DE60236019D1 - Stereoskopisches dreidimensionales metrologiesystem und -verfahren - Google Patents

Stereoskopisches dreidimensionales metrologiesystem und -verfahren

Info

Publication number
DE60236019D1
DE60236019D1 DE60236019T DE60236019T DE60236019D1 DE 60236019 D1 DE60236019 D1 DE 60236019D1 DE 60236019 T DE60236019 T DE 60236019T DE 60236019 T DE60236019 T DE 60236019T DE 60236019 D1 DE60236019 D1 DE 60236019D1
Authority
DE
Germany
Prior art keywords
test article
stereoscopic
metrology system
feature
dimensional metrology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60236019T
Other languages
English (en)
Inventor
Donald B Snow
John T Strom
Raymond H Kraft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MARINER ACQUISITION CO LLC
Rudolph Technologies Inc
Original Assignee
MARINER ACQUISITION CO LLC
Rudolph Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MARINER ACQUISITION CO LLC, Rudolph Technologies Inc filed Critical MARINER ACQUISITION CO LLC
Application granted granted Critical
Publication of DE60236019D1 publication Critical patent/DE60236019D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C11/00—Photogrammetry or videogrammetry, e.g. stereogrammetry; Photographic surveying
    • G01C11/04—Interpretation of pictures
    • G01C11/06—Interpretation of pictures by comparison of two or more pictures of the same area
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Holo Graphy (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE60236019T 2001-12-28 2002-12-18 Stereoskopisches dreidimensionales metrologiesystem und -verfahren Expired - Lifetime DE60236019D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34644701P 2001-12-28 2001-12-28
PCT/US2002/040610 WO2003058158A2 (en) 2001-12-28 2002-12-18 Stereoscopic three-dimensional metrology system and method

Publications (1)

Publication Number Publication Date
DE60236019D1 true DE60236019D1 (de) 2010-05-27

Family

ID=23359434

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60236019T Expired - Lifetime DE60236019D1 (de) 2001-12-28 2002-12-18 Stereoskopisches dreidimensionales metrologiesystem und -verfahren

Country Status (7)

Country Link
US (2) US7231081B2 (de)
EP (1) EP1466137B1 (de)
JP (2) JP4896373B2 (de)
AT (1) ATE464535T1 (de)
AU (1) AU2002357335A1 (de)
DE (1) DE60236019D1 (de)
WO (1) WO2003058158A2 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8466703B2 (en) 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
JP5089166B2 (ja) * 2003-03-14 2012-12-05 ルドルフテクノロジーズ インコーポレイテッド プローブカードアナライザにおける部品のたわみの影響を軽減する方法
US7064318B2 (en) * 2003-08-26 2006-06-20 Thermo Finnigan Llc Methods and apparatus for aligning ion optics in a mass spectrometer
DE60316942T2 (de) * 2003-08-27 2008-08-14 Alstom Technology Ltd. Adaptive automatisierte Bearbeitung von überfüllten Kanälen
US7117068B2 (en) * 2003-09-29 2006-10-03 Quantum Corporation System and method for library robotics positional accuracy using parallax viewing
US6977356B2 (en) * 2003-09-30 2005-12-20 United Technologies Corporation Stereovision guided laser drilling system
KR101034923B1 (ko) * 2004-05-31 2011-05-17 엘지디스플레이 주식회사 오토 프로브 검사장비 및 이를 이용한 검사방법
US7557966B2 (en) * 2004-08-11 2009-07-07 Acushnet Company Apparatus and method for scanning an object
EP1805478A1 (de) * 2004-10-29 2007-07-11 Wincor Nixdorf International GmbH Einrichtung zur dreidimensionalen vermessung von objekten
CN101124454A (zh) * 2004-12-30 2008-02-13 斯耐普昂公司 非接触式车辆测量方法及系统
JP2008122228A (ja) 2006-11-13 2008-05-29 Konica Minolta Sensing Inc 位置合わせシステム及び位置合わせ方法
WO2009101798A1 (ja) * 2008-02-12 2009-08-20 Panasonic Corporation 複眼撮像装置、測距装置、視差算出方法及び測距方法
KR101420684B1 (ko) * 2008-02-13 2014-07-21 삼성전자주식회사 컬러 영상과 깊이 영상을 매칭하는 방법 및 장치
EP2182387A1 (de) 2008-10-30 2010-05-05 EADS Construcciones Aeronauticas, S.A. Anzeigesystem und Verfahren für Auftankvorgänge
DK200801722A (en) 2008-12-05 2010-06-06 Unisensor As Optical sectioning of a sample and detection of particles in a sample
JP2010210585A (ja) * 2009-03-12 2010-09-24 Omron Corp ３次元視覚センサにおけるモデル表示方法および３次元視覚センサ
JP5245938B2 (ja) * 2009-03-12 2013-07-24 オムロン株式会社 ３次元認識結果の表示方法および３次元視覚センサ
JP5316118B2 (ja) 2009-03-12 2013-10-16 オムロン株式会社 ３次元視覚センサ
JP5714232B2 (ja) * 2009-03-12 2015-05-07 オムロン株式会社 キャリブレーション装置および３次元計測のためのパラメータの精度の確認支援方法
JP5282614B2 (ja) * 2009-03-13 2013-09-04 オムロン株式会社 視覚認識処理用のモデルデータの登録方法および視覚センサ
US20110165923A1 (en) * 2010-01-04 2011-07-07 Davis Mark L Electronic circle game system
EP2334089A1 (de) 2009-12-04 2011-06-15 Alcatel Lucent Verfahren und Systeme zur Erzeugung eines verbesserten Stereobildes eines Objekts
AU2010327159B2 (en) 2009-12-04 2013-10-10 Unisensor A/S System and method for time-related microscopy of biological organisms
KR20130054240A (ko) 2010-03-04 2013-05-24 유니센서 에이/에스 가요성 샘플 컨테이너
WO2011127962A1 (de) * 2010-04-13 2011-10-20 Cascade Microtech Dresden Gmbh Verfahren und vorrichtung zur kontaktierung einer reihe von kontaktflächen mit sondenspitzen
US20120009394A1 (en) * 2010-07-07 2012-01-12 MOS Art Pack Corporation Bonding method and bonding substrate
CN103322937A (zh) * 2012-03-19 2013-09-25 联想(北京)有限公司 一种结构光法测量物体深度的方法及装置
US10112258B2 (en) * 2012-03-30 2018-10-30 View, Inc. Coaxial distance measurement via folding of triangulation sensor optics path
US9317109B2 (en) 2012-07-12 2016-04-19 Mep Tech, Inc. Interactive image projection accessory
US10196850B2 (en) 2013-01-07 2019-02-05 WexEnergy LLC Frameless supplemental window for fenestration
US8923650B2 (en) 2013-01-07 2014-12-30 Wexenergy Innovations Llc System and method of measuring distances related to an object
US9230339B2 (en) 2013-01-07 2016-01-05 Wexenergy Innovations Llc System and method of measuring distances related to an object
US10883303B2 (en) 2013-01-07 2021-01-05 WexEnergy LLC Frameless supplemental window for fenestration
US9691163B2 (en) 2013-01-07 2017-06-27 Wexenergy Innovations Llc System and method of measuring distances related to an object utilizing ancillary objects
US9845636B2 (en) 2013-01-07 2017-12-19 WexEnergy LLC Frameless supplemental window for fenestration
US11885738B1 (en) 2013-01-22 2024-01-30 J.A. Woollam Co., Inc. Reflectometer, spectrophotometer, ellipsometer or polarimeter system including sample imaging system that simultaneously meet the scheimpflug condition and overcomes keystone error
US9778546B2 (en) 2013-08-15 2017-10-03 Mep Tech, Inc. Projector for projecting visible and non-visible images
JP6564781B2 (ja) 2013-10-29 2019-08-21 アイデックス ラボラトリーズ インコーポレイテッドＩＤＥＸＸ Ｌａｂｏｒａｔｏｒｉｅｓ， Ｉｎｃ． 液体サンプル中で細菌を検出し、その濃度を決定するための方法および容器
TWI655439B (zh) * 2014-06-06 2019-04-01 美商魯道夫科技股份有限公司 用檢測裝置來測量及評估探針卡的方法
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
EP3158731B1 (de) * 2014-12-31 2020-11-25 SZ DJI Technology Co., Ltd. System und verfahren zur einstellung einer grundlinie eines abbildungssystems mit mikrolinsenraster
US9804196B2 (en) 2016-01-15 2017-10-31 Cascade Microtech, Inc. Probes with fiducial marks, probe systems including the same, and associated methods
IL271006B1 (en) 2017-05-30 2024-05-01 WexEnergy LLC Complementary window without a frame for window design
CN110044293B (zh) * 2018-01-17 2020-11-17 深圳中科飞测科技有限公司 一种三维重构系统及三维重构方法
US10877070B2 (en) 2018-01-19 2020-12-29 Formfactor Beaverton, Inc. Probes with fiducial targets, probe systems including the same, and associated methods
DE102018133188A1 (de) * 2018-12-20 2020-06-25 Carl Zeiss Microscopy Gmbh Abstandbestimmung einer probenebene in einem mikroskopsystem
DE102019126419A1 (de) * 2019-05-08 2020-11-12 Docter Optics Se Vorrichtung zum optischen Abbilden von Merkmalen einer Hand
US11927603B2 (en) 2021-10-20 2024-03-12 Formfactor, Inc. Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI74556C (fi) * 1986-04-11 1988-02-08 Valtion Teknillinen Foerfarande foer tredimensionell oevervakning av ett maolutrymme.
JPH04259808A (ja) * 1991-02-15 1992-09-16 Fujitsu Ltd 線状物検査用画像入力装置
JPH04283672A (ja) * 1991-03-13 1992-10-08 Fujitsu Ltd 分割試験ヘッドの位置補正方法及び装置
JPH05141930A (ja) * 1991-11-19 1993-06-08 Nippon Telegr & Teleph Corp <Ntt> ３次元形状計測装置
US5603318A (en) * 1992-04-21 1997-02-18 University Of Utah Research Foundation Apparatus and method for photogrammetric surgical localization
US5389101A (en) * 1992-04-21 1995-02-14 University Of Utah Apparatus and method for photogrammetric surgical localization
JP3427499B2 (ja) * 1993-07-23 2003-07-14 富士写真光機株式会社 干渉計の被検体アライメント装置
JP3048107B2 (ja) * 1994-03-17 2000-06-05 新日本製鐵株式会社 物体の寸法の計測方法及び装置
US5537204A (en) * 1994-11-07 1996-07-16 Micron Electronics, Inc. Automatic optical pick and place calibration and capability analysis system for assembly of components onto printed circuit boards
US6122541A (en) * 1995-05-04 2000-09-19 Radionics, Inc. Head band for frameless stereotactic registration
JPH09119819A (ja) * 1995-10-24 1997-05-06 Olympus Optical Co Ltd 三次元情報再構成装置
JP3869876B2 (ja) * 1995-12-19 2007-01-17 キヤノン株式会社 画像計測方法及び画像計測装置
JPH1089957A (ja) * 1996-09-13 1998-04-10 Sakurada:Kk 構造部材の三次元計測方法
JPH1196374A (ja) * 1997-07-23 1999-04-09 Sanyo Electric Co Ltd ３次元モデリング装置、３次元モデリング方法および３次元モデリングプログラムを記録した媒体
JP3728900B2 (ja) * 1997-10-17 2005-12-21 ソニー株式会社 キャリブレーション方法及び装置、並びにキャリブレーション用データ生成方法
DE19748844C1 (de) * 1997-11-05 1999-08-26 Cybertron Automation Qualitaetsanalyse Prüfkörper
DE19757763A1 (de) * 1997-12-23 1999-07-01 Bosch Gmbh Robert Vorrichtung zum Bestimmen der Rad- und/oder Achsgeometrie von Kraftfahrzeugen
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
JP3897203B2 (ja) * 1998-02-10 2007-03-22 株式会社テクノホロン ボールグリッドアレイのボール高さ計測方法
JP4288753B2 (ja) * 1999-05-31 2009-07-01 コニカミノルタセンシング株式会社 ３次元データ入力装置
JP3798922B2 (ja) * 1999-06-24 2006-07-19 ペンタックス株式会社 写真測量画像処理装置、写真測量画像処理方法、および写真測量画像処理プログラムを格納した記憶媒体
JP2003504607A (ja) * 1999-07-13 2003-02-04 ビーティ エルウィン エム 電子部品の三次元検査装置及び方法
AU1763801A (en) * 1999-11-12 2001-06-06 Brian S. Armstrong Methods and appparatus for measuring orientation and distance
JP4469462B2 (ja) * 2000-05-25 2010-05-26 株式会社ニコン キャリア形状測定機
US6728582B1 (en) * 2000-12-15 2004-04-27 Cognex Corporation System and method for determining the position of an object in three dimensions using a machine vision system with two cameras

Also Published As

Publication number Publication date
WO2003058158A3 (en) 2003-09-18
US20030142862A1 (en) 2003-07-31
JP2005514606A (ja) 2005-05-19
JP2010038923A (ja) 2010-02-18
EP1466137B1 (de) 2010-04-14
JP4896373B2 (ja) 2012-03-14
WO2003058158A2 (en) 2003-07-17
ATE464535T1 (de) 2010-04-15
AU2002357335A1 (en) 2003-07-24
AU2002357335A8 (en) 2003-07-24
US20070269103A1 (en) 2007-11-22
US7634128B2 (en) 2009-12-15
EP1466137A4 (de) 2005-03-23
EP1466137A2 (de) 2004-10-13
US7231081B2 (en) 2007-06-12

Similar Documents

Publication Publication Date Title
ATE464535T1 (de) Stereoskopisches dreidimensionales metrologiesystem und -verfahren
JP6068593B2 (ja) タッチプローブに対してビジョンシステムを校正するためのシステム及び方法
KR101601331B1 (ko) 물체의 모양을 삼차원 측정하기 위한 시스템 및 방법
CN106595519B (zh) 一种基于激光mems投影的柔性三维轮廓测量方法及装置
CN104990515B (zh) 大型物体三维形状测量系统及其测量方法
WO2002013140A3 (en) Camera calibration for three-dimensional reconstruction of objects
TW200741174A (en) Apparatus for measuring three dimensional shape
ATE292784T1 (de) Verfahren zur optischen formerfassung von gegenständen
CN104897142A (zh) 一种适用于双目或多目视觉尺寸测量的立体靶标
KR19990068886A (ko) 프리즘에 의한 스테레오 카메라 시스템
CN208012553U (zh) 一种圆筒内壁检测系统
WO2002010679A1 (fr) Systeme servant a mesurer la forme d&#39;une surface
SE9701911D0 (sv) Sätt och anordning för beröringsfri inmätning av förflyttning
CN108534704A (zh) 基于结构光的圆筒内壁检测系统
CN116678324A (zh) 电池检测机构及电池检测方法
CN108534716A (zh) 针对圆筒内壁检测的结构光光栅
EP0474776B1 (de) Verfahren zum dokumentieren und messen in der zahnheilkunde sowie vorrichtung zur durchführung des verfahrens
CN105157562A (zh) 一种小空间复杂精密工件几何尺寸在线动态视觉测量系统及测量方法
CN113494891B (zh) 一种用于火车承载鞍整体型面测量的多视角拼接方法
KR100295477B1 (ko) 물체의치수를측정하는장치
Breuckmann et al. 3D-metrologies for industrial applications
IL161745A0 (en) A method and a system for height triangulation measurement of low objects
CA2272500A1 (en) Method and apparatus for measuring dimensional rough stone blocks
DK1111334T3 (da) Fremgangsmåde og indretning til lokalisering af cylinderformede objekter
CN2935081Y (zh) 双镜头三角定位深度测量仪

Legal Events

Date Code Title Description
8364 No opposition during term of opposition