CN103814629B - 电子组件及其制造方法 - Google Patents

电子组件及其制造方法 Download PDF

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Publication number
CN103814629B
CN103814629B CN201280040829.3A CN201280040829A CN103814629B CN 103814629 B CN103814629 B CN 103814629B CN 201280040829 A CN201280040829 A CN 201280040829A CN 103814629 B CN103814629 B CN 103814629B
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bonding pad
section
core space
building brick
electronic building
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CN103814629A (zh
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T.戈特瓦尔德
C.罗斯尔
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Schweizer Electronic AG
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Schweizer Electronic AG
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H02K11/30—Structural association with control circuits or drive circuits
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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Abstract

本发明涉及一种电子组件(50、50′)，具有包括多层结构(10)的印刷电路板结构，所述多层结构具有至少两个导电层(12、14)，并且具有与所述两个导电层(12、14)连接的附加的无源构件(C、C′；L)，其中，所述两个导电层(12、14)各具有至少一个延长超出多层结构(10)的区段，用以构成连接区(12.2、14.1、14.2)，并且其中，所述无源构件(C、C′；L)直接与连接区(12.2、14.1、14.2)接触。

Description

电子组件及其制造方法
技术领域
本发明涉及一种电子组件及其制造方法，以及涉及一种例如用于汽车的电动机。
已知例如形式上为DCB模件(Direct Copper Bonding铜瓷直接键合)的电力电子设备的电子构件或电子元件或组件。在这里大多涉及带有被钎焊的功率半导体的陶瓷基体，在该功率半导体上连接有其他必要的(无源)构件。在逆变器/整流器中，这些构件可以是电容器(尤其薄膜电容)和电感。
因此，根据本发明，提供了一种电子组件，具有包括多层结构的印刷电路板结构，所述多层结构具有至少两个导电层，并具有与所述两个导电层连接的附加的无源构件，其中，所述两个导电层各具有至少一个延长超出多层结构的区段，用以构成连接区，并且其中，所述无源构件直接与连接区接触，并提供了上述这种电子组件的制造方法，并且提供了一种由带有集成的功率半导体和附加的无源构件的印刷电路板多层结构组成的装置，其中，所述无源构件的连接区直接从印刷电路板多层结构引出并直接与所述无源构件连接，并且提供了一种电动机，该电动机包括设计为整流/逆变系统的上述电子组件，其中，为构成冷源，所述印刷电路板多层结构直接安装在电动机的冷却区上。
根据本发明的电子组件具有带有多层结构的印刷电路板结构。所述多层结构按己知的方式包括至少两个导电层。本发明规定，这两个导电层的每一层这样延伸，从而使所述导电层具有超过多层结构伸出的区段，所述区段被定义为用于与附加的无源构件构成直接接触的连接区。这些连接区可例如设计为板状或条状的。
这可以明显减小在已知的DCB模件中由于其较长的导线和接头而大幅存在的寄生电感。此外可以将功率半导体短且低感应地连接在多层结构内并实现紧凑的结构。在有源与无源构件之间尤其通过焊接形成的连接点的数量减少，因为只有从印刷电路板核心区伸出的连接区才必须与无源构件连接。附加的无源构件例如可以是电容器和/或电感和/或电阻。
为了制造根据本发明的电子组件而制备多层结构，所述多层结构带有导电的支承层和至少另一个导电层。所述支承层和所述另一个导电层带有超过多层结构核心区伸出的层区段。至少部分去除不需要作为连接区的层区段，并且也至少部分去除超过核心区伸出的预浸料层区段。在必要时，剩余的超过核心区伸出的层区段为了构成用于无源构件的连接区而被弯曲。这意味着，在没有附加的中间连接点的情况下，通过集成在内和超过原本的层状结构伸出的连接区而特别简单地制造一种用于直接低感应地连接无源构件的紧凑的组件。
根据一种变形方式，在至少部分去除(层区段)的步骤前，在所述另一个导电层伸出的层区段与支承层伸出的层区段之间形成至少一个层间电接触头，以及将所述另一个导电层伸出的层区段与此另一个导电层分离。由此达到，这两个超过多层结构伸出的连接区处于相同的平面并具有同样的厚度。
此外，通过结合超过多层结构伸出的连接区与电感构件、例如铁氧体磁芯，可以有目的形成具有特定值的电感。这种电感构件可以自身单独使用或也可以结合其他无源构件、如电容器共同使用。
所述连接区可以具有至少一个凹槽，在该凹槽内包含有用于连接无源构件的接触面。由此便于与无源构件直接连接。接触面可例如借助至少一个固定杆与连接区电连接。因此基于所述固定杆较小的横截面而在钎焊/熔焊时产生较低的传热。所述接触面例如可以这样直接钎焊在薄膜电容器的金属喷镀层上。为所述接触面以及固定杆的设计提供了不同的几何形状。所述固定杆可以被这样设计，即所述固定杆在工作时具有不同的膨胀系数或承受与此相关联的机械应力。所述固定杆例如可以曲折形/蛇曲状延伸，或通过其安装的几何形状允许变形或扭转。
由说明书和附图得知本发明的其他优点和设计。
当然，在不脱离本发明的范围的情况下，上面提及的并在下面还要阐述的这些特征，不仅能以已说明的各种组合方式使用，而且也可以以其他组合方式或独立使用。
本发明为了进行阐述，借助附图中的实施例而非常示意性地且未按尺寸比例地示出了本发明，并在下面根据附图详细说明。
附图说明
图1示出通过本发明电子组件的第一实施例的侧向剖视图；
图2示出通过本发明电子组件的第二实施例的侧向剖视图；
图3至6显示出根据本发明的连接区的制造过程；
图7示出多层结构，其带有在制造根据本发明的连接区时使用的隔离层；
图8至12显示出根据本发明的连接区另一种制造过程；以及
图13示出根据本发明的连接区设计的俯视图。
具体实施方式
图1以侧向剖视图方式示出根据本发明的电子组件50。
所述组件50包括印刷电路板多层结构，所述印刷电路板多层结构具有支承(嵌入的)半导体构件18的支承层12。预浸料层或由前者的预浸料层得到的树脂层20在所述支承层12和半导体构件18的上方延伸，在所述预浸料层或树脂层上具有另一个导电层14。所述另一个导电层14具有与半导体构件18的层间电接触连通。如图所示，在上部导电层14上可以例如通过层压安置逻辑电路40。电子组件的图示实施例涉及电桥装置中的整流/逆变系统和相关的逻辑控制。然而，图示的逻辑电路也可以作为单独的电路存在，并借助常用的连接技术与电力电子部件相连接。
在支承层下方，设有通过第二预浸料料层22与所述支承层隔开的第二另一个导电层16。该第二另一个导电层16与支承层12电绝缘地布置，但该导电层的材料厚度及材料性质是这样选择的，使之具有良好的导热性并与此同时达到高的耐击穿强度。本装置通过第二另一个导电层16安装在冷源60上。
与冷源60的连接可直接在工厂里完成，从而使根据本发明的构件已经与冷却元件整体交货。这可以例如在根据图2中表示的紧凑的结构中提供一种围绕包括冷源在内的多层结构的环形电容器。另一方面，所述组件也可以在规定的地点才与在该处可能已经存在并用作冷源的元件连接。为此，在所述组件下侧(亦即在第二导电层16下侧)可以具有(图中没有表示的)带有足够导热性能的粘结膏层或类似物(参见在下面段落中描述的车辆电动机的例子)。
所述支承层12在图1所示的视图中向右超过原来的多层结构伸出，并构成连接区12.2。以类似的方式，所述另一个导电层14沿反方向超过多层结构的“核心区”或“功能区”伸出，以构成连接区14.1。在图示的实施例中，连接区12.2和14.1是用于电容器C的接头，所述电容器C借此与功率半导体的漏极接头或源极接头直接连接。
根据本发明，连接区12.2和14.1以此方式直接从印刷电路板多层结构引出，并直接与无源构件、例如与在本实施例中的电容器连接。由此实现无源构件在半导体构件18上较短的连接。根据本发明的电子组件具有简单的结构、明显更高的结构密度/集成度，以及更低的寄生电感。
此外，所述连接区14.1和12.2设计为负载电感L。负载电感L可例如通过一个或多个铁氧体磁芯构成。
此外，根据本发明的设计，还允许至少一个构成负载电感的铁氧体磁芯直接与冷源60接触。
图2示出了本发明的电子组件50′的另一种设计，所述设计具有围绕印刷电路板结构设置的环形电容器C′。在这种情况下，漏极/源极连接区12.1、14.1、12.2、14.2形成由支承层12和另一个导电层14组成的结构的两侧，从而总共存在四个连接区12.1、14.1、12.2、14.2。原则上，环形电容器C′可以只与两个接头连接(如在图1所示的实施例中)，不过为了减小寄生电感人们仍令其与四个接头连接，就可以使在环形电容器的金属喷镀层中出现的所述寄生电感减为二分之一。
如由图2所示的视图中可以看到的那样，本发明利用环形电容器实现了特别紧凑和扁平的结构，因为包括冷源60在内的整体内部结构被电容器围绕。在这种布置中，根据本发明的连接区可以设计得比较短。所述环形电容器在其内部(亦即环形孔)容纳有印刷电路板多层结构，连接区从所述印刷电路板多层结构向外延伸。这些连接区直接与环形电容器的接头连接。在图示的实施例中，冷源60也布置在环形电容器的内部，用以实现尽可能紧凑的结构。
当然，这也可以利用矩形电容器实现。可选地，可以在成对连接区12.1、14.1和12.2、14.2的左与右安装两个独立的电容器组。
在具体使用时，所述电子组件可是车辆电动机的整流器/逆变器。在这种情况下，组件可以以特别节省空间的方式直接(为避免形成空气间隔，在其间利用适于导热的连接层、例如粘结膏、烧结膏、钎焊膏或类似物)固定在电动机的(始终存在的)冷却段上(，从而使冷却段构成冷源60，并无需额外的冷源。
为了制造根据本发明的电子组件，制备已知的多层结构10′(参见图3)。这种多层结构例如可以是如同一申请人的平行德国专利申请102010060855.6已知的那种结构。
制备好的多层结构10′包括第一导电层12，所述第一导电层12是用于图中未表示的半导体构件18的支承层。此外，多层结构10′还包括另一个导电层14，在图3的视图中所述另一个导电层处于第一导电层12上方。在这两个导电层12、14之间设置预浸料层20，所述预浸料层可以由具有导热性能的材料制成。
此外，多层结构10′还包括第二另一个导电层16，在图3的视图中所述第二另一个导电层16布置在第一导电层12的下方，并通过第二预浸料层22与所述第一导电层12隔离。所述第二预浸料层22也可以由具有导热性能的材料制成。
所述另一些导电层14、16可以是可经额外电镀处理的铜箔。
所述根据本发明的印刷电路板多层结构可以具有围绕支承层12的对称结构，也就是说，与另一些导电层14、16分别有相同的厚度一样，预浸料层20、22也具有相同的厚度。结构的对称性带来组件的高可靠性。如DCB基体那样的不对称结构在热交变负荷作用下容易弯曲，相较而言，在所描述的对称结构中，这种状况得到抑制。
在图3中通过两条垂直延伸的虚线表示要制造的电子组件的实际尺寸/宽度，并在下文中称为“核心区”或功能区K。为了制造根据本发明的超过多层结构伸出的层区段，在该方法步骤中，将多层结构10′的这些层超过虚线一直朝两侧伸出，使之相当于稍后的连接区的期望长度。所述层的这些区段用对应于附图标记的尾标“.1”或“.2”表示。被自由铣的内衬F处于支承层12或12.2(在视图中)的左侧和右侧。
在虚线左侧和右侧的区段中，预浸料层20.1、20.2、22.1、22.2可以由与在虚线之间的“核心区”K相同的(具有导热性能的)材料制成，或当出自于成本的原因时由更便宜的标准材料制成。所述印刷电路板多层结构的那个具有电力电子器件和必要时功能控制器件的区段，称为“核心区”K或也称功能区。超过这种核心区伸出的区段用于实现根据本发明的思路，亦即可以提供与无源构件的直接连接方式。
图4示出经腐蚀过程处理后的多层结构：正如同第一另一个导电段14的两个伸出的区段之一14.2那样，第二另一个导电段16超过核心区伸出的区段16.1、16.2已被腐蚀掉。正如稍后还需要的第一另一个导电段14和支承层12的区段14.1和12.2那样，腐蚀过程不触及预浸料层。
在接下来的步骤中，暴露的预浸料层20.1、20.2、22.1和22.2通过铣削(深铣)被基本去除(参见图5)，从而留下多层结构10，它在“核心区”K内的这些层相应于期望的尺寸，其中两层分别具有超过多层结构10伸出的层区段14.1、12.2。这些层区段14.1、12.2被定义为连接区，并在必要时通过后续的方法步骤被这样弯曲，从而使所述连接区用于与无源构件的直接接触(参见图6)。根据本发明，这些连接区可以设计为板状或条状的。所述连接区尤其被这样设计，从而使所述连接区适用于与至少一个附加的无源构件直接接触，而无需额外的连接元件(尤其如电缆或类似物)。
然后，如此构成的连接区14.1、12.2可以与无源构件、在本实施例中为电容器C、C′(例如通过钎焊、必要时经由金属喷镀层)连接。
此外，所述连接区14.1、12.2中的一个或两个可以设计为至少一个负载电感L，为此利用例如铁氧体磁芯围绕导电的连接区。此外，所述结构可以与冷源60连接。成品可以浇铸完成(铸壳70；参见图1)。
图7示出原始多层结构10″的一种变形方式。此多层结构的基本构造相应于与图3所示，具有的区别在于，在伸出的层区段14.1和12.2与和所述层区段毗邻的预浸料层区段20.1、20.2、22.2之间设置隔离膜11、13、15，所述隔离膜利用机械的手段通过拉脱、剥离等方式实现或简化了预浸料层20.1、20.2、22.2从稍后的连接区14.1、12.2上的去除。为此深铣待拉脱区的轮廓，以得到抵达隔离膜的通道。其优点在于，只须铣削、蚀刻或激光标刻所述轮廓，而不是整个面。除了图示和描述过的隔离膜(在这里例如可以是聚四氟乙烯薄膜或聚四氟乙烯类薄膜)，还可以使用其他任何能防止预浸料层与导电层粘结的隔离装置。所述隔离装置也可以是适宜的液态或膏状材料，借助丝网印刷、喷射或浸泡来涂覆所述液态或膏状材料。
如在图8中所示，另一种变形方式设有所谓平面充填。
在这种实施方案中设置多层结构10″′，其中支承层12仅稍微延长超过“核心区”K(标记12′)。如在之前的那些实施例中那样，另一个导电层14在两侧超过核心区伸出(标记14.1和14.2)。
在下一个步骤中形成所述第一另一个导电层14加长的层区段14.1与在其下方支承层12的较短凸块12′的层间电接触头17(也可以是多处层间电接触头、例如呈一排或多排层间电接触头的形式)(参见图9)，并在此之后将层区段14.1在“核心区”边界和层间电接触头17前(参见图10，标记19)从第一另一个导电层14分离。以此方式形成(略厚的)支承层12与第一另一个导电层14(较薄的)连接区之间的连接，从而使支承层12具有较薄的“辅助”连接区。其结果是，所述连接区双双i)处于一个平面上，并且ii)有相同的厚度。
接着，从与所述第一另一个导电层14的对置侧、亦即从第二另一个导电层16的一侧开始进行深铣，用以在核心区的每一侧均构成一个弯曲区24。在核心区外部、但在其附近实施深铣，从而使连接区的弯曲能尽可能靠近核心区进行。深铣穿过除连接区14.1和14.2之外的所有分层(参见图11)。
最后，第二次深铣同样可以从与所述第一另一个导电层14的对置侧、亦即从第二另一个导电层16的一侧开始进行。所述第二次深铣用于形成钎焊接头26，用以能连接无源构件(参见图12)。剩余区域28带有在连接区14.1和14.2下方的分层组，所述剩余区域28可以在浇铸时用作相对于围绕电子组件(未表示的)外壳的间隔件。
图13示出根据本发明的连接区12.2或14.1的设计的局部俯视图。所述连接区有一个或(如图所示)多个凹槽30(在图13的实施例中示出了四个凹槽)。在每个凹槽30内设有接触面32，所述接触面被设置并设计用于熔焊或钎焊在待连接的无源构件的触点上。在图示的实施例中，接触面32有大致呈矩形的平面设计，但它们也可以有其他任何且适宜的形状。
所述接触面32借助至少一个固定杆34与连接区电连接。在图示的实施例中，每个接触面32设置四个固定杆34；然而固定杆也可以更多或更少。这些固定杆34具有比连接区周围更小的传热横截面，从而简化熔焊或钎焊过程。
此外，所述固定杆34被这样设计，从而使所述固定杆抵消在(与产热相关的)工作时不同的膨胀系数。其实现方式如下：即固定杆34适用于吸收机械张力负荷或拉力负荷。在图示实施形式中的几何形状布置是这样的，即在直线固定杆34的情况下可以实现接触面32的旋转。这是通过在接触面与连接区连接时破坏对称性达到的。另一种(图中未表示的)可能性例如在于，将一个或多个固定杆设计为蛇曲状或锯齿形或类似形状。
本发明因而可以在印刷电路板多层结构上直接连接无源构件，而无需额外的连接装置、导线、压焊丝之类。仅需对构件进行连接(一般用钎焊)。由此缩短接触路径、增大钎焊连接的数量并进而也提高可靠性、减小寄生电感并提高集成密度。

Claims (15)

1.一种电子组件(50、50′)，具有包括多层结构(10)的印刷电路板结构，所述多层结构(10)具有至少一个导电的、配备半导体构件(18)的支承层(12)和至少另一个与所述半导体构件(18)相连接的导电层(14)，该电子组件还具有与支承层(12)和导电层(14)连接的无源构件(C、C′；L)，其中，所述支承层(12)和导电层(14)各具有至少一个延长超出多层结构(10)的核心区(K)的区段，所述区段具有设在区段上构成的连接区(12.2、14.1、14.2)，所述连接区通过至少部分去除超过核心区(K)伸出的、不需要作为连接区的层区段(16.1、16.2、14.2)和通过至少部分去除超过核心区(K)伸出的预浸料层区段(20.1、20.2、22.1、22.2)而构成，并且其中，所述无源构件(C、C′；L)直接与连接区(12.2、14.1、14.2)接触。
2.按照权利要求1所述的电子组件(50、50′)，其中，所述无源构件是电容器(C、C′)和/或电感(L)。
3.按照权利要求2所述的电子组件(50、50′)，其中，所述电容器是围绕印刷电路板多层结构的环形电容器(C′)，和/或
其中，设置直接与所述连接区(12.1、12.2、14.1、14.2)连接的负载电感(L)。
4.按照上述权利要求之一所述的电子组件(50、50′)，其中，所述印刷电路板多层结构与冷源(60)连接，和/或
其中，直接与所述连接区(12.1、12.2、14.1、14.2)连接的负载电感(L)直接与冷源(60)连接，和/或
所述电子组件被容纳或浇铸在铸壳(70)内。
5.按照权利要求1至3之一所述的电子组件(50、50′)，其中，所述至少一个连接区(12.2、14.1、14.2)具有至少一个凹槽(30)，在所述凹槽(30)内包含有用于接触无源构件的接触面(32)。
6.按照权利要求5所述的电子组件(50、50′)，其中，所述接触面(32)被设计用于直接接触薄膜电容器的金属喷镀层，和/或
其中，所述接触面(32)借助至少一个固定杆(34)与连接区电连接，和/或
其中，所述接触面(32)借助至少一个固定杆(34)与连接区电连接，并且所述固定杆(34)被设计用于在组件工作时承受不同的膨胀系数。
7.一种电动机，包括设计为整流/逆变系统的按照前列诸权利要求之一所述的电子组件(50、50′)，其中，为构成冷源(60)，所述印刷电路板多层结构直接安装在电动机的冷却区上。
8.一种制造根据权利要求1至6之一所述的电子组件(50、50′)的方法，包括下列步骤：
-制备多层结构(10′；10″；10′″)，包括导电的支承层(12)和至少另一个导电层(14)，所述导电的支承层和至少另一个导电层具有超过多层结构核心区(K)伸出的层区段(12′、12.2、14.1、14.2)，
-至少部分去除超过核心区(K)伸出的、不需要作为连接区的层区段(16.1、16.2、14.2)，
-至少部分去除超过核心区(K)伸出的预浸料层区段(20.1、20.2、22.1、22.2),
-在剩余的超过核心区(K)伸出的层区段上构成连接区(14.1、12.2；14.2)，以及
-将无源构件(C、C′；L)与连接区(14.1、12.2；14.2)直接接触。
9.按照权利要求8所述的方法，其中，构成连接区(14.1、12.2；14.2)的步骤包括弯曲剩余的超过核心区(K)伸出层区段的步骤。
10.按照权利要求8所述的方法，其中，在至少部分去除超过核心区(K)伸出的不需要作为连接区的层区段(16.1、16.2、14.2)的步骤前，实施下列步骤：
-在所述另一个导电层(14)伸出的层区段(14.1)与支承层(12)伸出的层区段(12′)之间形成层间电接触(17)，
-将所述另一个导电层(14)伸出的层区段(14.1)与此另一个导电层(14)分离。
11.按照权利要求8至10之一所述的方法，其中，这两个所述部分去除的步骤实施如下：
-在核心区(K)的每一侧，通过深铣有限地去除除连接区(14.1、14.2)外的所有层，来构成弯曲区(24)。
12.按照权利要求8至10之一所述的方法，其中，在所述部分去除的步骤后，剩余区域(28)带有在连接区(14.1、14.2、12.2)下方的分层组，所述剩余区域(28)被用作相对于围绕电子组件的外壳的间隔件(28)。
13.按照权利要求8所述的方法，其中，在所述伸出的层区段(14.1和12.2)与和所述伸出的层区段(14.1、12.2)毗邻的预浸料层区段(20.1、20.2、22.2)之间设置隔离装置(11、13、15)，用以将预浸料层区段(20.1、20.2、22.2)从稍后的连接区(14.1、12.2)上机械去除。
14.按照权利要求8所述的方法，其中，去除所述不需要作为连接区的层区段(16.1、16.2、14.2)通过腐蚀实现，并且去除所述超过核心区(K)伸出的预浸料层区段(20.1、20.2、22.1、22.2)通过铣削实现。
15.按照权利要求8或14所述的方法，其中，去除所述超过核心区(K)伸出的、不需要作为连接区的层区段(16.1、16.2、14.2)，以及去除所述超过核心区(K)伸出的预浸料层区段(20.1、20.2、22.1、22.2)全部进行。
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