JP2017224835A - 電子装置の表面材料の外観的同時除去 - Google Patents
電子装置の表面材料の外観的同時除去 Download PDFInfo
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
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- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- H05K5/0208—Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Computer Security & Cryptography (AREA)
- Computer Networks & Wireless Communication (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
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Abstract
Description
本出願は、2010年2月2日に出願された米国仮特許出願第61/300,780号、2010年4月19日に出願された米国仮特許出願第61/325,625号、及び2010年4月19日に出願された米国仮特許出願第61/325,786号の利益を主張するものであり、これらの仮特許出願は全てその全体が引用により本明細書に組み入れられる。
101:外面
102:左面
106:頂面
108:底面
110:大型L字型要素
112:接触面
114:中間要素
120:小型L字型要素
122:接触面
124:中間要素
130:U字型要素
132:接触面
134:中間要素
Claims (20)
- 電子装置部品の複数の要素間の少なくとも1つの継ぎ目を越えて広がる連続的な外面を有する前記電子装置部品を構成する方法であって、
第1の材料で形成された第1の要素を提供するステップと、
第2の材料で形成された第2の要素を提供するステップと、
前記第1及び第2の要素を、第3の材料で形成された中間要素とともに接続して、前記第1の要素と前記中間要素の間の接触面における第1の継ぎ目と、前記第2の要素と前記中間要素の間の接触面における第2の継ぎ目とを有する前記電子装置部品を形成するステップと、
単一の処理を使用して前記第1の要素、前記第2の要素及び前記中間要素のうちの少なくとも2つから余剰材料を除去し、前記第1の継ぎ目及び前記第2の継ぎ目の少なくとも一方にわたる連続表面を形成するステップと、
を含むことを特徴とする方法。 - 前記第1の要素、前記第2の要素及び前記中間要素のうちの少なくとも2つから離れた材料を研磨するステップをさらに含む、
ことを特徴とする請求項1に記載の方法。 - 前記第1の要素、前記第2の要素及び前記中間要素にツールを適用して、前記第1の継ぎ目及び前記第2の継ぎ目の一方にわたる余剰材料を除去するステップをさらに含む、
ことを特徴とする請求項1に記載の方法。 - 前記第1の要素、前記第2の要素及び前記中間要素のうちの少なくとも2つに、前記ツールを異なる方法で適用するステップをさらに含む、
ことを特徴とする請求項3に記載の方法。 - 前記ツールを異なる方法で適用するステップが、前記第1の要素、前記第2の要素及び前記中間要素のうちの少なくとも2つに対して前記ツールの異なる設定を選択するステップをさらに含み、前記設定が、前記第1、第2及び第3の材料のうちの1つに対応する、ことを特徴とする請求項3に記載の方法。
- 前記第1、第2、及び第3の材料が、金属及びプラスチックのうちの少なくとも2つを含む、
ことを特徴とする請求項1に記載の方法。 - 前記第1の材料と前記第2の材料が同じものである、
ことを特徴とする請求項6に記載の方法。 - 少なくとも2つの要素を接続することによって構築された電子装置部品の表面を仕上げる方法であって、
ツールと位置が合った構成部品の要素を識別するステップを含み、前記構成部品が、少なくとも2つの異なる材料で構築された、接触面において接続された少なくとも2つの要素を含み、
前記識別された要素の材料を検出するステップと、
前記検出された材料に基づいて、前記ツールの動作を制御する設定を調整するステップと、
前記識別された要素上で前記ツールを動作させて、前記少なくとも2つの要素間の前記接触面にわたる連続表面を形成するステップと、
をさらに含むことを特徴とする方法。 - 前記ツールを、前記少なくとも2つの要素のうちの別の要素と位置合わせするステップと、
前記少なくとも2つの要素のうちの前記別の要素の材料が、前記識別された要素の前記材料とは異なることを検出するステップと、
前記少なくとも2つの要素のうちの前記別の要素の前記検出された材料に基づいて前記設定を調整するステップと、
をさらに含むことを特徴とする請求項8に記載の方法。 - 前記少なくとも2つの異なる材料が、異なる製造特性を有する異なる材料を含む、
ことを特徴とする請求項8に記載の方法。 - 前記少なくとも2つの異なる材料が、少なくとも1つの金属及び1つのプラスチックを含む、
ことを特徴とする請求項10に記載の方法。 - 前記少なくとも2つの異なる材料の各々に同じツールが適用される、
ことを特徴とする請求項10に記載の方法。 - 前記ツールが、前記少なくとも2つの要素の前記接触面に隣接する領域において、前記少なくとも2つの要素の各々から材料を除去する、
ことを特徴とする請求項8に記載の方法。 - 前記ツールが研削機を含む、
ことを特徴とする請求項13に記載の方法。 - 前記動作させるステップが、前記接触面にわたる滑らかな平面を形成するステップをさらに含む、
ことを特徴とする請求項8に記載の方法。 - 第1の導電材料で構築された第1の要素と、
第2の導電材料で構築された第2の金属要素と、
絶縁材料で構築された中間要素と、
を備え、
前記中間要素が、第1の接触面において前記第1の要素に接続されて、前記第1の接触面にわたる第1の連続表面を形成し、
前記中間要素が、第2の接触面において前記第2の要素に接続されて、前記第2の接触面にわたる第2の連続表面を形成する、
ことを特徴とする電子装置部品。 - 前記第1及び第2の要素が冷間加工される、
ことを特徴とする請求項16に記載の電子装置部品。 - 前記第1及び第2の連続表面が滑らかである、
ことを特徴とする請求項16に記載の電子装置部品。 - 前記第1及び第2の連続する表面が単一の平面を定める、
ことを特徴とする請求項18に記載の電子装置部品。 - 前記中間要素が、前記第1の要素と前記第2の要素の間に成形される、
ことを特徴とする請求項16に記載の電子装置部品。
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30078010P | 2010-02-02 | 2010-02-02 | |
US61/300,780 | 2010-02-02 | ||
US32578610P | 2010-04-19 | 2010-04-19 | |
US32562510P | 2010-04-19 | 2010-04-19 | |
US61/325,786 | 2010-04-19 | ||
US61/325,625 | 2010-04-19 | ||
US12/794,496 US9363905B2 (en) | 2010-02-02 | 2010-06-04 | Cosmetic co-removal of material for electronic device surfaces |
US12/794,496 | 2010-06-04 |
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JP2014222264A Division JP2015035625A (ja) | 2010-02-02 | 2014-10-31 | 電子装置の表面材料の外観的同時除去 |
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JP2020181162A Division JP7280858B2 (ja) | 2010-02-02 | 2020-10-29 | 電子装置の表面材料の外観的同時除去 |
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JP2017224835A true JP2017224835A (ja) | 2017-12-21 |
JP6873858B2 JP6873858B2 (ja) | 2021-05-19 |
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JP2012551960A Active JP5551276B2 (ja) | 2010-02-02 | 2010-09-24 | ハンドヘルド装置のエンクロージャー |
JP2012551959A Active JP5643845B2 (ja) | 2010-02-02 | 2010-09-24 | 電子装置の表面材料の外観的同時除去 |
JP2014105514A Active JP5875088B2 (ja) | 2010-02-02 | 2014-05-21 | ハンドヘルド装置のエンクロージャー |
JP2014222264A Pending JP2015035625A (ja) | 2010-02-02 | 2014-10-31 | 電子装置の表面材料の外観的同時除去 |
JP2017148056A Active JP6873858B2 (ja) | 2010-02-02 | 2017-07-31 | 電子装置の表面材料の外観的同時除去 |
JP2020181162A Active JP7280858B2 (ja) | 2010-02-02 | 2020-10-29 | 電子装置の表面材料の外観的同時除去 |
JP2022201860A Active JP7460739B2 (ja) | 2010-02-02 | 2022-12-19 | 電子装置の表面材料の外観的同時除去 |
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JP2012551959A Active JP5643845B2 (ja) | 2010-02-02 | 2010-09-24 | 電子装置の表面材料の外観的同時除去 |
JP2014105514A Active JP5875088B2 (ja) | 2010-02-02 | 2014-05-21 | ハンドヘルド装置のエンクロージャー |
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JP2022201860A Active JP7460739B2 (ja) | 2010-02-02 | 2022-12-19 | 電子装置の表面材料の外観的同時除去 |
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