JP5875088B2 - ハンドヘルド装置のエンクロージャー - Google Patents
ハンドヘルド装置のエンクロージャー Download PDFInfo
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- JP5875088B2 JP5875088B2 JP2014105514A JP2014105514A JP5875088B2 JP 5875088 B2 JP5875088 B2 JP 5875088B2 JP 2014105514 A JP2014105514 A JP 2014105514A JP 2014105514 A JP2014105514 A JP 2014105514A JP 5875088 B2 JP5875088 B2 JP 5875088B2
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- H05K5/0208—Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
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- H—ELECTRICITY
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
ある実施形態では、冷間加工を使用して要素を形成することができる。ある実施形態では、それに代わって又はそれに加えて、鍛造プロセス、アニールプロセス、加工プロセス、又は他の適当なプロセス、或いはそれらプロセスの組み合わせを使用して要素を形成することができる。ある実施形態では、ブレイジング(braising)プロセスを使用して、個々の要素を互いに又は他の電子装置コンポーネントに接続する(例えば、アンテナの一部分として働く個々のコンポーネントにセラミック材料を接続する)ことができる。外周部材の個々の要素は、適当な解決策を使用して一緒に接続することができる。ある実施形態では、固定具又は接着剤を使用して個々の要素を接続することができる。ある実施形態では、それに代わって又はそれに加えて、隣接する個々の要素間に中間要素を配置して、個々の要素を一緒にしっかりと接続することができる。例えば、中間要素は、第1状態から第2状態へ変化する材料から形成することができる。第1状態では、中間要素の材料が、隣接する個々の要素間のギャップに流れる。第2状態では、隣接する個々の要素に材料が接着し、そして個々の要素間に構造的接合を与え、個々の要素及び中間要素が一体的コンポーネントを形成することができる。例えば、中間要素は、プラスチック材料から構成することができる。
或いは又、電子装置200は、容積部222内に入れられて外周部材220に結合された個別の構造要素を含むことができる。例えば、電子装置200は、1つ以上の内部部材又はプラットホーム240を備え、これは、1つ以上のコンポーネント層を固定し、保持し又はパックする(例えば、コンポーネント230を内部プラットホーム240の後面に及びコンポーネント232を内部プラットホーム240の前面に取り付ける)上で役立つ装着点又は領域として働くことができる。この内部プラットホーム240は、例えば、スナップ、固定具、撓み部、溶接、接合材、又はそれらの組み合わせを使用することを含む適当な解決策を使用して、外周部材220に結合される。或いは又、内部プラットホーム240は、外周部材の一部分であってもよい(例えば、加工、押し出し又は鋳造されるか、或いは単一ユニットとして一体的に形成される)。又、内部プラットホームは、例えば、外周部材220の内部容積より小さいサイズを含めて、適当なサイズを有する。
内部プラットホーム440は、ベースプレート441、上段442、及び下段444を含めて、多数の個々の導電性プレート(例えば、金属プレート)を含む。これらのプレート及び段は、例えば、外周部材により包囲されたエリアの実質的な部分(例えば、40%、50%、60%、70%、80%又は90%)をカバーする大きなプレートを含めて、適当なサイズのものでよい。或いは又、全内部プラットホーム440が、外周部材によって包囲されたエリアの一部分(例えば、60%、70%、80%、90%、又はそれ以上)しかカバーしなくてもよい。段は、例えば、内部プラットホーム440の部分を接地するためのタブとして働くものを含めて、プレートより実質的に小さい。
ある実施形態では、プレート441及び段442、444の一部分が接続要素450及び452の縁を越えて延びて、プレート及び段を経て外周部材に内部プラットホームを結合できるようにする(例えば、内部プラットホームの金属要素を、接地又はアンテナ性能のために金属の外周部材に結合できるようにする)。例えば、プレート441及び段442、444の露出金属面は、溶接、半田付け、又は導電性を維持する他の接続プロセスを使用して、外周部材に結合することができる。或いは又、熱固定、接着剤、テープ、固定具、又は他の非導電性接続プロセスの1つ以上を使用することができる。溶接部460(例えば、レーザー溶接部)のような導電性プロセスが使用されるときには、電気的に分離されたままにすべき外周部材の要素が分離されたままとなるように溶接部を分散させることができる。特に、プレート441に沿った溶接部460は、小さなL字型要素426が、大きなL字型要素424及びU字型要素428から電気的に分離されるように配置される。或いは又、小さな形状の要素426及び大きな形状の要素424が、それらの要素間の界面付近のみで電気的に絶縁されることが重要である場合には、要素424と426との間にプレート441を通して導電路が存在するが、段444を通して存在しないように、溶接部460を分散させることができる。
例えば、内部プラットホーム440は、外周部材420の高さ以内でアッセンブルすることができる(例えば、接触点の位置又は外周部材の領域に基づいて)。接触点の分布は、例えば、ねじれ、曲げ又は他の機械的な力に対する望ましい耐性を含む構造上の事柄に基づいて選択することができる。特に、電子装置は、(例えば、外周部材の角付近で)外周部材420内に分散された少なくとも4つの接触点又は領域を含む。別の例として、内部プラットホーム440は、外周部材420のまっすぐな部分に沿って(例えば、プレート441の縁に沿って)接触領域を含む。更に別の例として、内部プラットホーム440の段々領域(例えば、段442及び444)は、外周部材420の前面又は後面に又はその付近に結合され(例えば、前面又は後面の互いに逆の部分において)、段442及び444の部分(例えば、接続要素450及び452)が外周部材420の前面を越えて延びるが、プレート441は、そうでないようにする。ある実施形態では、外周部材420は、内部プラットホーム440を支持するための1つ以上のタブ又は延長部を含む(例えば、プラットホームが半田付け又は溶接されるタブ)。例えば、外周部材420は、内部プラットホーム440が外周部材内に挿入されたときに内部プラットホームを支持するためのタブ422を含む。
例えば、プレスフィット、機械的固定具、接着剤、成形プロセス(例えば、中間材料を使用)、半田付け、溶接、又はそれらの組み合わせを含めて、適当な解決策を使用して、内部プラットホームを保持する。ある実施形態では、使用するプロセスをプロセスの導電性プロパティに基づいて選択する。ある実施形態では、内部プラットホームは、外周部材の構造完全性を高める(例えば、特定形式の力に対する耐性を改善する)仕方でバンドに接続される。内部プラットホームは、外周部材により包囲される容積部を2つの領域又はポケットに分割し、各ポケットは、外周部材の反対側又は面から(例えば、外周部材の前部又は後部から)アクセスすることができる。ステップ710において、電子装置コンポーネントを、外周部材によって包囲された容積部へ挿入する。例えば、コンポーネントは、外周部材の片面又は両面から、内部プラットホームにより画成されたポケットの一方又は両方へ挿入される。コンポーネントは、個々に挿入されて、後で外周部材内で互いに接続されるか、又はポケットの外部で少なくとも部分的に接続されて、コンポーネントアッセンブリとして、外周部材へ挿入される。個々のコンポーネント又はコンポーネントアッセンブリは、内部プラットホームに接続されるか、或いは内部プラットホームを通して他のポケットに入れられたコンポーネントに接続される。
例えば、前部カバーアッセンブリを外周部材の前面上に配置し、そして後部カバーアッセンブリを外周部材の後面上に配置する。カバーアッセンブリは、例えば、1つ以上のフック、凹所、突起、インターロック、機械的固定具、スプリング、又は他の保持コンポーネントを使用することを含めて、適当な解決策を使用して外周部材に接続又は結合される。
カバーアッセンブリは、(例えば、ステップ710において)外周部材の容積部内に挿入されたコンポーネントを装置内に保持し拘束するように、装置の外面として働くことができる。ある実施形態では、前部及び後部カバーアッセンブリの一方又は両方を装置の内部コンポーネントに対して整列させて、内部コンポーネントが適切に動作できるように保証することができる。例えば、カバーアッセンブリの窓を、装置のセンサ、光源、又はディスプレイに整列させることができる。プロセス700は、ステップ714で終了となる。
12:記憶及び処理回路
14:入力/出力装置
16:ハウジング
18:光学システム
22:窓又は開口
24:軸
200:電子装置
210:前面
212:後面
214:左面
216:右面
218:上面
219:下面
220:外周部材
222:容積部
230、232:コンポーネント
240:内部プラットホーム
250:前部カバーアッセンブリ
260:後部カバーアッセンブリ
300:電子装置
320:外周部材
322:容積部
325、326、327、328:開口
329:特徴部
340:内部プラットホーム
Claims (18)
- 電子装置であって、
電気回路と、
ハウジングと、を備え、
前記ハウジングは、
前記電子装置の高さ及び外周を実質的に画成する導電性構造部材であって、当該導電性構造部材は電気的に隔離される複数のセグメントを備え、前記複数のセグメントは電気的に絶縁する接続要素にしっかりと接続されるセグメントの少なくとも一つのペアを有する、少なくとも1つのセグメントは前記電気回路のコンポーネントを含む、導電性構造部材と、
前記構造部材から延びる複数のタブであって、少なくとも1つのタブは前記少なくとも1つのセグメントを前記電気回路に接続する、複数のタブと、
各タブを覆うために前記構造部材内に配置された内部プラットホームと、
を備える、電子装置。 - 前記電気回路は無線通信回路を備え、前記少なくとも1つのセグメントはアンテナを備える、請求項1に記載の電子装置。
- 前記電気回路は心拍数センサを備える、請求項1に記載の電子装置。
- 前記内部プラットホームは、
ベースプレートと、
前記ベースプレートに接続された上段と、
前記ベースプレートに接続された下段と、を備える、請求項1に記載の電子装置。 - 前記内部プラットホームは、前記構造部材の高さのほぼ中点に配置される請求項1に記載の電子装置。
- 前記ハウジングはさらに前部カバーアッセンブリと、後部カバーアッセンブリと、を更に備え、
前記前部カバーアッセンブリ及び後部カバーアッセンブリは、前記構造部材の前面及び後面において前記画成された外周にほぼ沿って前記構造部材と接続するように配置される、請求項1に記載の電子装置。 - 前記構造部材は、
コネクタのためのポートと、
取り外し可能なモジュールを含むトレーを受け入れるための開口部と、
ボタンを受け入れるための開口部と、を更に備える、請求項1に記載の電子装置。 - 前記構造部材は、第1及び第2の電気回路のコンポーネントをそれぞれ含む第1及び第2のセグメントを含む、請求項1に記載の電子装置。
- 前記第1及び第2の電気回路の各々は無線通信回路を含み、
前記第1及び第2のセグメントの各々はアンテナを含む請求項8に記載の電子装置。 - 前記第1の電気回路は無線通信回路を含み、前記第2の電気回路は心拍数センサを備え、
前記第1のセグメントはアンテナを備える、請求項8に記載の電子装置。 - 電子装置のためのハウジングであって、
前記電子装置の高さ及び外周を実質的に画成する導電性構造部材であって、当該導電性構造部材は、
電気的に隔離され、複数の電気的に絶縁する接続要素にしっかりと接続された複数のセグメントであって、少なくとも1つのセグメントは電気回路のコンポーネントを含む、複数のセグメントと、
複数の開口部と、を備える、導電性構造部材と、
前記構造部材から延びる複数のタブであって、少なくとも1つのタブは前記少なくとも1つのセグメントを前記電気回路に接続する、複数のタブと、
各タブを覆うために前記構造部材内に配置される内部プラットホームと、
を備える、ハウジング。 - 前記複数の開口部のうちの少なくとも1つは取り外し可能なモジュールを備えるトレーを受け入れるように形成される、請求項11に記載のハウジング。
- 前記複数の開口部のうちの少なくとも1つはコネクタを受け入れるように形成される、請求項11に記載のハウジング。
- 前記電気回路は無線通信回路を備え、前記少なくとも1つのセグメントはアンテナを備える、請求項11に記載のハウジング。
- 前記電気回路は心拍数センサを備える、請求項11に記載のハウジング。
- 前記内部プラットホームは、
ベースプレートと、
前記ベースプレートに接続された上段と、
前記ベースプレートに接続された下段と、を備える、
請求項11に記載のハウジング。 - 前記内部プラットホームは、前記構造部材の高さのほぼ中点に配置される、請求項11に記載のハウジング。
- 前記ハウジングは前部カバーアッセンブリと、後部カバーアッセンブリとを更に備え、 前記前部カバーアッセンブリ及び後部カバーアッセンブリは、前記構造部材の前面及び後面において前記画成された外周にほぼ沿って前記構造部材と接続するように配置される、請求項11に記載のハウジング。
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |