JP4086812B2 - 積層コンデンサ - Google Patents
積層コンデンサ Download PDFInfo
- Publication number
- JP4086812B2 JP4086812B2 JP2004161825A JP2004161825A JP4086812B2 JP 4086812 B2 JP4086812 B2 JP 4086812B2 JP 2004161825 A JP2004161825 A JP 2004161825A JP 2004161825 A JP2004161825 A JP 2004161825A JP 4086812 B2 JP4086812 B2 JP 4086812B2
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- JP
- Japan
- Prior art keywords
- width
- multilayer capacitor
- electrodes
- electrode
- internal electrode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
Description
また、内部電極110A〜113Aの幅W1は、100μmよりも大きく構成されているので、積層コンデンサ101の製造時において内部電極110A〜113Aを誘電体層102B〜102Eに印刷する時の、印刷精度の低下や、内部電極110A〜113Aの断線を防止することができる。また、引出し電極110B〜113Bの幅W2は、内部電極110A〜113Aの幅W1よりも狭く構成されているので、互いに近接する内部電極110A〜113A間の距離を十分に確保することができる。従って、積層コンデンサ101の実装時におけるはんだブリッジを防止することができる。
2、102 誘電体素体
2A〜2I、102A〜102E 誘電体層
10A〜17A、110A〜113A 内部電極
10B〜17B、110B〜113B 引出し電極
10A1〜17A1 平行部
L 長さ
W1 幅
Claims (3)
- シート状の誘電体層を積層させた誘電体素体と、
隣り合う該誘電体層の間、かつ該誘電体素体内に配置された細長状の内部電極と、
該内部電極の一端に1個のみ設けられ、該誘電体素体の外面まで引出された引出し電極と、
1枚の該内部電極のみと該引出し電極を介して接続される外部電極と、を備える積層コンデンサにおいて、
それぞれの該内部電極は、それぞれの該一端から同一方向に巻かれた形状をなし、かつ互いに平行に延びる少なくとも一組の平行部を有し、積層方向で隣り合う該内部電極は、略同形状で、極性が逆であり、
該引出し電極は、該誘電体素体に対して積層順に略螺旋の仮想的な経路上に設けられていることを特徴とする積層コンデンサ。 - 該引出し電極の延びる方向に直交する幅は、該内部電極の幅より狭いことを特徴とする請求項1に記載の積層コンデンサ。
- 該内部電極は、該一端から他端までの長さLと該長さの方向に直交する幅Wとを備え、
該長さLは、該幅Wの中央における長さであり、該長さLと該幅Wとは、8≦L/W≦33の関係を有し、
該内部電極の幅Wは、W≧100μmであることを特徴とする請求項1に記載の積層コンデンサ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004161825A JP4086812B2 (ja) | 2004-05-31 | 2004-05-31 | 積層コンデンサ |
US11/113,193 US6970342B1 (en) | 2004-05-31 | 2005-04-25 | Multilayer capacitor |
TW094114735A TWI255475B (en) | 2004-05-31 | 2005-05-06 | Multilayer capacitor |
CNB2005100729277A CN100433211C (zh) | 2004-05-31 | 2005-05-20 | 积层电容器 |
KR1020050045154A KR100702639B1 (ko) | 2004-05-31 | 2005-05-27 | 적층 캐패시터 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004161825A JP4086812B2 (ja) | 2004-05-31 | 2004-05-31 | 積層コンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005347314A JP2005347314A (ja) | 2005-12-15 |
JP4086812B2 true JP4086812B2 (ja) | 2008-05-14 |
Family
ID=35405246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004161825A Active JP4086812B2 (ja) | 2004-05-31 | 2004-05-31 | 積層コンデンサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US6970342B1 (ja) |
JP (1) | JP4086812B2 (ja) |
KR (1) | KR100702639B1 (ja) |
CN (1) | CN100433211C (ja) |
TW (1) | TWI255475B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101210183B (zh) * | 2006-12-27 | 2011-01-26 | 比亚迪股份有限公司 | 一种提纯液晶材料的方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006253371A (ja) * | 2005-03-10 | 2006-09-21 | Tdk Corp | 多端子型積層コンデンサ及びその製造方法 |
US7697262B2 (en) | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7414857B2 (en) * | 2005-10-31 | 2008-08-19 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7283348B2 (en) | 2005-12-22 | 2007-10-16 | Tdk Corporation | Multilayer capacitor |
JP4213744B2 (ja) | 2005-12-22 | 2009-01-21 | Tdk株式会社 | 積層コンデンサ及びその実装構造 |
US7292429B2 (en) | 2006-01-18 | 2007-11-06 | Kemet Electronics Corporation | Low inductance capacitor |
US7145429B1 (en) * | 2006-01-26 | 2006-12-05 | Tdk Corporation | Multilayer capacitor |
JP4293560B2 (ja) | 2006-07-12 | 2009-07-08 | Tdk株式会社 | 積層コンデンサアレイ |
JP4896642B2 (ja) * | 2006-09-12 | 2012-03-14 | Tdk株式会社 | 積層コンデンサ及び電子機器 |
US20080165468A1 (en) * | 2007-01-05 | 2008-07-10 | Avx Corporation | Very low profile multilayer components |
KR100946007B1 (ko) | 2007-12-07 | 2010-03-09 | 삼성전기주식회사 | 적층형 칩 커패시터 및 회로 기판 장치 |
US20080186650A1 (en) * | 2007-02-03 | 2008-08-07 | Benjamin Beker | Decoupling Capacitor with Controlled Equivalent Series Resistance |
US8238116B2 (en) | 2007-04-13 | 2012-08-07 | Avx Corporation | Land grid feedthrough low ESL technology |
JP4645637B2 (ja) | 2007-11-15 | 2011-03-09 | Tdk株式会社 | 積層コンデンサ |
JP4450084B2 (ja) * | 2008-03-14 | 2010-04-14 | Tdk株式会社 | 積層コンデンサ及び積層コンデンサの実装構造 |
US8446705B2 (en) * | 2008-08-18 | 2013-05-21 | Avx Corporation | Ultra broadband capacitor |
US20100188799A1 (en) * | 2009-01-28 | 2010-07-29 | Avx Corporation | Controlled esr low inductance capacitor |
US20100237462A1 (en) * | 2009-03-18 | 2010-09-23 | Benjamin Beker | Package Level Tuning Techniques for Propagation Channels of High-Speed Signals |
KR101053410B1 (ko) * | 2009-07-17 | 2011-08-01 | 삼성전기주식회사 | 적층형 칩 커패시터 |
KR101069989B1 (ko) * | 2009-09-10 | 2011-10-04 | 삼성전기주식회사 | 적층형 칩 커패시터 및 회로 기판 장치 |
KR101079408B1 (ko) * | 2009-12-24 | 2011-11-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
WO2011121994A1 (ja) | 2010-03-30 | 2011-10-06 | 株式会社村田製作所 | 電源装置 |
KR101504017B1 (ko) | 2013-07-11 | 2015-03-18 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR101548814B1 (ko) * | 2013-11-08 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR20150121479A (ko) * | 2014-04-21 | 2015-10-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20160053380A (ko) * | 2014-11-04 | 2016-05-13 | 삼성전기주식회사 | 적층형 인덕터 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838320A (en) * | 1974-01-04 | 1974-09-24 | American Tech Ceramics | Multiple layer capacitors |
US3896354A (en) * | 1974-07-02 | 1975-07-22 | Sprague Electric Co | Monolithic ceramic capacitor |
JP3136871B2 (ja) * | 1993-10-08 | 2001-02-19 | 株式会社村田製作所 | 容量内蔵型積層セラミック電子部品及びその製造方法 |
JP3340625B2 (ja) * | 1996-07-04 | 2002-11-05 | 株式会社村田製作所 | 表面実装型セラミック電子部品 |
JPH10275736A (ja) * | 1997-03-28 | 1998-10-13 | Tdk Corp | 積層基板の切断位置の良否判定方法と積層セラミック電子部品 |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
JP2991175B2 (ja) * | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
EP1022751B1 (en) * | 1998-12-28 | 2010-03-03 | Murata Manufacturing Co., Ltd. | Monolithic ceramic electronic component |
JP3548821B2 (ja) * | 1999-05-10 | 2004-07-28 | 株式会社村田製作所 | 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路 |
JP3930245B2 (ja) * | 2000-11-14 | 2007-06-13 | Tdk株式会社 | 積層型電子部品 |
JP3923723B2 (ja) | 2000-11-22 | 2007-06-06 | Tdk株式会社 | 積層型電子部品 |
JP3788329B2 (ja) * | 2001-11-29 | 2006-06-21 | 株式会社村田製作所 | コンデンサアレイ |
TWI229878B (en) * | 2003-03-12 | 2005-03-21 | Tdk Corp | Multilayer capacitor |
-
2004
- 2004-05-31 JP JP2004161825A patent/JP4086812B2/ja active Active
-
2005
- 2005-04-25 US US11/113,193 patent/US6970342B1/en active Active
- 2005-05-06 TW TW094114735A patent/TWI255475B/zh active
- 2005-05-20 CN CNB2005100729277A patent/CN100433211C/zh active Active
- 2005-05-27 KR KR1020050045154A patent/KR100702639B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101210183B (zh) * | 2006-12-27 | 2011-01-26 | 比亚迪股份有限公司 | 一种提纯液晶材料的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20060046236A (ko) | 2006-05-17 |
TW200540889A (en) | 2005-12-16 |
US20050264977A1 (en) | 2005-12-01 |
CN100433211C (zh) | 2008-11-12 |
CN1705047A (zh) | 2005-12-07 |
KR100702639B1 (ko) | 2007-04-02 |
TWI255475B (en) | 2006-05-21 |
US6970342B1 (en) | 2005-11-29 |
JP2005347314A (ja) | 2005-12-15 |
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