JP4351214B2 - 電子装置及びその製造方法 - Google Patents

電子装置及びその製造方法 Download PDF

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Publication number
JP4351214B2
JP4351214B2 JP2005515288A JP2005515288A JP4351214B2 JP 4351214 B2 JP4351214 B2 JP 4351214B2 JP 2005515288 A JP2005515288 A JP 2005515288A JP 2005515288 A JP2005515288 A JP 2005515288A JP 4351214 B2 JP4351214 B2 JP 4351214B2
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interposer
electronic
electronic device
electronic element
electrode
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Japanese (ja)
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JPWO2005045925A1 (ja
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英次 高池
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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US7847411B2 (en) 2010-12-07
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