IL162650A - Scrap-units- mapping system for mapping multiple layers of a single board and method therefor - Google Patents

Scrap-units- mapping system for mapping multiple layers of a single board and method therefor

Info

Publication number
IL162650A
IL162650A IL162650A IL16265004A IL162650A IL 162650 A IL162650 A IL 162650A IL 162650 A IL162650 A IL 162650A IL 16265004 A IL16265004 A IL 16265004A IL 162650 A IL162650 A IL 162650A
Authority
IL
Israel
Prior art keywords
mapping
scrap
units
multiple layers
method therefor
Prior art date
Application number
IL162650A
Other languages
Hebrew (he)
Other versions
IL162650A0 (en
Inventor
Nir Dery
Original Assignee
Camtek Ltd
Nir Dery
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Camtek Ltd, Nir Dery filed Critical Camtek Ltd
Priority to IL162650A priority Critical patent/IL162650A/en
Priority to JP2007517648A priority patent/JP4923180B2/en
Priority to CN2005800248665A priority patent/CN101297305B/en
Priority to PCT/IL2005/000650 priority patent/WO2005122695A2/en
Priority to TW094120377A priority patent/TWI275335B/en
Publication of IL162650A0 publication Critical patent/IL162650A0/en
Publication of IL162650A publication Critical patent/IL162650A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IL162650A 2004-06-21 2004-06-21 Scrap-units- mapping system for mapping multiple layers of a single board and method therefor IL162650A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IL162650A IL162650A (en) 2004-06-21 2004-06-21 Scrap-units- mapping system for mapping multiple layers of a single board and method therefor
JP2007517648A JP4923180B2 (en) 2004-06-21 2005-06-19 System for mapping defective printed circuits
CN2005800248665A CN101297305B (en) 2004-06-21 2005-06-19 A system for mapping defective printed circuits
PCT/IL2005/000650 WO2005122695A2 (en) 2004-06-21 2005-06-19 A system for mapping defective printed circuits
TW094120377A TWI275335B (en) 2004-06-21 2005-06-20 A system for mapping defective printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL162650A IL162650A (en) 2004-06-21 2004-06-21 Scrap-units- mapping system for mapping multiple layers of a single board and method therefor

Publications (2)

Publication Number Publication Date
IL162650A0 IL162650A0 (en) 2005-11-20
IL162650A true IL162650A (en) 2014-09-30

Family

ID=35510182

Family Applications (1)

Application Number Title Priority Date Filing Date
IL162650A IL162650A (en) 2004-06-21 2004-06-21 Scrap-units- mapping system for mapping multiple layers of a single board and method therefor

Country Status (5)

Country Link
JP (1) JP4923180B2 (en)
CN (1) CN101297305B (en)
IL (1) IL162650A (en)
TW (1) TWI275335B (en)
WO (1) WO2005122695A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
WO2019178977A1 (en) * 2018-03-22 2019-09-26 广州兴森快捷电路科技有限公司 Method and device for tracking circuit board defects on the basis of positioning holes, and computer apparatus

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101621893B (en) * 2008-07-02 2011-04-13 欣兴电子股份有限公司 Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board
CN101865652A (en) * 2009-04-15 2010-10-20 上海汽车制动系统有限公司 Detection method and system of EBS (Electronic Brake System) electromagnetic valve model discrimination
CN102338754A (en) * 2010-07-22 2012-02-01 牧德科技股份有限公司 Method for detecting defects of power supply layer and ground layer of circuit board
CN102074031B (en) * 2011-01-13 2013-08-07 广东正业科技股份有限公司 Standard establishment method for observational check machine of printed circuit board
CN102136016A (en) * 2011-03-09 2011-07-27 瑞谷科技(深圳)有限公司 Printed circuit board (PCB) designing method and device
KR101478790B1 (en) 2013-10-14 2015-01-06 (주)에이티테크놀러지 Apparatus for testing Printed Circuit Board
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
CN105588840B (en) * 2015-12-04 2019-01-25 广州视源电子科技股份有限公司 A kind of electronic units fix method and device
CN105873358B (en) * 2016-05-31 2019-02-05 Oppo广东移动通信有限公司 Multiple-printed-panel for circuit board
KR101751518B1 (en) * 2016-08-24 2017-06-27 주식회사 아이디디 Marking apparatus and method for PCB panel

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214198A (en) * 1988-02-23 1989-08-28 Toshiba Corp Recognition of failure of multi-layer printed-circuit board
US5204912A (en) * 1990-02-26 1993-04-20 Gerber Systems Corporation Defect verification and marking system for use with printed circuit boards
US5086477A (en) * 1990-08-07 1992-02-04 Northwest Technology Corp. Automated system for extracting design and layout information from an integrated circuit
US5260779A (en) * 1992-02-21 1993-11-09 Control Automation, Inc. Method and apparatus for inspecting a printed circuit board
JP2000101253A (en) * 1998-09-24 2000-04-07 Ibiden Co Ltd Manufacture of multilayer printed wiring board
US6707936B1 (en) * 1999-04-16 2004-03-16 Texas Instruments Incorporated Method and apparatus for predicting device yield from a semiconductor wafer
DE10011200A1 (en) * 2000-03-08 2001-09-13 Leica Microsystems Defect classification method for wafer inspection compares with reference is automatic and suitable for production line use
US7058474B2 (en) * 2000-11-08 2006-06-06 Orbotech Ltd. Multi-layer printed circuit board fabrication system and method
US6836560B2 (en) * 2000-11-13 2004-12-28 Kla - Tencor Technologies Corporation Advanced phase shift inspection method
JP2003139720A (en) * 2001-10-31 2003-05-14 Olympus Optical Co Ltd Verifying device
US6735745B2 (en) * 2002-02-07 2004-05-11 Applied Materials, Inc. Method and system for detecting defects
IL148829A0 (en) * 2002-03-21 2002-09-12 Camtek Ltd A method for storing information on layers of a layered product
JP4282515B2 (en) * 2004-03-15 2009-06-24 パナソニック株式会社 Method for manufacturing component-embedded board and board management apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
WO2019178977A1 (en) * 2018-03-22 2019-09-26 广州兴森快捷电路科技有限公司 Method and device for tracking circuit board defects on the basis of positioning holes, and computer apparatus

Also Published As

Publication number Publication date
JP2008504521A (en) 2008-02-14
TW200601927A (en) 2006-01-01
IL162650A0 (en) 2005-11-20
WO2005122695A2 (en) 2005-12-29
TWI275335B (en) 2007-03-01
WO2005122695A3 (en) 2007-05-18
CN101297305A (en) 2008-10-29
JP4923180B2 (en) 2012-04-25
CN101297305B (en) 2012-08-22

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