JP2005311176A - 吸着装置 - Google Patents
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- JP2005311176A JP2005311176A JP2004128214A JP2004128214A JP2005311176A JP 2005311176 A JP2005311176 A JP 2005311176A JP 2004128214 A JP2004128214 A JP 2004128214A JP 2004128214 A JP2004128214 A JP 2004128214A JP 2005311176 A JP2005311176 A JP 2005311176A
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
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- Microelectronics & Electronic Packaging (AREA)
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- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
【解決手段】 ウエハWは、裏面側からダイシングテープTを介してリングフレームRに支持されているとともに、表面側に保護テープHが貼付されている。吸着装置12は、吸着面15を上面に備えたテーブル16を備えている。吸着面15は、所定の吸着を行うことによりダイシングテープTを吸着してウエハWを保持する。吸着面15の外周に沿う少なくとも一部領域には、溝24が形成され、吸着面15により吸気を行うことにより、溝24内が負圧となってダイシングシテープTを陥没させる。
【選択図】 図6
Description
このような装置の問題点として、図12に示されるように、剥離用テープPを保護テープHの外周縁に貼り付けるときに、ローラ54が弾性変形して剥離用テープP及びダイシングテープTが接着し、この状態で保護テープHの剥離を始めるとウエハWを損傷させてしまう。
なお、リングフレームに対してウエハを上昇させる昇降装置を用いることにより、ダイシングテープを傾斜姿勢に保って剥離用テープと保護テープとの接着を防止する構造も知られているが、これによっても、昇降装置の複雑化や、ウエハの上昇工程に起因する剥離処理の長時間化を招来するという不都合がある。
本発明は、このような不都合に着目して案出されたものであり、その目的は、装置の簡略化を図ることができ、且つ、板状部材に貼付された保護テープの剥離するときに、当該剥離を迅速且つスムースに行うことができる吸着装置を提供することにある。
所定の吸気を行うことにより前記粘着シートを吸着する吸着面を備えたテーブルを含み、
前記板状部材の外周に沿う少なくとも一部領域に溝が形成される、という構成を採っている。
前記吸着面は、板状部材の平面形状に対応する平面形状を備え、吸着面の外周に沿うテーブル本体に前記溝が形成される、という構成も好ましくは採用される。
前記溝の延出長さは、剥離用テープの短寸幅より大きく設定される、という構成も採用することができる。
所定の吸気を行うことにより前記ダイシングテープを吸着してウエハを保持する吸着面を備えたテーブルを含み、
前記ウエハの外周に沿う少なくとも一部領域に溝が形成される、という構成も採用される。
図1には、第1実施形態に係る吸着装置が適用された剥離装置の概略構成図が示されている。この図において、剥離装置10は、図1中左右方向に延びるスライダ11を介して移動可能に支持された吸着装置12と、この吸着装置12の上方に設けられた剥離手段13とを備えて構成されている。
次に、本発明の第2実施形態について説明する。なお、以下の説明において、前記第1実施形態と同一若しくは同等の構成部分については必要に応じて同一符号を用いるものとし、説明を省略若しくは簡略にする。
第2実施形態における吸着部材20には、吸着面15の外周と略同心円上に位置する三つの隔壁部45が設けられ、これら隔壁部45により吸着部材20が平面視ドーナツ型をなす三つの円環体46と、最も内側の隔壁部45の内方に位置する円盤体47とに仕切られている。各隔壁部45の平面形状は、径寸法の異なる各種のウエハWの平面形状と略同一となるように設定されている。ここで、各円環体46には、隔壁部45の外周に沿って前記溝44が形成され、これら溝44及び前述の溝24は、吸着面15の面内中央部から外周を結ぶ方向すなわち吸着面15の径方向に沿って所定間隔を隔てて位置することとなる。各円環体46に形成された溝44の延出長さ及び幅は、前記溝24と略同一寸法に設定されている。
なお、図11に示されるように、ウエハWと重なって位置する溝44の内部には、吸着面15と略面一となる充填部材Fが配置される。当該充填部材Fは、溝44に対して着脱自在に設けられるとともに、吸着面15上でウエハWを保持した際に溝44の形成縁によってウエハWの図11中下面が傷付くことを防止するようになっている。
この状態において、ウエハWの外周が最も外側の隔壁部45に略一致するように図10に示される状態のウエハWをテーブル16上に配置する。これにより、吸気を行う円環体46及び円盤体47によってダイシングテープTを吸着してウエハWが保持される。このとき、第1実施形態の溝24と同様に、最も外側の円環体46に形成されてウエハWの外周に沿う溝44内の空気が吸引され、当該溝44内にダイシングテープTが入り込むように陥没することとなる。
すなわち、本発明は、主に特定の実施の形態に関して特に図示し、且つ、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上に述べた実施の形態に対し、形状、数量、材質、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。
また、前記溝24の形成位置は、図示構成例に限られず、例えば、平面視で吸着面15の外周に沿う略全領域に環状に形成したり、吸着面15の径方向に沿う剥離用テープPの貼り始め部分と貼り終わり部分の両側にそれぞれ形成する等、テーブル本体16の支持面23の複数箇所に形成してもよい。
更に、前記ダイシングテープTをリングフレームRに貼付した場合を説明したが、ダイシングテープTがウエハWの外周からはみ出る平面形状を備えている限りにおいて、リングフレームRを省略してもよい。
また、前記第1実施形態では、吸着部材20と溝24との間に若干の隙間を介在させたが、当該隙間を設けないように溝24を形成してもよい。
更に、前記第2実施形態における、溝44、隔壁部45及び円環体46の形成数は、必要に応じて適宜増減してもよい。
また、吸着装置12を移動させて保護テープHの剥離を行った場合を説明したが、剥離用テープPに掛け回される押さえ付けローラ35を保護テープH上で移動させる構成に代替してもよい。要するに、剥離用テープPの繰り出しに伴って、吸着装置12と押さえ付けローラ35とが相対移動可能に設けられていればよい。
15 吸着面
16 テーブル
19 テーブル本体
20 吸着部材
24 溝
44 溝
H 保護テープ
P 剥離用テープ
R リングフレーム
T ダイシングテープ(粘着テープ)
W ウエハ(板状部材)
Claims (5)
- 板状部材の一方の面に貼付され、当該板状部材の外周からはみ出る平面形状を備えた粘着シートを吸着することで板状部材を保持する吸着装置において、
所定の吸気を行うことにより前記粘着シートを吸着する吸着面を備えたテーブルを含み、
前記板状部材の外周に沿う少なくとも一部領域に溝が形成されていることを特徴とする吸着装置。 - 前記テーブルは、吸着面と略同一面上に位置する領域を有するテーブル本体と、このテーブル本体の領域内に設けられて前記吸着面を形成する吸着部材とを備え、
前記吸着面は、板状部材の平面形状に対応する平面形状を備え、吸着面の外周に沿うテーブル本体に前記溝が形成されていることを特徴とする請求項1記載の吸着装置。 - 前記溝は、吸着面の面内中央部から外周を結ぶ方向に沿って所定間隔を隔てて複数形成されていることを特徴とする請求項1記載の吸着装置。
- 前記板状部材の他方の面には、帯状の剥離用テープを介して剥離可能な保護テープが貼付され、
前記溝の延出長さは、剥離用テープの短寸幅より大きく設定されていることを特徴とする請求項1,2又は3記載の吸着装置。 - ダイシングテープを介してリングフレームに支持されたウエハの上面に貼付された保護テープを剥離する装置に用いられる吸着装置において、
所定の吸気を行うことにより前記ダイシングテープを吸着してウエハを保持する吸着面を備えたテーブルを含み、
前記ウエハの外周に沿う少なくとも一部領域に溝が形成されていることを特徴とする吸着装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004128214A JP4297829B2 (ja) | 2004-04-23 | 2004-04-23 | 吸着装置 |
US11/578,990 US7798195B2 (en) | 2004-04-23 | 2005-04-20 | Suction unit |
PCT/JP2005/007500 WO2005104201A1 (ja) | 2004-04-23 | 2005-04-20 | 吸着装置 |
EP05734627A EP1742254A1 (en) | 2004-04-23 | 2005-04-20 | Sucking apparatus |
KR1020067021007A KR20070004027A (ko) | 2004-04-23 | 2005-04-20 | 흡착장치 |
CNB2005800127251A CN100437928C (zh) | 2004-04-23 | 2005-04-20 | 吸附装置 |
TW094112783A TW200603332A (en) | 2004-04-23 | 2005-04-21 | Sucking equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004128214A JP4297829B2 (ja) | 2004-04-23 | 2004-04-23 | 吸着装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005311176A true JP2005311176A (ja) | 2005-11-04 |
JP2005311176A5 JP2005311176A5 (ja) | 2009-01-22 |
JP4297829B2 JP4297829B2 (ja) | 2009-07-15 |
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JP2004128214A Expired - Fee Related JP4297829B2 (ja) | 2004-04-23 | 2004-04-23 | 吸着装置 |
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US (1) | US7798195B2 (ja) |
EP (1) | EP1742254A1 (ja) |
JP (1) | JP4297829B2 (ja) |
KR (1) | KR20070004027A (ja) |
CN (1) | CN100437928C (ja) |
TW (1) | TW200603332A (ja) |
WO (1) | WO2005104201A1 (ja) |
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JP3983053B2 (ja) * | 2002-01-17 | 2007-09-26 | 日東電工株式会社 | 保護テープの切断方法およびそれを用いた保護テープ貼付装置 |
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JP2005175384A (ja) * | 2003-12-15 | 2005-06-30 | Nitto Denko Corp | 保護テープの貼付方法及び剥離方法 |
-
2004
- 2004-04-23 JP JP2004128214A patent/JP4297829B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-20 US US11/578,990 patent/US7798195B2/en active Active
- 2005-04-20 CN CNB2005800127251A patent/CN100437928C/zh not_active Expired - Fee Related
- 2005-04-20 KR KR1020067021007A patent/KR20070004027A/ko not_active Application Discontinuation
- 2005-04-20 EP EP05734627A patent/EP1742254A1/en not_active Withdrawn
- 2005-04-20 WO PCT/JP2005/007500 patent/WO2005104201A1/ja not_active Application Discontinuation
- 2005-04-21 TW TW094112783A patent/TW200603332A/zh unknown
Cited By (14)
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JP2007180503A (ja) * | 2005-11-29 | 2007-07-12 | Tokyo Seimitsu Co Ltd | 剥離テープ貼付方法および剥離テープ貼付装置 |
JP2009045926A (ja) * | 2007-07-12 | 2009-03-05 | Jenoptik Automatisierungstechnik Gmbh | レーザーによって脆い物質で作られた平行平面板を複数の個々のプレートに分割する方法及び装置 |
JP2009043771A (ja) * | 2007-08-06 | 2009-02-26 | Disco Abrasive Syst Ltd | チャックテーブル機構および被加工物の保持方法 |
TWI424485B (zh) * | 2007-08-14 | 2014-01-21 | Tokyo Seimitsu Co Ltd | Wafer table, surface protective film peeling device and surface protective film peeling method |
US8182632B2 (en) | 2007-08-14 | 2012-05-22 | Tokyo Seimitsu Co., Ltd. | Wafer table, surface protective film peeling apparatus and surface protective film peeling method |
WO2009022495A1 (ja) * | 2007-08-14 | 2009-02-19 | Tokyo Seimitsu Co., Ltd. | ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法 |
JP2010021472A (ja) * | 2008-07-14 | 2010-01-28 | Lintec Corp | 保持装置及び保持方法並びに剥離装置用テーブル |
JP2010067782A (ja) * | 2008-09-10 | 2010-03-25 | Tokyo Seimitsu Co Ltd | 表面保護フィルム剥離装置 |
JP2010165932A (ja) * | 2009-01-16 | 2010-07-29 | Lintec Corp | シート貼付装置および貼付方法 |
JP2010165933A (ja) * | 2009-01-16 | 2010-07-29 | Lintec Corp | シート貼付装置および貼付方法 |
JP2014063945A (ja) * | 2012-09-24 | 2014-04-10 | Lintec Corp | シート剥離装置及び剥離方法、並びに、シート貼替装置及び貼替方法 |
JP2015012202A (ja) * | 2013-06-28 | 2015-01-19 | 太平洋セメント株式会社 | 真空吸着装置およびその製造方法 |
JP2015035561A (ja) * | 2013-08-09 | 2015-02-19 | 東京エレクトロン株式会社 | 剥離装置、剥離システムおよび剥離方法 |
JP2017216291A (ja) * | 2016-05-30 | 2017-12-07 | 株式会社ディスコ | 保護膜形成装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070004027A (ko) | 2007-01-05 |
TWI355709B (ja) | 2012-01-01 |
TW200603332A (en) | 2006-01-16 |
US7798195B2 (en) | 2010-09-21 |
EP1742254A8 (en) | 2007-02-21 |
CN100437928C (zh) | 2008-11-26 |
CN1947226A (zh) | 2007-04-11 |
US20070169895A1 (en) | 2007-07-26 |
EP1742254A1 (en) | 2007-01-10 |
JP4297829B2 (ja) | 2009-07-15 |
WO2005104201A1 (ja) | 2005-11-03 |
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