JP4297829B2 - 吸着装置 - Google Patents

吸着装置 Download PDF

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Publication number
JP4297829B2
JP4297829B2 JP2004128214A JP2004128214A JP4297829B2 JP 4297829 B2 JP4297829 B2 JP 4297829B2 JP 2004128214 A JP2004128214 A JP 2004128214A JP 2004128214 A JP2004128214 A JP 2004128214A JP 4297829 B2 JP4297829 B2 JP 4297829B2
Authority
JP
Japan
Prior art keywords
suction
plate
tape
groove
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004128214A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005311176A5 (https=
JP2005311176A (ja
Inventor
賢治 小林
正樹 辻本
孝久 吉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004128214A priority Critical patent/JP4297829B2/ja
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to PCT/JP2005/007500 priority patent/WO2005104201A1/ja
Priority to EP05734627A priority patent/EP1742254A1/en
Priority to KR1020067021007A priority patent/KR20070004027A/ko
Priority to US11/578,990 priority patent/US7798195B2/en
Priority to CNB2005800127251A priority patent/CN100437928C/zh
Priority to TW094112783A priority patent/TW200603332A/zh
Publication of JP2005311176A publication Critical patent/JP2005311176A/ja
Publication of JP2005311176A5 publication Critical patent/JP2005311176A5/ja
Application granted granted Critical
Publication of JP4297829B2 publication Critical patent/JP4297829B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7446—Separation by peeling using a peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP2004128214A 2004-04-23 2004-04-23 吸着装置 Expired - Fee Related JP4297829B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004128214A JP4297829B2 (ja) 2004-04-23 2004-04-23 吸着装置
EP05734627A EP1742254A1 (en) 2004-04-23 2005-04-20 Sucking apparatus
KR1020067021007A KR20070004027A (ko) 2004-04-23 2005-04-20 흡착장치
US11/578,990 US7798195B2 (en) 2004-04-23 2005-04-20 Suction unit
PCT/JP2005/007500 WO2005104201A1 (ja) 2004-04-23 2005-04-20 吸着装置
CNB2005800127251A CN100437928C (zh) 2004-04-23 2005-04-20 吸附装置
TW094112783A TW200603332A (en) 2004-04-23 2005-04-21 Sucking equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004128214A JP4297829B2 (ja) 2004-04-23 2004-04-23 吸着装置

Publications (3)

Publication Number Publication Date
JP2005311176A JP2005311176A (ja) 2005-11-04
JP2005311176A5 JP2005311176A5 (https=) 2009-01-22
JP4297829B2 true JP4297829B2 (ja) 2009-07-15

Family

ID=35197263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004128214A Expired - Fee Related JP4297829B2 (ja) 2004-04-23 2004-04-23 吸着装置

Country Status (7)

Country Link
US (1) US7798195B2 (https=)
EP (1) EP1742254A1 (https=)
JP (1) JP4297829B2 (https=)
KR (1) KR20070004027A (https=)
CN (1) CN100437928C (https=)
TW (1) TW200603332A (https=)
WO (1) WO2005104201A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4688728B2 (ja) * 2006-05-19 2011-05-25 株式会社東京精密 表面保護フィルム剥離方法および表面保護フィルム剥離装置
DE102007033242A1 (de) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser
JP2009043771A (ja) * 2007-08-06 2009-02-26 Disco Abrasive Syst Ltd チャックテーブル機構および被加工物の保持方法
JP5147425B2 (ja) * 2007-08-14 2013-02-20 株式会社東京精密 ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
WO2009022495A1 (ja) * 2007-08-14 2009-02-19 Tokyo Seimitsu Co., Ltd. ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
JP5203827B2 (ja) * 2008-07-14 2013-06-05 リンテック株式会社 保持装置
US20100059183A1 (en) * 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Wafer taping and detaping machine
JP2010067782A (ja) * 2008-09-10 2010-03-25 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離装置
JP5159649B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5159650B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5381821B2 (ja) * 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
US8574398B2 (en) * 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
WO2011155443A1 (ja) * 2010-06-07 2011-12-15 日本電気硝子株式会社 板状部材の移送装置及び吸着パッド
JP2013191746A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 半導体装置の製造方法、半導体製造装置
KR101989484B1 (ko) * 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
JP6076856B2 (ja) * 2013-08-09 2017-02-08 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP5996347B2 (ja) * 2012-09-24 2016-09-21 リンテック株式会社 シート剥離装置及び剥離方法、並びに、シート貼替装置及び貼替方法
US20140238617A1 (en) * 2013-02-28 2014-08-28 General Electric Company System and method for removal of a layer
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101969092B1 (ko) * 2013-04-10 2019-04-16 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
CN103317824A (zh) * 2013-06-19 2013-09-25 深圳市华星光电技术有限公司 离型纸剥离装置
JP6104075B2 (ja) * 2013-06-28 2017-03-29 日本特殊陶業株式会社 真空吸着装置およびその製造方法
JP6340249B2 (ja) * 2014-05-28 2018-06-06 株式会社荏原製作所 テープ貼り付け装置およびテープ貼り付け方法
JP2016147342A (ja) * 2015-02-12 2016-08-18 株式会社ディスコ 加工装置のチャックテーブル
JP6704794B2 (ja) * 2016-05-30 2020-06-03 株式会社ディスコ 保護膜形成装置
JP2017224671A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 剥離装置
KR102898051B1 (ko) * 2020-03-13 2025-12-10 삼성전자주식회사 펠리클 전사 장치 및 펠리클 전사 방법
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof
JP7766467B2 (ja) * 2021-10-26 2025-11-10 株式会社ディスコ 剥離治具、剥離治具を用いたシート剥離方法及びシート剥離装置
CN118824894A (zh) * 2023-04-19 2024-10-22 长江存储科技有限责任公司 撕胶装置和撕胶方法

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JPS5930631A (ja) 1982-08-13 1984-02-18 Hitachi Ltd 吸着保持装置
US5180000A (en) * 1989-05-08 1993-01-19 Balzers Aktiengesellschaft Workpiece carrier with suction slot for a disk-shaped workpiece
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2001319906A (ja) * 2000-05-11 2001-11-16 Takatori Corp ウエハ表面保護テープの剥離装置
JP4739584B2 (ja) * 2001-07-05 2011-08-03 リンテック株式会社 剥離装置
JP4026680B2 (ja) * 2001-12-07 2007-12-26 株式会社ディスコ 板状物支持部材及びその使用方法
JP2003209082A (ja) * 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置
JP2004128115A (ja) * 2002-10-01 2004-04-22 Hitachi Chem Co Ltd 減圧固定用フィルム、ウエハ保護フィルム、ダイシングフィルム及び半導体装置の製造方法
JP2005175384A (ja) * 2003-12-15 2005-06-30 Nitto Denko Corp 保護テープの貼付方法及び剥離方法

Also Published As

Publication number Publication date
KR20070004027A (ko) 2007-01-05
TWI355709B (https=) 2012-01-01
US20070169895A1 (en) 2007-07-26
TW200603332A (en) 2006-01-16
WO2005104201A1 (ja) 2005-11-03
EP1742254A8 (en) 2007-02-21
US7798195B2 (en) 2010-09-21
CN1947226A (zh) 2007-04-11
JP2005311176A (ja) 2005-11-04
CN100437928C (zh) 2008-11-26
EP1742254A1 (en) 2007-01-10

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