JP2017521653A - インライン型のウェハエッジ検査、ウェハプレアラインメント、及びウェハ洗浄 - Google Patents
インライン型のウェハエッジ検査、ウェハプレアラインメント、及びウェハ洗浄 Download PDFInfo
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Abstract
Description
Claims (21)
- 半導体ウェハの検査及び加工システムにおいて、
リソグラフィシステム中でリソグラフィ工程がそこに施行される予定の各ウェハを、そのウェハに対してフォトリソグラフィ工程が実行される前に受けるエッジ検出システムであって、
1つ又は複数の照明ビームをウェハの、少なくとも1つの側面並びにウェハの境界領域内にある上部及び底部を含むエッジ部分へと誘導するための少なくとも1つの照明経路と、
1つ又は複数の照明ビームに応答して、ウェハのエッジ部分から散乱又は反射された出力放射を集光し、検出するための少なくとも1つの集光モジュールと、
エッジ部分の中の欠陥を位置特定し、そのようなウェハの検出された出力放射に基づいて、各ウェハが仕様範囲内であるか否かを判断するためのアナライザモジュールと、
を含むエッジ検出システムと、
エッジ検出システムから、仕様範囲内であることが判明した各ウェハを受け取るフォトリソグラフィシステムと、
を含み、
エッジ検出システムは、フォトリソグラフィシステムとインライン方式で連結されることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
エッジ検出システムのアナライザモジュールはさらに、各ウェハのアラインメント位置を判断するように構成され、このようなアラインメント位置は、エッジ検出システムからフォトリソグラフィシステムによって、フォトリソグラフィ工程中にそのようなウェハのアラインメントのために受け取られることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
エッジ検出システムは、各ウェハを、そのウェハがフォトリソグラフィシステムにより加工される直前に受けるように配置されることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの照明経路は、エッジ部分に同時に誘導される複数の照明ビームを生成するための回折光学要素を含むことを特徴とするシステム。 - 請求項4に記載のシステムにおいて、
エッジ検出システムは、照明経路の下で各ウェハを回転させて、複数の照明ビームでそのようなウェハのエッジ部分の全周がスキャンされるようにし、またエッジ検出システムをエッジ部分の上部、底部、及び少なくとも1つの側面の周囲で回転させるための少なくとも1つの位置決め機構をさらに含むことを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの集光モジュールは、各ウェハから散乱された出力放射を受け取るための暗視野経路と、各ウェハから反射された出力放射を受けるための明視野経路と、を含むことを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの照明経路は、少なくとも1つの照明ビームで各ウェハのエッジ部分をスキャンするための偏光機構を含むことを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの照明経路と少なくとも1つの集光経路は、各ウェハのエッジ部分の少なくとも1つの側面を検査するためのエッジ検査器と、少なくとも1つの側面の検査中に各ウェハのエッジ部分のそれぞれ上部及び底部を同時に検査するための上側カメラと下側カメラの形態であることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの照明経路と少なくとも1つの集光経路は、各ウェハのエッジ部分の少なくとも1つの側面、上部、及び底部を同時に検査するように構成された複数のカメラの形態であることを特徴とするシステム。 - 請求項9に記載のシステムにおいて、
カメラは、各ウェハのエッジ部分の少なくとも1つの側面、上部、及び底部に沿って相互にずらして配置されていることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
エッジ検出システムの少なくとも1つの照明経路と少なくとも1つの集光経路は、
各ウェハのエッジ部分に向かって位置決めするための内面と、内面の反対の外面を有する曲面ディフューザと、
ディフューザの外面上の複数の位置に隣接する複数の照明ビームを生成して、ディフューザによって各サンプルのエッジ部分において複数の入射角度で均一な光が出力されるようにする複数の光源と、
入射光に応答して各ウェハのエッジ部分から散乱される出力放射を受け取り、検出された信号を生成するためのセンサと、
を含み、
光源、ディフューザ、及びセンサは、コンパクトなフォーマットに集積されることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
照明経路は、明視野照明及び/又は暗視野照明を提供するように構成されることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの集光経路は、エッジ部分の少なくとも1つの側面、上部、及び底部からの出力放射を受け取るように配置された複数の第一の端と、受け取った出力放射をラインスキャンカメラ又はTDI(time delay integration)カメラへと出力する複数の第二の反対の端を有するファイバ束の形態であることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
少なくとも1つの集光経路は、エッジ部分の少なくとも1つの側面、上部、及び底部から出力放射を同時に受け取って、ラインスキャンカメラ又はTDI(time delay integration)カメラへと誘導するように位置付けられた複数の光学要素の形態であることを特徴とするシステム。 - 請求項1に記載のシステムにおいて、
エッジ検出システムの少なくとも1つの照明経路と少なくとも1つの集光経路は、各ウェハのエッジ部分に配置された複数のブルーレイ装置を含むことを特徴とするシステム。 - フォトリソグラフィシステムの中のフォトリソグラフィ工程が施行される予定のウェハのエッジ部分を検査する方法において、
フォトリソグラフィシステムの中でフォトリソグラフィ工程が施行される各ウェハについて、そのウェハにフォトリソグラフィ工程が実行される前にそのウェハをエッジ検出システムの中に受けるステップと、
エッジ検出システムによって、各ウェハの、少なくとも1つの側面並びにウェハの境界領域内にある上部及び底部を含むエッジ部分の欠陥を検査して、ウェハが仕様範囲内にあるか否かを判断するステップと、
エッジ検出システムが仕様範囲内にあると判断した各ウェハについて、エッジ検出システムからウェハをリソグラフィシステムへと排出するステップと、
を含み、
エッジ検出システムは、フォトリソグラフィシステムとインラインの関係であることを特徴とする方法。 - 請求項16に記載の方法において、
仕様範囲内であることが判明した特定のウェハの欠陥を、そのような特定のウェハにフォトリソグラフィ工程が実行されている間又はその後に追跡するステップを含むことを特徴とする方法。 - 請求項16に記載の方法において、
エッジ検出システムは、リソグラフィシステムの処理速度と等しいか、それより速い速度でウェハを検査することを特徴とする方法。 - 請求項16に記載の方法において、
各ウェハのエッジ部分は、ウェハの円周の周囲で回転され、ウェハのエッジ部分の上部及び下部並びに少なくとも1つの側面の全体にわたってステップ式に移動される複数の同時スキャンスポットで検査されることを特徴とする方法。 - 請求項16に記載の方法において、
エッジ検出システムによって、各ウェハのアラインメント位置を判断するステップと、
各ウェハに関するそのようなアラインメント位置をエッジ検出システムからフォトリソグラフィシステムで受けるステップを含み、それは受け取ったアラインメント位置をフォトリソグラフィ工程中のそのようなウェハのアラインメントのために使用することを特徴とする方法。 - 請求項20に記載の方法において、
仕様範囲外であると判断され、フォトリソグラフィシステムにウェハを送る前に洗浄可能である各ウェハを洗浄するステップをさらに含み、
洗浄するステップは、エッジ検出及びフォトリソグラフィシステムとインラインの関係にある内部洗浄システムにおいて実行されることを特徴とする方法。
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US201462014986P | 2014-06-20 | 2014-06-20 | |
US62/014,986 | 2014-06-20 | ||
US14/741,866 | 2015-06-17 | ||
US14/741,866 US9645097B2 (en) | 2014-06-20 | 2015-06-17 | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
PCT/US2015/036820 WO2015196163A1 (en) | 2014-06-20 | 2015-06-19 | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
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US9645097B2 (en) | 2017-05-09 |
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