JP3866579B2 - 薄層金属膜 - Google Patents

薄層金属膜 Download PDF

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Publication number
JP3866579B2
JP3866579B2 JP2002016707A JP2002016707A JP3866579B2 JP 3866579 B2 JP3866579 B2 JP 3866579B2 JP 2002016707 A JP2002016707 A JP 2002016707A JP 2002016707 A JP2002016707 A JP 2002016707A JP 3866579 B2 JP3866579 B2 JP 3866579B2
Authority
JP
Japan
Prior art keywords
metal salt
hydrophilic
graft polymer
metal
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002016707A
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English (en)
Japanese (ja)
Other versions
JP2003213437A5 (enExample
JP2003213437A (ja
Inventor
丈嘉 加納
浩一 川村
Original Assignee
富士フイルムホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士フイルムホールディングス株式会社 filed Critical 富士フイルムホールディングス株式会社
Priority to JP2002016707A priority Critical patent/JP3866579B2/ja
Priority to US10/347,736 priority patent/US20030149187A1/en
Priority to EP03001354A priority patent/EP1331285A3/en
Publication of JP2003213437A publication Critical patent/JP2003213437A/ja
Priority to US10/853,215 priority patent/US20050019502A1/en
Publication of JP2003213437A5 publication Critical patent/JP2003213437A5/ja
Application granted granted Critical
Publication of JP3866579B2 publication Critical patent/JP3866579B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Graft Or Block Polymers (AREA)
JP2002016707A 2002-01-25 2002-01-25 薄層金属膜 Expired - Fee Related JP3866579B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002016707A JP3866579B2 (ja) 2002-01-25 2002-01-25 薄層金属膜
US10/347,736 US20030149187A1 (en) 2002-01-25 2003-01-22 Thin-layer metal film
EP03001354A EP1331285A3 (en) 2002-01-25 2003-01-24 Thin-layer metal film
US10/853,215 US20050019502A1 (en) 2002-01-25 2004-05-26 Thin-layer metal film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002016707A JP3866579B2 (ja) 2002-01-25 2002-01-25 薄層金属膜

Publications (3)

Publication Number Publication Date
JP2003213437A JP2003213437A (ja) 2003-07-30
JP2003213437A5 JP2003213437A5 (enExample) 2005-07-14
JP3866579B2 true JP3866579B2 (ja) 2007-01-10

Family

ID=19192012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002016707A Expired - Fee Related JP3866579B2 (ja) 2002-01-25 2002-01-25 薄層金属膜

Country Status (3)

Country Link
US (2) US20030149187A1 (enExample)
EP (1) EP1331285A3 (enExample)
JP (1) JP3866579B2 (enExample)

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JP4321653B2 (ja) 2007-12-27 2009-08-26 オムロン株式会社 金属膜の製造方法
JP4321652B2 (ja) 2007-12-27 2009-08-26 オムロン株式会社 金属膜の製造方法
JP4458188B2 (ja) 2008-09-26 2010-04-28 オムロン株式会社 ハーフミラーおよびその製造方法
JP4853596B1 (ja) 2011-03-15 2012-01-11 オムロン株式会社 酸化金属膜を備えたセンサおよびその利用
JP5670827B2 (ja) 2011-05-13 2015-02-18 富士フイルム株式会社 導電シート及びタッチパネル
JP5675491B2 (ja) 2011-05-13 2015-02-25 富士フイルム株式会社 導電シート及びタッチパネル
JP5809846B2 (ja) 2011-05-13 2015-11-11 富士フイルム株式会社 導電シート及びタッチパネル
JP5839541B2 (ja) 2011-05-13 2016-01-06 富士フイルム株式会社 導電シート及びタッチパネル
JP2013149232A (ja) 2011-12-22 2013-08-01 Fujifilm Corp 導電シート及びタッチパネル
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JP5975907B2 (ja) * 2012-04-11 2016-08-23 株式会社半導体エネルギー研究所 半導体装置
JP6129769B2 (ja) 2013-05-24 2017-05-17 富士フイルム株式会社 タッチパネル用透明導電膜、透明導電膜の製造方法、タッチパネル及び表示装置
JP6026003B2 (ja) 2013-10-22 2016-11-16 富士フイルム株式会社 導電性フイルム、タッチパネル及び表示装置
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JP6348874B2 (ja) 2015-05-19 2018-06-27 富士フイルム株式会社 タッチセンサパネル
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EP1331285A3 (en) 2004-06-09

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