CN100437928C - 吸附装置 - Google Patents

吸附装置 Download PDF

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Publication number
CN100437928C
CN100437928C CNB2005800127251A CN200580012725A CN100437928C CN 100437928 C CN100437928 C CN 100437928C CN B2005800127251 A CNB2005800127251 A CN B2005800127251A CN 200580012725 A CN200580012725 A CN 200580012725A CN 100437928 C CN100437928 C CN 100437928C
Authority
CN
China
Prior art keywords
tape
adsorption
wafer
suction
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800127251A
Other languages
English (en)
Chinese (zh)
Other versions
CN1947226A (zh
Inventor
小林贤治
辻本正树
吉冈孝久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN1947226A publication Critical patent/CN1947226A/zh
Application granted granted Critical
Publication of CN100437928C publication Critical patent/CN100437928C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7446—Separation by peeling using a peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
CNB2005800127251A 2004-04-23 2005-04-20 吸附装置 Expired - Fee Related CN100437928C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004128214A JP4297829B2 (ja) 2004-04-23 2004-04-23 吸着装置
JP128214/2004 2004-04-23

Publications (2)

Publication Number Publication Date
CN1947226A CN1947226A (zh) 2007-04-11
CN100437928C true CN100437928C (zh) 2008-11-26

Family

ID=35197263

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800127251A Expired - Fee Related CN100437928C (zh) 2004-04-23 2005-04-20 吸附装置

Country Status (7)

Country Link
US (1) US7798195B2 (https=)
EP (1) EP1742254A1 (https=)
JP (1) JP4297829B2 (https=)
KR (1) KR20070004027A (https=)
CN (1) CN100437928C (https=)
TW (1) TW200603332A (https=)
WO (1) WO2005104201A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4688728B2 (ja) * 2006-05-19 2011-05-25 株式会社東京精密 表面保護フィルム剥離方法および表面保護フィルム剥離装置
DE102007033242A1 (de) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser
JP2009043771A (ja) * 2007-08-06 2009-02-26 Disco Abrasive Syst Ltd チャックテーブル機構および被加工物の保持方法
JP5147425B2 (ja) * 2007-08-14 2013-02-20 株式会社東京精密 ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
WO2009022495A1 (ja) * 2007-08-14 2009-02-19 Tokyo Seimitsu Co., Ltd. ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
JP5203827B2 (ja) * 2008-07-14 2013-06-05 リンテック株式会社 保持装置
US20100059183A1 (en) * 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Wafer taping and detaping machine
JP2010067782A (ja) * 2008-09-10 2010-03-25 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離装置
JP5159649B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5159650B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5381821B2 (ja) * 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
US8574398B2 (en) * 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
WO2011155443A1 (ja) * 2010-06-07 2011-12-15 日本電気硝子株式会社 板状部材の移送装置及び吸着パッド
JP2013191746A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 半導体装置の製造方法、半導体製造装置
KR101989484B1 (ko) * 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
JP6076856B2 (ja) * 2013-08-09 2017-02-08 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP5996347B2 (ja) * 2012-09-24 2016-09-21 リンテック株式会社 シート剥離装置及び剥離方法、並びに、シート貼替装置及び貼替方法
US20140238617A1 (en) * 2013-02-28 2014-08-28 General Electric Company System and method for removal of a layer
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101969092B1 (ko) * 2013-04-10 2019-04-16 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
CN103317824A (zh) * 2013-06-19 2013-09-25 深圳市华星光电技术有限公司 离型纸剥离装置
JP6104075B2 (ja) * 2013-06-28 2017-03-29 日本特殊陶業株式会社 真空吸着装置およびその製造方法
JP6340249B2 (ja) * 2014-05-28 2018-06-06 株式会社荏原製作所 テープ貼り付け装置およびテープ貼り付け方法
JP2016147342A (ja) * 2015-02-12 2016-08-18 株式会社ディスコ 加工装置のチャックテーブル
JP6704794B2 (ja) * 2016-05-30 2020-06-03 株式会社ディスコ 保護膜形成装置
JP2017224671A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 剥離装置
KR102898051B1 (ko) * 2020-03-13 2025-12-10 삼성전자주식회사 펠리클 전사 장치 및 펠리클 전사 방법
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof
JP7766467B2 (ja) * 2021-10-26 2025-11-10 株式会社ディスコ 剥離治具、剥離治具を用いたシート剥離方法及びシート剥離装置
CN118824894A (zh) * 2023-04-19 2024-10-22 长江存储科技有限责任公司 撕胶装置和撕胶方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5891298A (en) * 1995-08-31 1999-04-06 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2003022986A (ja) * 2001-07-05 2003-01-24 Lintec Corp 剥離装置
JP2003173996A (ja) * 2001-12-07 2003-06-20 Disco Abrasive Syst Ltd 板状物支持部材及びその使用方法
CN1433055A (zh) * 2002-01-15 2003-07-30 日东电工株式会社 保护带条的粘贴方法与装置以及保护带条的分离方法
JP2004128115A (ja) * 2002-10-01 2004-04-22 Hitachi Chem Co Ltd 減圧固定用フィルム、ウエハ保護フィルム、ダイシングフィルム及び半導体装置の製造方法

Family Cites Families (5)

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JPS5930631A (ja) 1982-08-13 1984-02-18 Hitachi Ltd 吸着保持装置
US5180000A (en) * 1989-05-08 1993-01-19 Balzers Aktiengesellschaft Workpiece carrier with suction slot for a disk-shaped workpiece
JP2001319906A (ja) * 2000-05-11 2001-11-16 Takatori Corp ウエハ表面保護テープの剥離装置
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置
JP2005175384A (ja) * 2003-12-15 2005-06-30 Nitto Denko Corp 保護テープの貼付方法及び剥離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5891298A (en) * 1995-08-31 1999-04-06 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2003022986A (ja) * 2001-07-05 2003-01-24 Lintec Corp 剥離装置
JP2003173996A (ja) * 2001-12-07 2003-06-20 Disco Abrasive Syst Ltd 板状物支持部材及びその使用方法
CN1433055A (zh) * 2002-01-15 2003-07-30 日东电工株式会社 保护带条的粘贴方法与装置以及保护带条的分离方法
JP2004128115A (ja) * 2002-10-01 2004-04-22 Hitachi Chem Co Ltd 減圧固定用フィルム、ウエハ保護フィルム、ダイシングフィルム及び半導体装置の製造方法

Also Published As

Publication number Publication date
KR20070004027A (ko) 2007-01-05
TWI355709B (https=) 2012-01-01
US20070169895A1 (en) 2007-07-26
JP4297829B2 (ja) 2009-07-15
TW200603332A (en) 2006-01-16
WO2005104201A1 (ja) 2005-11-03
EP1742254A8 (en) 2007-02-21
US7798195B2 (en) 2010-09-21
CN1947226A (zh) 2007-04-11
JP2005311176A (ja) 2005-11-04
EP1742254A1 (en) 2007-01-10

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Granted publication date: 20081126