CN102065636A - 电路板及应用该电路板的电子装置及液晶显示器 - Google Patents
电路板及应用该电路板的电子装置及液晶显示器 Download PDFInfo
- Publication number
- CN102065636A CN102065636A CN2009103096109A CN200910309610A CN102065636A CN 102065636 A CN102065636 A CN 102065636A CN 2009103096109 A CN2009103096109 A CN 2009103096109A CN 200910309610 A CN200910309610 A CN 200910309610A CN 102065636 A CN102065636 A CN 102065636A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- row
- plate body
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000006698 induction Effects 0.000 abstract description 2
- 230000001939 inductive effect Effects 0.000 description 13
- 238000004804 winding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103096109A CN102065636A (zh) | 2009-11-12 | 2009-11-12 | 电路板及应用该电路板的电子装置及液晶显示器 |
US12/944,778 US20110109416A1 (en) | 2009-11-12 | 2010-11-12 | Inductor of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103096109A CN102065636A (zh) | 2009-11-12 | 2009-11-12 | 电路板及应用该电路板的电子装置及液晶显示器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102065636A true CN102065636A (zh) | 2011-05-18 |
Family
ID=43973731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009103096109A Pending CN102065636A (zh) | 2009-11-12 | 2009-11-12 | 电路板及应用该电路板的电子装置及液晶显示器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110109416A1 (zh) |
CN (1) | CN102065636A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104658931A (zh) * | 2013-11-20 | 2015-05-27 | 英特尔公司 | 衬底封装核中的编织的电气组件 |
CN105023732A (zh) * | 2015-06-30 | 2015-11-04 | 安捷利(番禺)电子实业有限公司 | 立体电感线圈及采用印制电路法制备立体电感线圈的方法 |
CN105671786A (zh) * | 2016-03-18 | 2016-06-15 | 苏州椒图电子有限公司 | 一种传感电路的加工方法 |
WO2022134847A1 (zh) * | 2020-12-25 | 2022-06-30 | 京东方科技集团股份有限公司 | 集成有无源器件的基板及其制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10393908B2 (en) | 2016-12-15 | 2019-08-27 | Rockwell Automation Technologies, Inc. | Bobbin construction and coil winding method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1045002A (zh) * | 1990-03-15 | 1990-08-29 | 中国康复研究中心康复工程研究所 | 一种能产生瞬态强磁场的线圈 |
US5055816A (en) * | 1989-06-26 | 1991-10-08 | Motorola, Inc. | Method for fabricating an electronic device |
CN1469400A (zh) * | 2003-07-02 | 2004-01-21 | 威盛电子股份有限公司 | 形成于二布线层间的电感 |
JP2004235596A (ja) * | 2003-01-30 | 2004-08-19 | Koshin Denki Kk | プリント基板形コイル |
US20070090912A1 (en) * | 2005-10-20 | 2007-04-26 | Sheng-Yuan Lee | Embedded inductor and application thereof |
CN101002515A (zh) * | 2004-07-28 | 2007-07-18 | 埃托特克德国有限公司 | 通过直接写入技术制造电子电路器件的方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3757028A (en) * | 1972-09-18 | 1973-09-04 | J Schlessel | Terference printed board and similar transmission line structure for reducing in |
JPH033289A (ja) * | 1989-05-30 | 1991-01-09 | Gurafuiko:Kk | ツイスト・プリント配線 |
US5461353A (en) * | 1994-08-30 | 1995-10-24 | Motorola, Inc. | Printed circuit board inductor |
JPH1140915A (ja) * | 1997-05-22 | 1999-02-12 | Nec Corp | プリント配線板 |
JP4005762B2 (ja) * | 1999-06-30 | 2007-11-14 | 株式会社東芝 | 集積回路装置及びその製造方法 |
JP2002009244A (ja) * | 2000-06-21 | 2002-01-11 | Hitachi Ltd | 半導体集積回路および半導体集積回路の設計方法 |
JP2004200227A (ja) * | 2002-12-16 | 2004-07-15 | Alps Electric Co Ltd | プリントインダクタ |
US7230316B2 (en) * | 2002-12-27 | 2007-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having transferred integrated circuit |
US20060109071A1 (en) * | 2004-11-19 | 2006-05-25 | Thongsouk Christopher H | Circuit board inductor |
KR100688858B1 (ko) * | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법 |
US7088215B1 (en) * | 2005-02-07 | 2006-08-08 | Northrop Grumman Corporation | Embedded duo-planar printed inductor |
US7591686B2 (en) * | 2006-04-18 | 2009-09-22 | Commscope, Inc. Of North Carolina | Communications connectors with jackwire contacts and printed circuit boards |
TWI345243B (en) * | 2007-08-14 | 2011-07-11 | Ind Tech Res Inst | Inter-helix inductor devices |
JP5268345B2 (ja) * | 2007-12-20 | 2013-08-21 | パナソニック株式会社 | インダクタ |
US7911313B2 (en) * | 2008-07-02 | 2011-03-22 | Intel Corporation | Inductors for integrated circuit packages |
US8928276B2 (en) * | 2008-09-27 | 2015-01-06 | Witricity Corporation | Integrated repeaters for cell phone applications |
US20120212375A1 (en) * | 2011-02-22 | 2012-08-23 | Depree Iv William Frederick | Quantum broadband antenna |
-
2009
- 2009-11-12 CN CN2009103096109A patent/CN102065636A/zh active Pending
-
2010
- 2010-11-12 US US12/944,778 patent/US20110109416A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5055816A (en) * | 1989-06-26 | 1991-10-08 | Motorola, Inc. | Method for fabricating an electronic device |
CN1045002A (zh) * | 1990-03-15 | 1990-08-29 | 中国康复研究中心康复工程研究所 | 一种能产生瞬态强磁场的线圈 |
JP2004235596A (ja) * | 2003-01-30 | 2004-08-19 | Koshin Denki Kk | プリント基板形コイル |
CN1469400A (zh) * | 2003-07-02 | 2004-01-21 | 威盛电子股份有限公司 | 形成于二布线层间的电感 |
CN101002515A (zh) * | 2004-07-28 | 2007-07-18 | 埃托特克德国有限公司 | 通过直接写入技术制造电子电路器件的方法 |
US20070090912A1 (en) * | 2005-10-20 | 2007-04-26 | Sheng-Yuan Lee | Embedded inductor and application thereof |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104658931A (zh) * | 2013-11-20 | 2015-05-27 | 英特尔公司 | 衬底封装核中的编织的电气组件 |
CN104658931B (zh) * | 2013-11-20 | 2019-12-31 | 英特尔公司 | 衬底封装核中的编织的电气组件 |
CN105023732A (zh) * | 2015-06-30 | 2015-11-04 | 安捷利(番禺)电子实业有限公司 | 立体电感线圈及采用印制电路法制备立体电感线圈的方法 |
CN105671786A (zh) * | 2016-03-18 | 2016-06-15 | 苏州椒图电子有限公司 | 一种传感电路的加工方法 |
CN105671786B (zh) * | 2016-03-18 | 2018-11-16 | 苏州椒图电子有限公司 | 一种传感电路的加工方法 |
WO2022134847A1 (zh) * | 2020-12-25 | 2022-06-30 | 京东方科技集团股份有限公司 | 集成有无源器件的基板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20110109416A1 (en) | 2011-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518109 Longhua, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 1, floor 4, Applicant after: Qunkang Technology (Shenzhen) Co., Ltd. Co-applicant after: Chimei Optoelectronics Co., Ltd. Address before: 518109 Longhua, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 1, floor 4, Applicant before: Qunkang Technology (Shenzhen) Co., Ltd. Co-applicant before: Innolux Display Group |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110518 |