KR100707414B1 - 적층 커패시터 - Google Patents
적층 커패시터 Download PDFInfo
- Publication number
- KR100707414B1 KR100707414B1 KR1020050057080A KR20050057080A KR100707414B1 KR 100707414 B1 KR100707414 B1 KR 100707414B1 KR 1020050057080 A KR1020050057080 A KR 1020050057080A KR 20050057080 A KR20050057080 A KR 20050057080A KR 100707414 B1 KR100707414 B1 KR 100707414B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrodes
- lead
- stacking direction
- dielectric
- electrode
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 47
- 238000000605 extraction Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 230000008859 change Effects 0.000 description 16
- 230000004907 flux Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims (4)
- 유전체 부재,복수개의 내부 전극,복수개의 인출 전극, 및복수개의 외부 전극을 포함하고,상기 유전체 부재는, 소정의 표면적을 각각 형성하는 복수개의 적층된 시트형 유전체 층을 포함하며,각각의 상기 내부 전극은, 각각의 상기 유전체 층과 교호로 적층되며, 각각의 상기 내부 전극은 상기 소정의 표면적 내에 수용되는 도체를 포함하고, 각각의 상기 내부 전극의 한 측변은 상기 시트형 유전체 층의 한 측면에 근접하여 위치되고,상기 복수개의 유전체 층 및 상기 복수개의 내부 전극에 의해 적층 방향이 정의되고,각각의 상기 인출 전극은, 서로 접촉되지 않으면서 각각의 상기 내부 전극의 상기 측변으로부터 각각의 상기 유전체 층의 상기 측면으로 연장되며, 상기 적층 방향과 직교하는 방향으로 상기 한 측면에서 폭 W을 갖고, 인접하는 인출 전극의 대향하는 측면 사이에 상기 적층 방향과 직교하는 방향으로 거리 G가 정해지며,상기 복수개의 인출 전극은 1.2 ≤ W/G ≤ 4.0의 기하학적 관계를 갖는적층 커패시터.
- 제1항에 있어서,상기 한 측면에 배치되어 적층 방향으로 연장되는 복수개의 외부 전극을 더 포함하고, 상기 각각의 외부 전극은 상기 각각의 인출 전극과 전기적으로 접촉되는 것을 특징으로 하는 적층 커패시터.
- 제2항에 있어서,상기 각각의 외부 전극은 상기 인출 전극의 폭과 실질적으로 동일한 폭을 갖는 것을 특징으로 하는 적층 커패시터.
- 제2항에 있어서,상기 유전체 부재, 상기 복수개의 내부 전극 및 상기 복수개의 외부 전극이 결합되어 상기 한 측면과 일치되는 길이방향 측면, 상기 길이방향 및 상기 적층 방향과 실질적으로 직각을 이루는 방향으로 연장되는 제2 측면, 및 상기 적층 방향으로 연장되는 제3 측면을 갖는 실질적으로 직사각형 평행 6면체 형상을 제공하며, 상기 길이방향 측면의 길이는 1.8 mm 내지 2.5 mm, 상기 제2 측면의 길이는 1.1 mm 내지 1.3 mm, 상기 제3 측면의 길이는 0.5 mm 내지 1.3 mm인 것을 특징으로 하는 적층 커패시터.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004192041A JP2006013380A (ja) | 2004-06-29 | 2004-06-29 | 積層コンデンサ |
JPJP-P-2004-00192041 | 2004-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060048706A KR20060048706A (ko) | 2006-05-18 |
KR100707414B1 true KR100707414B1 (ko) | 2007-04-16 |
Family
ID=35505425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050057080A KR100707414B1 (ko) | 2004-06-29 | 2005-06-29 | 적층 커패시터 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7061747B2 (ko) |
JP (1) | JP2006013380A (ko) |
KR (1) | KR100707414B1 (ko) |
CN (1) | CN100576383C (ko) |
TW (1) | TWI260656B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7414857B2 (en) * | 2005-10-31 | 2008-08-19 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
JP4765604B2 (ja) * | 2005-12-15 | 2011-09-07 | Tdk株式会社 | 電気化学デバイス |
JP4433204B2 (ja) * | 2006-03-10 | 2010-03-17 | Tdk株式会社 | 積層セラミックコンデンサ |
US8238116B2 (en) | 2007-04-13 | 2012-08-07 | Avx Corporation | Land grid feedthrough low ESL technology |
US8446705B2 (en) * | 2008-08-18 | 2013-05-21 | Avx Corporation | Ultra broadband capacitor |
KR101922863B1 (ko) * | 2011-05-31 | 2018-11-28 | 삼성전기 주식회사 | 적층형 세라믹 전자부품 및 그 제조방법 |
WO2013109719A1 (en) | 2012-01-17 | 2013-07-25 | Massachusetts Institute Of Technology | Stacked switched capacitor energy buffer circuit |
US10306711B2 (en) * | 2013-05-17 | 2019-05-28 | Bemon, LLC | Microwave oven with dual doors |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08124799A (ja) * | 1994-10-27 | 1996-05-17 | Rohm Co Ltd | 積層セラミックコンデンサアレイ |
JPH11144996A (ja) | 1997-11-10 | 1999-05-28 | Murata Mfg Co Ltd | 積層コンデンサ |
JPH11329894A (ja) | 1998-05-21 | 1999-11-30 | Murata Mfg Co Ltd | 積層コンデンサ |
JP2000114100A (ja) | 1998-09-30 | 2000-04-21 | Matsushita Electric Ind Co Ltd | 多連型電子部品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3340625B2 (ja) * | 1996-07-04 | 2002-11-05 | 株式会社村田製作所 | 表面実装型セラミック電子部品 |
JP3514195B2 (ja) | 1999-12-27 | 2004-03-31 | 株式会社村田製作所 | 積層コンデンサ、配線基板、デカップリング回路および高周波回路 |
US6266228B1 (en) * | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
EP1950776B1 (en) * | 1998-12-28 | 2010-05-19 | Murata Manufacturing Co. Ltd. | Monolithic ceramic electronic component |
JP4000701B2 (ja) | 1999-01-14 | 2007-10-31 | 株式会社村田製作所 | 積層コンデンサ |
JP3548821B2 (ja) * | 1999-05-10 | 2004-07-28 | 株式会社村田製作所 | 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路 |
JP3563665B2 (ja) | 2000-03-30 | 2004-09-08 | Tdk株式会社 | 積層型電子回路部品 |
TWI229878B (en) * | 2003-03-12 | 2005-03-21 | Tdk Corp | Multilayer capacitor |
US6906907B2 (en) * | 2003-04-15 | 2005-06-14 | Kemet Electronics Corporation | Monolithic multi-layer capacitor with improved lead-out structure |
-
2004
- 2004-06-29 JP JP2004192041A patent/JP2006013380A/ja active Pending
-
2005
- 2005-06-22 US US11/157,799 patent/US7061747B2/en active Active
- 2005-06-22 CN CN200510079437A patent/CN100576383C/zh active Active
- 2005-06-23 TW TW094121036A patent/TWI260656B/zh active
- 2005-06-29 KR KR1020050057080A patent/KR100707414B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08124799A (ja) * | 1994-10-27 | 1996-05-17 | Rohm Co Ltd | 積層セラミックコンデンサアレイ |
JPH11144996A (ja) | 1997-11-10 | 1999-05-28 | Murata Mfg Co Ltd | 積層コンデンサ |
JPH11329894A (ja) | 1998-05-21 | 1999-11-30 | Murata Mfg Co Ltd | 積層コンデンサ |
JP2000114100A (ja) | 1998-09-30 | 2000-04-21 | Matsushita Electric Ind Co Ltd | 多連型電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US7061747B2 (en) | 2006-06-13 |
TWI260656B (en) | 2006-08-21 |
CN100576383C (zh) | 2009-12-30 |
US20050286206A1 (en) | 2005-12-29 |
CN1716474A (zh) | 2006-01-04 |
TW200605111A (en) | 2006-02-01 |
KR20060048706A (ko) | 2006-05-18 |
JP2006013380A (ja) | 2006-01-12 |
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