JP2023021066A5 - - Google Patents

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Publication number
JP2023021066A5
JP2023021066A5 JP2022120997A JP2022120997A JP2023021066A5 JP 2023021066 A5 JP2023021066 A5 JP 2023021066A5 JP 2022120997 A JP2022120997 A JP 2022120997A JP 2022120997 A JP2022120997 A JP 2022120997A JP 2023021066 A5 JP2023021066 A5 JP 2023021066A5
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
metallization
layers
counterbore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022120997A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023021066A (ja
Filing date
Publication date
Priority claimed from FR2108248A external-priority patent/FR3125941B1/fr
Application filed filed Critical
Publication of JP2023021066A publication Critical patent/JP2023021066A/ja
Publication of JP2023021066A5 publication Critical patent/JP2023021066A5/ja
Pending legal-status Critical Current

Links

JP2022120997A 2021-07-29 2022-07-28 多層印刷回路基板 Pending JP2023021066A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2108248A FR3125941B1 (fr) 2021-07-29 2021-07-29 Carte de circuits imprimes multicouche
FRFR2108248 2021-07-29

Publications (2)

Publication Number Publication Date
JP2023021066A JP2023021066A (ja) 2023-02-09
JP2023021066A5 true JP2023021066A5 (enExample) 2025-01-31

Family

ID=80113291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022120997A Pending JP2023021066A (ja) 2021-07-29 2022-07-28 多層印刷回路基板

Country Status (6)

Country Link
US (1) US12127341B2 (enExample)
EP (1) EP4125309A1 (enExample)
JP (1) JP2023021066A (enExample)
CN (1) CN115696720A (enExample)
FR (1) FR3125941B1 (enExample)
TW (1) TW202318944A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230389183A1 (en) * 2022-05-26 2023-11-30 Steering Solutions Ip Holding Corporation Non-symmetric single circuit board assembly with polytronics dielectric material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7364461B1 (en) * 2007-02-28 2008-04-29 Sv Probe Pte. Ltd. Direct attachment of coaxial cables
JP5787605B2 (ja) * 2011-04-28 2015-09-30 富士通コンポーネント株式会社 多層基板
CN107535044B (zh) * 2014-11-21 2019-12-10 安费诺公司 用于高速、高密度电连接器的配套背板
JP2018037430A (ja) * 2016-08-29 2018-03-08 日本アビオニクス株式会社 多層プリント基板
US10973122B1 (en) * 2020-05-29 2021-04-06 Hewlett Packard Enterprise Development Lp Differential via stack

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