KR100784454B1 - 전자 장치 및 그 제조 방법 - Google Patents

전자 장치 및 그 제조 방법 Download PDF

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Publication number
KR100784454B1
KR100784454B1 KR1020067008322A KR20067008322A KR100784454B1 KR 100784454 B1 KR100784454 B1 KR 100784454B1 KR 1020067008322 A KR1020067008322 A KR 1020067008322A KR 20067008322 A KR20067008322 A KR 20067008322A KR 100784454 B1 KR100784454 B1 KR 100784454B1
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interposer
electrode
base material
electronic
electronic device
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KR20060080236A (ko
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에이지 다카이케
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신꼬오덴기 고교 가부시키가이샤
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    • H01L24/82Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2924/181Encapsulation
    • H01L2924/1815Shape
    • H01L2924/1816Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
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KR1020067008322A 2003-11-07 2004-11-01 전자 장치 및 그 제조 방법 Expired - Lifetime KR100784454B1 (ko)

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