22G, which is long; includes: Via body 220 As shown in FIG. 9 and FIG. 10, the system electrode 20 ". Also: the first internal electrode 20 ^ and the second internal electrical indication, the second plural two, in this embodiment, such as The ceramic layer 202 shown in FIGS. 9 and 10 is laminated on the water 7 卩 electrode 2011 and the second internal electrode 20 ″ through the height direction of the ceramic body 220, so that the short side of the ceramic layer 202 and the The capacitor ceramic layer 202 can be extended to at least two ends of the main body 2 20 in the lamination direction, as shown in FIG. ^ No, each first internal electrode 201 has a rectangular

2030-3679-?. ptd Page 22 498373 V. Description of the invention (19) | A main part is located on the first side (surface) of the ceramic layer 202. Only the first main side of || the main part of the lower (first) long edge ceramic layer 202 is exposed to the underside of the | I body 2 20. The longitudinal and transverse dimensions of the first electrode 2 01! Are set | ΐ ^? | So that the other long side and two short sides of the first electrode 20 I do not reach the ceramic layer | The second long side 2023 and two of the 02 Short side 202 (:： 202 (1. The first electrode 2011 | I may have a width that is the same as the width of the ceramic layer 202. One of the short sides of the | I-th electrode 20 L may be along the ceramic layer The short sides 202c and 202d of 202 are exposed. J In addition, each second internal electrode 2012 has a rectangular second main portion |

The rear surface of the first main portion with respect to the first internal electrode 20: (the second surface) passes through a ceramic layer 202 in the longitudinal direction. The second main portion 201a is composed of a pair of guide portions 201b and 201c exposed from the upper (second) long side to the second long side 202a of the ceramic layer 202. These guide portions 201b and 201c are formed so as to project upward from both ends of the long side of the rectangular second main portion 201a |

I out. / I

i The vertical and horizontal dimensions of the second electrode 20 "are set such that the second electrode I

The other long side and two short sides of the second main portion 201a of the pole 2 0 12 do not reach the first long side 202b and the two short sides 202c and 202d of the ceramic I layer 202. However, the width of the second | electrode 2 0 12 may be a size having the same width as the width of the ceramic layer 202. One of the short sides of the second electrode 2012 may be exposed along the short sides of the ceramic layer 202 j 202c and 202d.丨

I As shown in FIG. 9 and FIG. 10, in the present embodiment, in the body 220 II, the internal electrodes 201! And 2012 are laminated and alternately arranged through the ceramic layer 202; i is at different positions in the omnidirectional direction . !

2030-3679-P.ptd Page 23 η 刈 373 5. Description of the invention (20) As shown in Fig. 11, a first external electrode 203 is bonded to the bottom of the capacitor body 2 2 0 to be electrically connected to The first inner electrode 201! Of the first long side 202b of the ceramic layer 202 is exposed. The upper body i of the capacitor body 220 is joined with a pair of second outer electrodes 204 and 205 to be electrically connected to a guide portion 20 lb with a second long side 202a exposed along the ceramic layer 202. The second internal electrode 201c j 201m. The external electrode 203 is preferably formed on the entire lower surface of the capacitor body 2 2 G, but it is not necessarily limited to cover the entire surface. The coverage area can also be determined according to the shape of the pads of the multilayer substrate on which the capacitor 230 is to be mounted. The area of the first external electrode 203 is preferably at least 50% of the area of the body exposed to the long side of the first internal electrode 20! These internal electrodes 20 L and 2012 are formed by coating or grilling a nickel or other j conductive coating on the surface of a ceramic green sheet, and include a nickel or nickel j alloy layer and the like. Note that the internal electrode may also include a base metal copper, a precious metal palladium I or a palladium-silver alloy layer, and the like.

The I I ceramic layer 202 is composed of a barium titanate-based, titanium-based, halide-based, I, or other ceramic composition. The laminated layer of the ceramic layer 202 and the internal electrode is formed by coating and pottery clay on the surface of a base film or other films to form a / green sheet. A conductive coating is printed thereon, and then laminated, cut, and fired into the green Flakes. After the body 22 is produced, the external electrodes are constructed and grilled. Specifically, the external electrodes 203, 204 and 205 can be coated, dried, and grilled with a copper coating on the capacitor body 22 to form a ground layer, and then i is covered with a nickel and tin plating layer. Strata. 1 The multilayer ceramic capacitor 230 produced in this way is directly connected to the first external

498373 V. Description of the invention (21) Circuit pattern of the electrode 203 and the second external electrode 204 and 20, s is also rugged, and the difference from + one to the other substrate is different from% to μ. Multi-terminal stereo mounting. The connected outer # 笔 极 'and the multi-terminal multilayer ceramic capacitor used in this example are also limited in size f, but can be, for example, 0.5, 0.5 ± 0.1 color, 0.8 ± 0.1 m /, and = mm The thickness of the Man layer is not particularly limited, but it can be, for example, the 4 / ^ layer of the tomb is a short side 0 5 ± 01 dragon and a long side 16 soil 0 1 coffee ^ • ^ shaped electrode called and called can be 甴 丨^ To 珉 to the thickness of ㈣. The distance G between the external electrodes 203 and 204 and the distance G between the second electrodes may be set to correspond to the width of the short side of the ceramic layer, that is, 0.5 to 0.1 mm. The multi-terminal multilayer ceramic capacitor 23 () can be sandwiched and installed between the circuit substrates 2 06 and 2 7 facing in the power supply circuit with the semiconductor device D as shown in FIG. 12. This stereoscopic The installation can be performed in the following way. That is, the 'external electrodes 203, 204, and 205 are arranged to directly face the different circuit patterns 208, 209a, and 209b of the circuit substrate 205 and 206, and are connected as a positive / Negative electrode (GND). In this three-dimensional installation, the height of the capacitor device can be kept low as a whole, and the distance between the circuit substrates 2 06 and 2 7 facing each other is kept narrow. Therefore, the detour of the solder pads can be It is shortened, and the effect of the inductance element on the circuit side can be reduced. In order to reduce the inductance of the circuit pattern, the multilayer ceramic capacitor 230 with an ESL value of 10 to 20ρΗ and an ESR value as low as 5 to 7m Ω is embedded, and the inductance of the pad The component can be ignored. Therefore, if the conventional technology has an ESL of a multilayer ceramic capacitor with an electrostatic capacitance of 0.2 2 # F, and the ESR and

2030-3679-P.ptd Page 25, 498373! V. Description of the invention (22) I ^ j multilayer ceramic capacitor (same as the electrostatic capacitance of the conventional technology) If it is 100%, the value of the multilayer ceramic capacitor according to this embodiment can be reduced by 2 to 3%. This is because in the multilayer ceramic capacitor of this embodiment, the distance between the external electrodes I 203, 204, and 205 can be set short, the height of the capacitor device as a whole | it seems to be kept low, and the external electrode 203 is wide, to Easy connection of pads. In addition, even if the capacitor 230 of this embodiment is mounted on a multilayer substrate 5, the total inductance due to the routing of the bonding pad can be reduced, and the bonding pad formed on the multi-substrate substrate can be simplified. β a '

As shown in the figure, there is a 13th ceramic component, and the 2 inner ceramics are laminated by the inner side.

Fourth Embodiment Secondly, please refer to FIG. 13 to FIG. 16 to explain this embodiment. According to the Bejia example, a three-dimensionally mounted through-hole multilayer ceramic capacitor M with a m-capacity body 320 is rectangular. Hexahedral. The capacitor body 32, as shown in FIG. 14 and FIG. 14, includes a plurality of first internal electrodes 311 and second internal electrodes 30 12 alternately formed in a horizontal pattern in the figure by alternately forming a backup layer 3 02 in a rectangular shape. That is, as shown in FIG. 13 and FIG. 14 of the present embodiment, the plurality of first internal electrodes 30 込 and the first electrode 30 are laminated in the horizontal direction 5 through the ceramic layer 302 so that the layer = 302 short side and the capacitor body The direction of the height of 32 ° is the same. Note that at least one ceramic layer 302 formed by the electrode of the part can be laminated on both end surfaces in the direction of the body 3204. + — As shown in the U figure, each of the first internal electrodes 30 11 has a length: The first main point is located on the first side (surface) of the ceramic layer 302. The first long side of the net is exposed along the two long sides 302c and 302d of the ceramic layer 302.

Page 26

498373 V. Description of the invention (23) | The longitudinal and transverse dimensions of the first electrode ⑽ are set so that the two short sides of the first electrode 301! Do not reach the two short sides of the ceramic layer 302 and the sides 302 and 302b. In addition, each of the second internal electrodes 30 l2 has a rectangular second main portion 301a 'after a rear surface (first surface) of the first main portion 30 h with respect to the first internal electrode via a ceramic layer in the longitudinal direction. Department of the Second Main Section 30a

i is composed of a pair of guide portions 301b and 301c that are extended from the two short sides to the short sides 3023 and 3021 of the ceramic layer 302). These guide portions 30b and 301c are structured so as to protrude from the approximate center of the short side of the rectangular second main portion 3 (Ha toward the two sides I | 302a and 302b. The short side dimensions of the second main portion 301a are set So that | | the long side of the rectangular second main portion 30a does not reach the long sides i 30 2c and 302d of the ceramic layer 30. Note the vertical width of the guide portions 30b and 301c (body height | degree knife The width in the vertical direction) is smaller than the vertical width of the part 30a in the illustration, but ij can be the same width. Bayi | | In this example, as shown in Figures 13 and 14 In the body 3 2 Q | j, the internal electrodes 3011 and 3012 are laminated through the ceramic layer 302 and are alternately arranged at different positions in the vertical direction. As shown in FIGS. 13 and 16, the capacitor body 32 〇 The upper surface and lower surface | The first external electrode 303 and 303 are joined to be electrically connected to the long side 302 (with the long side of the exposed side of the ceramic layer 30 ^) and the long side of the exposed side of 302 (1 An internal electric ^ 3 01 !. The peripheral surface of the inverted side of the capacitor body 3 2 0 is joined with a strip-shaped second outer electrode j 304 to be electrically connected to a short bathroom having a ceramic layer 3 0 2 | 302b Exposed The second internal electrode 3〇 丨 of the guide part "Bu and Be." | J The first external electrodes 3 03 and 303 are preferably formed in the capacitor body 2 32

2030-3679-P.ptd Page 27, 498373 V. Description of the invention (24) It also covers the entire top or bottom, but it is not necessary to limit the shape of the pad that covers the entire multilayer substrate that can be installed according to the capacitor 3 3 0, ^ Covered area. Relative to the long side exposure of the first internal electrode for 30 hours determines the area above or below 320, the first external condyle electrode is 303 or 30, which is an area of at least 50 percent. The inner electrodes 30 and 3012 are formed by coating or grilling a conductive coating on the surface of a ceramic green sheet, and including / including other alloy layers. Note that the internal electrode may also include a base metal, copper, or nickel or palladium-silver alloy layer, and the like. . Shell & Gen # 5 ceramic layer 302 comprises a barium titanate-based, titanium-based, hammer salt or other ceramic composition. The product of the ceramic layer 300 and the internal electrode is dried and then baked with a copper coating on the capacitor body 320 to form a lower ground layer, which is covered with a nickel and tin plating layer. ^ The multilayer ceramic capacitor 330 produced in this way is formed by directly connecting the first external electrodes 30 3 and 30 3 ′ and the second external electrode 304 to different circuit patterns of the circuit substrate and supplying different voltages to adjacent external electrodes. And for the three-dimensional installation of multiple terminals. The unit size of the multi-terminal multi-layer ceramic capacitor of this embodiment is not limited. Restricted 'but may be, for example, height 0 · 5 ± 0 · 1 mm; width (K 8 ± 〇1 mm, and ^ 1 · 6 ± 0 · 1 mm. The thickness of the ceramic layer is not particularly limited, but may be, for example, $ 乂A piece of clay is formed on the surface of a base film or other film, and the stomach is formed into a thin sheet, and a conductive coating is printed on it, and then laminated and cut: a green sheet is formed. After that, it is constituted and grilled on the outer part of the grill and burned. Specifically, the external electrodes 30 3, 30 3, and 304 can be coated by the coating part.

Page 28

2030-3679-P.ptd 498373 V. Description of the invention (25) m. The shape of the ceramic layer is a rectangle with a short side of 0.5v 〇. Imm and a long side of 16 ± (Klmm. The internal electrodes 3011 and 3〇19 can be composed of a thickness of 5 to 2 (). Between the external electrodes 303 and 303, The distance H can be set to correspond to the width of the short side of the ceramic layer 302 ', that is, 0.5 ± 〇Um. The through-hole laminated ceramic ceramic 3 3 () thus arranged can be sandwiched and installed as shown in FIG. 16 Between the circuit substrates 305 and 306 of the lightning source Xuezhi shown with the semiconductor device {) shown. The chaotic one-dimensional installation can be performed as follows. That is, the external electrodes 303 and 303 facing vertically are arranged so as to face different circuit patterns 3007a and 3007b facing the circuit substrates 305 and 306, and the external electrodes 3 extending through the entire peripheral surface of the side surface 〇4 series is set to be straight === away from the circuit patterns 308a and 308b, and these series are electrically connected as: pole / negative lion). In this three-dimensional installation, the height of the capacitor device is kept low, and in addition, the facing circuit substrates 305 and 306 are kept narrow. Therefore, the routing of the bonding pad can be shortened, and the effect of the inductive element can be reduced. In order to reduce the inductance of the circuit pattern, it is determined that the value of £ is fixed and the SSR value is as low as 5 ~? The ΏΩ multilayer ceramic capacitor 330 is neglected. Therefore, if the conventional technology has a built-in multilayer structure of 022 # F = capacitance: it is the other of the capacitor and the ESR is according to this embodiment; the layer: the actual capacitance (same as the electrostatic capacitance of the conventional technology); The value of the multilayer ceramic capacitor according to the second technique is 100%, and the value of the multilayer ceramic capacitor according to this embodiment can be reduced by 2 to 3%. This is the external electrode of the multilayer ceramic capacitor applied in this embodiment. . The distance between 303 ’and 304 can be set short, the height of the capacitor device as a whole

2030 > 3679-P.Ptd Page 29 498373 V. Description of the invention (26) It seems to be kept low. In addition, the external electrode is wide, and the connection to the bonding pad is easy, so even if the capacitor is mounted on a multilayer substrate, the total inductance due to the routing of the bonding pad can be reduced, and the bonding pad formed on the multilayer substrate Can be simplified. Although the present invention has been disclosed as above with several preferred embodiments, it is not a lie? As for the present invention, any person skilled in the art can still make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application. .

2030-3679-P.ptd Page 30

Claims (1)

498373 、 Application patent scope 1 1 A multilayer ceramic capacitor for three-dimensional installation, comprising: | a ceramic layer composed of a rectangle; | a first internal electrode having a first side along the first side of the aforementioned ceramic layer in the vertical direction! A rectangular first main portion extending in a direction, and having a plurality of first guide portions extending from a long side of the first main portion to a long side of the Taumman layer; a second internal electrode having the same shape as the first The aforementioned first | main portion of an internal electrode is a rectangular second major portion facing through the ceramic layer and located on the second surface of the aforementioned ceramic layer opposite to the first surface, and has a length from the aforementioned second major portion A plurality of second guide portions extending to the long side of the ceramic layer at different positions from the first guide portion provided on the first internal electrode; a rectangular hexahedral capacitor body including a plurality of the first An internal electrode and the second internal electrode are laminated by the ceramic, so that the short side of the foregoing ceramic layer is consistent with the height direction of the capacitor body; J; | Is formed above and below the capacitor body, and is electrically connected to the aforementioned first guide portions located in the same row along the laminated direction of the ceramic layer; and the second external electrode corresponds to the first external portion. The electrodes are alternately formed on the upper surface and the lower surface of the capacitor body, and are electrically connected to the second guide portions located in the same row along the stacking direction of the Taoman layer, respectively. 2. The multi-layer mounted multilayer ceramic ceramic capacitor according to item 1 of the scope of patent application, wherein the first external electrode system is connected to the first circuit pattern outside the capacitor body j, and the second external electrode system is Connected with before 11 II I __Beg_ II Guo Xing_1 Yuanyuan I! 11 ____ 2030-3679-P.ptd Page 31 4 498373 i 6. Scope of Patent Application I The second circuit pattern of the first circuit pattern is different. 3 · Multilayer ceramic capacitors for three-dimensional installation as described in item 1 of the scope of patent application, wherein the aforementioned multilayer ceramic capacitors are buried in a three-dimensional circuit-based I-board. i i 4, a multilayer ceramic capacitor for stereo mounting, including:! I a Taurman layer composed of a rectangle; | | a first internal electrode 5 has a rectangular first main portion extending in the longitudinal direction I along the first surface of the aforementioned ceramic layer, and has a first A! A long side and a first long side of the aforementioned first main part exposed; II a second internal electrode having the aforementioned ceramic I opposite the first surface I The rectangular second main portion 5 of which the second surface of the porcelain layer extends in the longitudinal direction and has a second I of the aforementioned second main portion that is exposed along the second long side of the aforementioned ceramic layer! The bulk capacitor body includes a plurality of the aforementioned first internal II electrodes and the aforementioned second internal electrodes through the aforementioned ceramic lamination so that the short side of the aforementioned ceramic layer is consistent with the height direction of the aforementioned capacitor body; I a first external electrode Is formed above or below the capacitor body, and is respectively electrically connected to the first internal electrode described above that is exposed along the first long side of the ceramic layer; and j The second external electrode is formed above or below the capacitor body, and is electrically connected to the second internal electrode respectively exposed along the second long side of the ceramic layer. 5 5, as described in item 4 of the scope of the patent application for the three-dimensional installation of the multilayer | ceramic capacitor 5 wherein the aforementioned first external electrode is connected to the aforementioned capacitor body I f 2030-3679-P.ptd Page 32 498373 6. Scope of patent application The first circuit pattern on the outside, and the second external electrode is connected to a second circuit pattern different from the first circuit pattern. I 6. The multilayer ceramic capacitor for three-dimensional installation as described in item 4 of the scope of patent application, wherein the aforementioned multilayer ceramic capacitor is buried in a three-dimensional circuit substrate. 7. —A multilayer ceramic capacitor mounted in a three-dimensional installation, including: I a ceramic layer composed of a rectangle; 1 a first internal electrode having a rectangular first extending in a longitudinal direction along a first surface of the ceramic layer A main part having the first long side of the first main part exposed along the first long side of the pottery layer; a second internal electrode having the pottery | porcelain layer opposite the first surface The second side of the rectangular second main portion extending in the longitudinal direction has a plurality of guide portions extending from the second long side of the second main portion to the second long side of the ceramic layer;! A rectangle The hexahedron-shaped capacitor body includes a plurality of the aforementioned first internal I electrodes and the aforementioned second internal electrodes by the aforementioned ceramic lamination so that the short sides of the aforementioned ceramic layer are consistent with the height direction of the aforementioned capacitor body; I-first The external electrode is formed on the upper or lower surface of the capacitor body, and is electrically connected to the first internal electrode described above exposed along the first long side of the ceramic layer; and the second external electrode is formed on Said capacitance above or below the main body, and electrically connected to the ceramic layers along the second long side of said exposed front guide portion I. \ 8. As described in item 7 of the scope of the patent application, the layering of the three-dimensional installation 2030-3679-P.ptd Page 33, 498373 I Sixth, the scope of patent application |! Ceramic capacitor 5 wherein the aforementioned plurality of second external electrodes are arranged on the capacitor body with a distance substantially equivalent to the aforementioned short side of the aforementioned ceramic layer The aforementioned! I above or below mentioned. II 9 · The multilayer j 1 ceramic capacitor for stereoscopic installation as described in item 7 of the scope of patent application, wherein the first external electrode is a first circuit pattern connected to the outside of the capacitor body II, and the second external electrode is It is connected to the second circuit pattern which is different from the former circuit. | 1G · If the scope of patent application is the first? The multilayer ceramic capacitor for three-dimensional mounting according to the item above, wherein the multilayer ceramic capacitor is embedded in a three-dimensional circuit substrate I In the board. I 11. A multilayer ceramic capacitor for three-dimensional mounting, comprising: I a ceramic layer formed of a rectangle; I 1 a first internal electrode: having a first frame extending vertically along the aforementioned Taoman layer | j direction A rectangular first main part having two long sides of the first main part that are respectively exposed along the long side 1 of the ceramic layer; a second internal electrode having the pottery j facing the first part The rectangular second main portion of the second layer of the porcelain layer extending in the longitudinal direction, and I having i extending from the short side of the aforementioned second main portion to the short side of the aforementioned ceramic layer, respectively—the pair of guides;! A rectangular hexahedron-shaped capacitor body includes a plurality of the aforementioned first internal I electrodes and the aforementioned second internal electrodes through the aforementioned ceramic lamination, so that the short sides of the aforementioned ceramic layer are consistent with the height direction of the aforementioned capacitor body; j a The first external electrode is formed on the upper and lower surfaces of the capacitor body, and is electrically connected to the I exposed to the long side of the ceramic layer. 2030-3679-P.ptd Page 34 498373 VI. Patent application scope First internal electrode; and |! The second outer electrode, which is formed on the side of the capacitor body, and is electrically connected to the ceramic layer respectively The aforementioned guide portion of the aforementioned short side is exposed. ί! 12. The product of three-dimensional installation as described in item 范围 of the patent application scope | 1 I-layer ceramic capacitor, wherein the second external electrode is in a strip shape along the entire periphery of the four sides of the capacitor | 丨 the body面 Extending. i! i 3. The three-dimensionally mounted product 1 j-layer ceramic capacitor as described in item Π of the application scope, wherein the first external electrode is connected to the first circuit pattern on the outside of the capacitor | The second external electrode is connected to a second circuit pattern different from the first circuit pattern. i 1 4. According to item 1 of the scope of the patent application, the product for three-dimensional installation | | layer ceramic capacitors, wherein the aforementioned multilayer ceramic capacitors are buried in a three-dimensional circuit I I substrate. i X i I 15. The three-dimensionally mounted I-layer ceramic capacitor as described in item 14 of the scope of the patent application, wherein the aforementioned first external electrode of the aforementioned laminated ceramic capacitor is directly connected to the aforementioned second external electrode system In the circuit pattern formed on the three-dimensional circuit substrate. 2030-3679-P.ptd Page 35